CN103453357A - 发光组件 - Google Patents

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Publication number
CN103453357A
CN103453357A CN2013101919555A CN201310191955A CN103453357A CN 103453357 A CN103453357 A CN 103453357A CN 2013101919555 A CN2013101919555 A CN 2013101919555A CN 201310191955 A CN201310191955 A CN 201310191955A CN 103453357 A CN103453357 A CN 103453357A
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China
Prior art keywords
light
type surface
emitting diode
diode chip
backlight unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2013101919555A
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English (en)
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CN103453357B (zh
Inventor
潘锡明
郑惟纲
黄知澍
李承鸿
叶时有
蒲计志
杨程光
汤士杰
洪祥富
王子翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Formosa Epitaxy Inc
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49662121&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN103453357(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from TW101125599A external-priority patent/TWI479695B/zh
Priority claimed from TW101131198A external-priority patent/TW201409775A/zh
Priority claimed from TW101131643A external-priority patent/TWI464908B/zh
Priority claimed from TW101132185A external-priority patent/TWI577919B/zh
Priority claimed from TW101132187A external-priority patent/TWI490432B/zh
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Publication of CN103453357A publication Critical patent/CN103453357A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
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Abstract

本发明公开了一种发光组件，其在透明基板上设置至少一个多方向出光的发光二极管芯片，使所述透明基板本身形成一个可自由运用的发光板/发光片，所述发光组件除设有所述发光二极管芯片的所述透明基板所形成的一第一主表面可发光，并因所述透明基板的透光能力使所述透明基板一第二主表面也能出光；本发明的发光组件为可灵活且广泛地加以应用为各式灯具的发光组件。

