WO2009054343A1 - 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 - Google Patents

銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 Download PDF

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Publication number
WO2009054343A1
WO2009054343A1 PCT/JP2008/068960 JP2008068960W WO2009054343A1 WO 2009054343 A1 WO2009054343 A1 WO 2009054343A1 JP 2008068960 W JP2008068960 W JP 2008068960W WO 2009054343 A1 WO2009054343 A1 WO 2009054343A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
wiring pattern
particles
forming
copper oxide
Prior art date
Application number
PCT/JP2008/068960
Other languages
English (en)
French (fr)
Inventor
Hideo Nakako
Kazunori Yamamoto
Youichi Machii
Yasushi Kumashiro
Shunya Yokozawa
Yoshinori Ejiri
Katsuyuki Masuda
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to US12/739,228 priority Critical patent/US20100233011A1/en
Priority to CN200880112547.3A priority patent/CN101836268B/zh
Priority to KR1020107008688A priority patent/KR101120743B1/ko
Priority to JP2009538191A priority patent/JP5067426B2/ja
Priority to EP08842232A priority patent/EP2204824A4/en
Publication of WO2009054343A1 publication Critical patent/WO2009054343A1/ja
Priority to US13/935,302 priority patent/US20130295276A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12181—Composite powder [e.g., coated, etc.]

Abstract

　銅粒子の耐酸化、分散に必須であった表面処理剤をほとんど用いずに、エレクトロマイグレーションが少なく、材料自体の単価が安価な銅粒子を用いて、クラックの発生を抑え、低抵抗の銅配線パターン形成方法と、それに用いる酸化銅粒子分散液を提供する。 　基板上に、酸化銅表面を有する銅系粒子を分散した分散液を用いて任意のパターンを形成する工程と、前記パターン中の銅系粒子表面の酸化銅を原子状水素により還元して銅に戻し、還元されて生成した銅金属粒子同士を焼結する工程と、を含むことを特徴とする銅配線パターン形成方法である。
PCT/JP2008/068960 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 WO2009054343A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/739,228 US20100233011A1 (en) 2007-10-22 2008-10-20 Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used therein
CN200880112547.3A CN101836268B (zh) 2007-10-22 2008-10-20 铜配线图案形成方法以及用于其中的氧化铜粒子分散液
KR1020107008688A KR101120743B1 (ko) 2007-10-22 2008-10-20 구리배선 패턴 형성방법 및 거기에 이용하는 산화구리 입자 분산액
JP2009538191A JP5067426B2 (ja) 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液
EP08842232A EP2204824A4 (en) 2007-10-22 2008-10-20 METHOD FOR FORMING A COPPER WIRING STRUCTURE AND COPPER OXIDE PARTICLE DISPERSION FOR USE THEREOF
US13/935,302 US20130295276A1 (en) 2007-10-22 2013-07-03 Method for forming a copper wiring pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-273779 2007-10-22
JP2007273779 2007-10-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/935,302 Division US20130295276A1 (en) 2007-10-22 2013-07-03 Method for forming a copper wiring pattern

Publications (1)

Publication Number Publication Date
WO2009054343A1 true WO2009054343A1 (ja) 2009-04-30

Family

ID=40579448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068960 WO2009054343A1 (ja) 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液

Country Status (8)

Country Link
US (2) US20100233011A1 (ja)
EP (1) EP2204824A4 (ja)
JP (1) JP5067426B2 (ja)
KR (1) KR101120743B1 (ja)
CN (1) CN101836268B (ja)
MY (1) MY154259A (ja)
TW (1) TWI425893B (ja)
WO (1) WO2009054343A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
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WO2011034016A1 (ja) 2009-09-16 2011-03-24 日立化成工業株式会社 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
WO2011034019A1 (ja) * 2009-09-16 2011-03-24 日立化成工業株式会社 印刷法用インク及びそれに用いられる金属ナノ粒子、並びに配線、回路基板、半導体パッケージ
JP2012018946A (ja) * 2010-07-06 2012-01-26 Hitachi Chem Co Ltd Ｃｕパターン付基板の製造方法及びそれにより得られるＣｕパターン付基板
WO2012128139A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
WO2012128140A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
JPWO2013077448A1 (ja) * 2011-11-24 2015-04-27 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物
TWI660789B (zh) * 2016-10-25 2019-06-01 財團法人金屬工業研究發展中心 微粒成形裝置及其微粒成形方法

