JP5544324B2 - 銅配線の形成方法および配線基板の製造方法 - Google Patents

銅配線の形成方法および配線基板の製造方法 Download PDF

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Publication number
JP5544324B2
JP5544324B2 JP2011065885A JP2011065885A JP5544324B2 JP 5544324 B2 JP5544324 B2 JP 5544324B2 JP 2011065885 A JP2011065885 A JP 2011065885A JP 2011065885 A JP2011065885 A JP 2011065885A JP 5544324 B2 JP5544324 B2 JP 5544324B2
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JP
Japan
Prior art keywords
copper particles
copper
wiring
dispersion
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011065885A
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English (en)
Japanese (ja)
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JP2012204467A (ja
JP2012204467A5 (https=
Inventor
裕司 又木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2011065885A priority Critical patent/JP5544324B2/ja
Priority to PCT/JP2012/056525 priority patent/WO2012128140A1/ja
Priority to EP12761154.9A priority patent/EP2690938A4/en
Priority to CN2012800144030A priority patent/CN103460817A/zh
Priority to TW101109784A priority patent/TW201244569A/zh
Publication of JP2012204467A publication Critical patent/JP2012204467A/ja
Priority to US14/033,412 priority patent/US20140020938A1/en
Publication of JP2012204467A5 publication Critical patent/JP2012204467A5/ja
Application granted granted Critical
Publication of JP5544324B2 publication Critical patent/JP5544324B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4473—Conductive organic materials, e.g. conductive adhesives or conductive inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2011065885A 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法 Expired - Fee Related JP5544324B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011065885A JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法
EP12761154.9A EP2690938A4 (en) 2011-03-24 2012-03-14 PROCESS FOR FORMING COPPER CABLING, METHOD FOR PRODUCING A CABINING SUBSTRATE AND CABINING SUBSTRATE
CN2012800144030A CN103460817A (zh) 2011-03-24 2012-03-14 铜配线的形成方法、配线基板的制造方法以及配线基板
PCT/JP2012/056525 WO2012128140A1 (ja) 2011-03-24 2012-03-14 銅配線の形成方法、配線基板の製造方法及び配線基板
TW101109784A TW201244569A (en) 2011-03-24 2012-03-22 Method of forming copper wiring, method of manufacturing wiring board, and wiring board
US14/033,412 US20140020938A1 (en) 2011-03-24 2013-09-20 Method of forming copper wiring, method of manufacturing wiring board, and wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011065885A JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2012204467A JP2012204467A (ja) 2012-10-22
JP2012204467A5 JP2012204467A5 (https=) 2013-10-24
JP5544324B2 true JP5544324B2 (ja) 2014-07-09

Family

ID=46879292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011065885A Expired - Fee Related JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法

Country Status (6)

Country Link
US (1) US20140020938A1 (https=)
EP (1) EP2690938A4 (https=)
JP (1) JP5544324B2 (https=)
CN (1) CN103460817A (https=)
TW (1) TW201244569A (https=)
WO (1) WO2012128140A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133149B2 (ja) * 2013-06-28 2017-05-24 古河電気工業株式会社 導電性ペースト、及びその製造方法
JP2016009731A (ja) * 2014-06-24 2016-01-18 コニカミノルタ株式会社 導電パターン形成方法および導電パターン形成装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513412A (ja) 1991-07-02 1993-01-22 Nippon Steel Corp 半導体集積回路の配線
JPH06215617A (ja) * 1993-01-14 1994-08-05 Asahi Chem Ind Co Ltd 焼成用導電性ペースト
JPH10178247A (ja) * 1996-12-18 1998-06-30 Kyocera Corp 配線基板およびその製造方法
JP3599950B2 (ja) * 1997-04-16 2004-12-08 株式会社アルバック 金属ペーストの焼成方法
JP3690552B2 (ja) 1997-05-02 2005-08-31 株式会社アルバック 金属ペーストの焼成方法
JPH11312859A (ja) * 1998-04-28 1999-11-09 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JP2003311196A (ja) 2002-04-19 2003-11-05 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体、圧電体素子、並びにインクジェット式記録ヘッド
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
EP1626614B1 (en) * 2003-05-16 2013-08-28 Harima Chemicals, Inc. Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film
KR100819876B1 (ko) * 2006-09-19 2008-04-07 삼성전기주식회사 합금배선기판 및 그 제조방법
JP4858057B2 (ja) * 2006-09-29 2012-01-18 大日本印刷株式会社 導電性基板の製造方法
EP2204824A4 (en) * 2007-10-22 2011-03-30 Hitachi Chemical Co Ltd Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
JP5467855B2 (ja) * 2009-03-09 2014-04-09 富士フイルム株式会社 ラインパターン形成方法

Also Published As

Publication number Publication date
CN103460817A (zh) 2013-12-18
JP2012204467A (ja) 2012-10-22
WO2012128140A1 (ja) 2012-09-27
US20140020938A1 (en) 2014-01-23
TW201244569A (en) 2012-11-01
EP2690938A4 (en) 2014-08-13
EP2690938A1 (en) 2014-01-29

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