CN103985690B - 树脂密封型半导体装置及其制造方法 - Google Patents
树脂密封型半导体装置及其制造方法 Download PDFInfo
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- CN103985690B CN103985690B CN201410048433.4A CN201410048433A CN103985690B CN 103985690 B CN103985690 B CN 103985690B CN 201410048433 A CN201410048433 A CN 201410048433A CN 103985690 B CN103985690 B CN 103985690B
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Classifications
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Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013024972A JP6030970B2 (ja) | 2013-02-12 | 2013-02-12 | 樹脂封止型半導体装置およびその製造方法 |
JP2013-024972 | 2013-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103985690A CN103985690A (zh) | 2014-08-13 |
CN103985690B true CN103985690B (zh) | 2018-09-25 |
Family
ID=51277603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410048433.4A Expired - Fee Related CN103985690B (zh) | 2013-02-12 | 2014-02-12 | 树脂密封型半导体装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US9275972B2 (zh) |
JP (1) | JP6030970B2 (zh) |
KR (1) | KR102082941B1 (zh) |
CN (1) | CN103985690B (zh) |
TW (1) | TWI591775B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20120854A1 (it) * | 2012-09-28 | 2014-03-29 | Stmicroelectronics Malta Ltd | Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione |
JP2017079215A (ja) * | 2014-02-27 | 2017-04-27 | パナソニックIpマネジメント株式会社 | 樹脂封止型半導体装置、およびその製造方法、ならびにその実装体 |
JP2015176907A (ja) * | 2014-03-13 | 2015-10-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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US20160086826A1 (en) | 2016-03-24 |
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