CN103460817A - 铜配线的形成方法、配线基板的制造方法以及配线基板 - Google Patents

铜配线的形成方法、配线基板的制造方法以及配线基板 Download PDF

Info

Publication number
CN103460817A
CN103460817A CN2012800144030A CN201280014403A CN103460817A CN 103460817 A CN103460817 A CN 103460817A CN 2012800144030 A CN2012800144030 A CN 2012800144030A CN 201280014403 A CN201280014403 A CN 201280014403A CN 103460817 A CN103460817 A CN 103460817A
Authority
CN
China
Prior art keywords
suspension
copper
copper particles
wiring
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012800144030A
Other languages
English (en)
Chinese (zh)
Inventor
又木裕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN103460817A publication Critical patent/CN103460817A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4473—Conductive organic materials, e.g. conductive adhesives or conductive inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Electrodes Of Semiconductors (AREA)
CN2012800144030A 2011-03-24 2012-03-14 铜配线的形成方法、配线基板的制造方法以及配线基板 Pending CN103460817A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011065885A JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法
JP2011-065885 2011-03-24
PCT/JP2012/056525 WO2012128140A1 (ja) 2011-03-24 2012-03-14 銅配線の形成方法、配線基板の製造方法及び配線基板

Publications (1)

Publication Number Publication Date
CN103460817A true CN103460817A (zh) 2013-12-18

Family

ID=46879292

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012800144030A Pending CN103460817A (zh) 2011-03-24 2012-03-14 铜配线的形成方法、配线基板的制造方法以及配线基板

Country Status (6)

Country Link
US (1) US20140020938A1 (https=)
EP (1) EP2690938A4 (https=)
JP (1) JP5544324B2 (https=)
CN (1) CN103460817A (https=)
TW (1) TW201244569A (https=)
WO (1) WO2012128140A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133149B2 (ja) * 2013-06-28 2017-05-24 古河電気工業株式会社 導電性ペースト、及びその製造方法
JP2016009731A (ja) * 2014-06-24 2016-01-18 コニカミノルタ株式会社 導電パターン形成方法および導電パターン形成装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06215617A (ja) * 1993-01-14 1994-08-05 Asahi Chem Ind Co Ltd 焼成用導電性ペースト
JPH10178247A (ja) * 1996-12-18 1998-06-30 Kyocera Corp 配線基板およびその製造方法
JPH11312859A (ja) * 1998-04-28 1999-11-09 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
CN1792127A (zh) * 2003-05-16 2006-06-21 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法,以及应用所述方法形成铜微细布线和薄铜膜的方法
CN101150915A (zh) * 2006-09-19 2008-03-26 三星电机株式会社 合金电路板及其制造方法
JP2008086895A (ja) * 2006-09-29 2008-04-17 Dainippon Printing Co Ltd 導電性基板の製造方法及び導電性基板
WO2009054343A1 (ja) * 2007-10-22 2009-04-30 Hitachi Chemical Company, Ltd. 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513412A (ja) 1991-07-02 1993-01-22 Nippon Steel Corp 半導体集積回路の配線
JP3599950B2 (ja) * 1997-04-16 2004-12-08 株式会社アルバック 金属ペーストの焼成方法
JP3690552B2 (ja) 1997-05-02 2005-08-31 株式会社アルバック 金属ペーストの焼成方法
JP2003311196A (ja) 2002-04-19 2003-11-05 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体、圧電体素子、並びにインクジェット式記録ヘッド
EP1626614B1 (en) * 2003-05-16 2013-08-28 Harima Chemicals, Inc. Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film
JP5467855B2 (ja) * 2009-03-09 2014-04-09 富士フイルム株式会社 ラインパターン形成方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06215617A (ja) * 1993-01-14 1994-08-05 Asahi Chem Ind Co Ltd 焼成用導電性ペースト
JPH10178247A (ja) * 1996-12-18 1998-06-30 Kyocera Corp 配線基板およびその製造方法
JPH11312859A (ja) * 1998-04-28 1999-11-09 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
CN1792127A (zh) * 2003-05-16 2006-06-21 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法,以及应用所述方法形成铜微细布线和薄铜膜的方法
CN101150915A (zh) * 2006-09-19 2008-03-26 三星电机株式会社 合金电路板及其制造方法
JP2008086895A (ja) * 2006-09-29 2008-04-17 Dainippon Printing Co Ltd 導電性基板の製造方法及び導電性基板
WO2009054343A1 (ja) * 2007-10-22 2009-04-30 Hitachi Chemical Company, Ltd. 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液
US20100233011A1 (en) * 2007-10-22 2010-09-16 Hideo Nakako Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used therein

Also Published As

Publication number Publication date
JP2012204467A (ja) 2012-10-22
WO2012128140A1 (ja) 2012-09-27
US20140020938A1 (en) 2014-01-23
TW201244569A (en) 2012-11-01
EP2690938A4 (en) 2014-08-13
JP5544324B2 (ja) 2014-07-09
EP2690938A1 (en) 2014-01-29

Similar Documents

Publication Publication Date Title
JP3774638B2 (ja) インクジェット印刷法を利用する回路パターンの形成方法
JP5971250B2 (ja) 組成物セット、導電性基板及びその製造方法並びに導電性接着材組成物
US10400119B2 (en) Method and apparatus for aerosol-based three-dimensional (3D) printing of flexible graphene electronic devices
JP6211245B2 (ja) 導電性材料およびその製造方法
JP2009074054A (ja) 非水系導電性ナノインク組成物
US20110300305A1 (en) Mechanical sintering of nanoparticle inks and powders
JP6659026B2 (ja) 銅粒子を用いた低温接合方法
JP2008243946A (ja) 導電性基板及びその製造方法
CN101836268A (zh) 铜配线图案形成方法以及用于其中的氧化铜粒子分散液
JP5092630B2 (ja) 微粒銀粉およびその製造方法並びにその微粒銀粉を用いた導電性ペースト用分散液
JP6531547B2 (ja) 接合材及び接合体の製造方法
CN103460817A (zh) 铜配线的形成方法、配线基板的制造方法以及配线基板
JP7091611B2 (ja) ニッケルペースト及びその製造方法、並びにニッケル有機スラリーの製造方法
JP5772462B2 (ja) パターン形成方法及び銅パターン膜の製造方法
US20140083753A1 (en) Method of forming copper wiring, method of manufacturing wiring board, and wiring board
JP2010095789A (ja) 金属粒子分散液、塗膜、金属膜および導電ペースト並びに金属膜の製造方法
JP4223848B2 (ja) 導電性組成物の製造方法、および導電ペーストの製造方法
JP2014122368A (ja) ニッケル超微粉、導電ペーストおよびニッケル超微粉の製造方法
JP5617291B2 (ja) エアロゾルデポジション装置及びエアロゾルデポジション方法
JP5713181B2 (ja) 印刷用液状組成物及びそれを用いて得られる導体配線及びその形成方法、熱伝導路、接合材
JP2010049849A (ja) 無機粉末ペーストの製造方法
JP5489358B2 (ja) 銅配線の形成方法、配線基板の製造方法および配線基板
JP5018542B2 (ja) 板状ニッケル粉及び板状ニッケル粉有機スラリーとそれらの製造方法、並びにそれらを用いた導電性ペースト
JP2012104857A (ja) 導電性基板
JP2020113654A (ja) 金属層形成基板の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131218