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EP2741300B1 (en) * 2011-08-03 2019-04-17 Hitachi Chemical Company, Ltd. Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
KR101633013B1 (ko) * 2012-12-31 2016-06-24 주식회사 아모그린텍 연성인쇄회로기판
KR101846141B1 (ko) * 2016-03-03 2018-04-05 미쓰이금속광업주식회사 동장 적층판의 제조 방법
WO2017154937A1 (ja) * 2016-03-11 2017-09-14 株式会社ニコン ミスト発生装置、成膜装置、ミスト発生方法、成膜方法、および、デバイス製造方法

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5903887B2 (ja) * 2009-09-16 2016-04-13 日立化成株式会社 印刷法用インクの製造方法
KR20160044062A (ko) 2009-09-16 2016-04-22 히타치가세이가부시끼가이샤 금속 구리막 및 그 제조 방법, 금속 구리 패턴 및 그것을 이용한 도체 배선, 금속 구리 범프, 열전도로, 접합재, 및 액상(液狀) 조성물
US9457406B2 (en) 2009-09-16 2016-10-04 Hitachi Chemical Company, Ltd. Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
CN102549086A (zh) * 2009-09-16 2012-07-04 日立化成工业株式会社 印刷法用油墨以及用于该油墨的金属纳米粒子、以及布线、电路基板、半导体封装
KR101633152B1 (ko) * 2009-09-16 2016-06-23 히타치가세이가부시끼가이샤 인쇄법용 잉크 및 그에 이용되는 금속 나노 입자, 및 배선, 회로 기판, 반도체 패키지
WO2011034019A1 (ja) * 2009-09-16 2011-03-24 日立化成工業株式会社 印刷法用インク及びそれに用いられる金属ナノ粒子、並びに配線、回路基板、半導体パッケージ
WO2011034016A1 (ja) 2009-09-16 2011-03-24 日立化成工業株式会社 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
KR20120094157A (ko) * 2009-09-16 2012-08-23 히다치 가세고교 가부시끼가이샤 인쇄법용 잉크 및 그에 이용되는 금속 나노 입자, 및 배선, 회로 기판, 반도체 패키지
JP2012018946A (ja) * 2010-07-06 2012-01-26 Hitachi Chem Co Ltd Ｃｕパターン付基板の製造方法及びそれにより得られるＣｕパターン付基板
CN103460817A (zh) * 2011-03-24 2013-12-18 富士胶片株式会社 铜配线的形成方法、配线基板的制造方法以及配线基板
JP2012204466A (ja) * 2011-03-24 2012-10-22 Fujifilm Corp 銅配線の形成方法、配線基板の製造方法および配線基板
WO2012128140A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
WO2012128139A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
JP2012204467A (ja) * 2011-03-24 2012-10-22 Fujifilm Corp 銅配線の形成方法、配線基板の製造方法および配線基板
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
JPWO2013077448A1 (ja) * 2011-11-24 2015-04-27 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物
TWI660789B (zh) * 2016-10-25 2019-06-01 財團法人金屬工業研究發展中心 微粒成形裝置及其微粒成形方法

Also Published As

Publication number Publication date
US20100233011A1 (en) 2010-09-16
EP2204824A1 (en) 2010-07-07
JPWO2009054343A1 (ja) 2011-03-03
KR101120743B1 (ko) 2012-03-22
US20130295276A1 (en) 2013-11-07
JP5067426B2 (ja) 2012-11-07
CN101836268A (zh) 2010-09-15
TW200930186A (en) 2009-07-01
TWI425893B (zh) 2014-02-01
MY154259A (en) 2015-05-29
KR20100057091A (ko) 2010-05-28
CN101836268B (zh) 2013-09-18
EP2204824A4 (en) 2011-03-30

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