Description

发光组件
技术领域
本发明揭示了一种发光组件，尤其是指一种运用具多方向出光发光二极管芯片的透明基板而形成的发光板/发光片，并通过立设的方式，以黏接或插接而耦接于承载机构，将本发明的发光组件应用于各种发光装置。
背景技术
在照明技术的领域中，近代对于光源多以兼顾成本、环保以及节电等方向进行发展，以诉求在耗费较少能源的条件下获得较佳的照明效益，这使得发光二极管在此发展历程中扮演着重要的角色。
发光二极管除了耗电低、不含汞、寿命长以及二氧化碳排放量低等优势外，其已普遍应用于3C产品指示器与显示设备上；而再随着发光二极管生产良率的提高，单位制造成本也已大幅降低，因此发光二极管的需求持续增加。
而若要将发光二极管或类似的发光单元实际应用于照明灯具，则仍有许多发展的空间。过去在利用发光二极管做为光源时，大多为将数个发光二极管芯片或是发光二极管排列布置于一平面且为单方向出光，或是更进一步在芯片底部设置光学反射层，以提高单个发光二极管本身的出光效率。
然而，这种布置方式对于制作大照明角度的灯具并不是很有利，因为发光二极管本身所产生的光当中，仅有部分得以往照明的方向行进，另一部分的光能则被吸收于灯具底座或是在反射的过程中损失，因此需要设置更多的发光二极管来做弥补。
另外，现有技术中发光二极管灯具多是以平面的基板作为承载发光二极管的底座，因此局限了在布置发光二极管于其上的灵活性。若其将基板制作非为平面时，平躺于基板表面的发光二极管所产生的光将会因基板不平整的结构而受到些许遮蔽或是阻碍，这对于减少耗能和降低成本都有不利的影响。因此，发光二极管在做为照明灯具的应用上，仍然有改进的空间存在。
发明内容
本发明的主要目的，提供一种高可靠度的发光组件，其将承载有多方向出光的发光二极管芯片的透明基板做为发光板，并将其立设于底座上，以作为一种具照明功能的装置。
本发明的次要目的，提供一种发光装置，其可将多个发光板做对称性或非对称性的排列，可增加发光装置的发光强度，同时也兼顾到各个方向的出光均匀性与应用时所需光形。
本发明的另一目的，提供一种发光装置，以灯壳做包覆，应用为灯具或广告牌，不但发光效果佳，低耗电量、不需变压器等优点也可取代传统的日光灯管。
因此，为了达到上述的目的，本发明揭示了一种发光组件，其包含：一透明基板，具有一承载面；以及至少一发光二极管芯片，设置于所述透明基板的所述承载面上，而形成可发光的一第一主表面；其中，所述发光二极管芯片的一出光角度大于180°，且所述透明基板容许所述发光二极管芯片所发出的一光线穿透至所述透明基板上相对应所述第一主表面的一第二主表面。采用上述技术方案，本发明揭示的发光组件即可提供充足的照明强度、均匀的出光效果，以及在针对不同场合时，可通过改变透明基板的数量和排列方式而调整亮度的运用灵活性。
附图说明
图1A~B：为本发明的结构示意图；
图2A~C：为本发明的不同形式的发光二极管芯片耦接于导线的示意图；
图3A~B：为本发明的波长转换层的示意图；
图4：为本发明的承载座的示意图；
图5A~D：为本发明的以点对称或线对称排列透明基板于承载机构上的俯视示意图；
图6：为本发明的发光面的示意图；
图7：为本发明的电路基板的示意图；
图8A~B：为本发明的灯壳的示意图；
图9：为本发明的广告牌式灯壳的俯视剖面示意图；
图10：为本发明的反射镜的示意图；
图11：为本发明的类金刚石碳膜的示意图； 
图12A~C：为本发明的透明基板插接或黏接于承载座的示意图；
图13A~B：为本发明的透明基板黏接于具翘曲体的承载座的示意图；以及
图14A~D：为本发明的球泡灯式的实施示意图。
具体实施方式
以下将结合附图所示的具体实施方式对本发明进行详细描述。但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构上的变换均包含在本发明的保护范围内。
首先，请参考图A~B，为本发明的发光组件或发光板的结构示意；如图所示，发光组件1包含：透明基板2；承载面210；第一主表面21；第二主表面22以及至少多方向出光发光二极管芯片3。
其中，为平板薄片状的透明基板2本身具有两个主要面体，其中的任一主要面体为承载面210，具有发光功能的发光二极管芯片3即是设置于所述承载面210上，而形成可发光的第一主表面21。透明基板2未设有发光二极管芯片3的另一主要面体则为第二主表面22。上述布置方式也可相反，且也可在基板两个面均布置发光二极管芯片。
透明基板2的材质可为氧化铝、含有氧化铝的蓝宝石、玻璃、塑料或是橡胶，其中，本发明较佳实施例采用蓝宝石基板，因为这种材料大体上为单晶结构，不但具有较好的透光率，且散热能力佳，可延长发光组件1的寿命，但使用传统蓝宝石基板在本发明中会有易碎裂的问题，因此为克服可靠度问题，所述透明基板2的厚度经实验验证要大于或等于200微米，这样才能实际应用作为承载以及透光的基板。然而由于发光二极管芯片3本身的出光角度大于180°，并非仅能单向出光，因此当所述发光二极管芯片3设置于透明基板2的承载面210上，形成第一主表面21时，发光二极管芯片3所发出的光线至少部分会穿透透明基板2而透明基板2上相对应第一主表面21的第二主表面22出光。
另外，本发明进一步设计是使发光组件1的第一主表面21与第二主表面22发出的色温差异等于或小于1500K，使发光组件1有更全面一致的发光效果。而在透明基板2的透光特性上，当光线的波长范围大于或等于420纳米，或是当所述光线的波长范围小于或等于470纳米时，在前述透明基板2厚度设计条件下，透明基板2的光穿透率大于或等于70%。
 请参考图A~C，本发明为了获得供电以进行发光，发光二极管芯片3本身包含第一电极31与第二电极32，所述第一电极31与第二电极32则分别与位于透明基板2上的第一连接导线23以及第二连接导线24电性连接。其中，图A~C分别揭示了不同形式的发光二极管芯片3是通过何种方式与耦接于导线。图2A为横式发光二极管；图2B为覆晶式发光二极管；图2C则是在发光二极管芯片3的磊晶层33的两端设置第一电极31与第二电极32，以直立设置的方式而与第一连接导线23以及第二连接导线24相连接。
由于发光二极管芯片3是设置于承载面210，因此与第一电极31与第二电极32相连接的第一连接导线23以及第二连接导线24也是同时位于承载面210。
请参考图3A~B，本发明的发光组件还包含一波长转换层4，其设置于第一主表面21和/或第二主表面22上，或是直接设置于发光二极管芯片上（图未示），所述波长转换层4接收并转换至少部分发光二极管芯片3所发出色光的波长。波长转换层4含有至少一种荧光粉，其可直接接触于发光二极管芯片3或是与发光二极管芯片3相邻一段距离而不直接接触，以接收并至少部分转换发光二极管芯片3所发出光线为另一种波长范围的光线。例如，当发光二极管芯片3发出蓝光，波长转换层4就会转换部分蓝光为黄光，而使发光组件1在蓝光与黄光混合下最后发出白光。
由于第一主表面21与第二主表面22发出的光线强度略有不同，前者主要通过发光二极管芯片3直接发光，后者则通过发光二极管芯片3的光线穿透透明基板2而出光，且如上述本发明进一步设计是使发光组件1的第一主表面21与第二主表面22发出的色温差异等于或小于1500K，因此本发明的发光组件1较佳设计可相应调整位于第一主表面21与第二主表面22的波长转换层4为具不同的荧光粉含量，较佳的实施例可从1比0.5至1比3或其他比例，以提升发光组件1的波长转换效率与发光效果。
为了在应用上的便利，请参考图4，本发明还包含一承载座5，使透明基板2可以立设于其上并耦接于所述承载座5，形成发光装置11；另外，透明基板2与承载座5之间具有一第一夹角θ1，且所述第一夹角θ1角度可为固定或根据发光装置光形需要调动，其中较佳实施例的第一夹角θ1角度范围介于30°-150°。
为了提高发光装置的亮度，用户也可将若干个透明基板2所形成的发光组件同时布置于例如承载座等的承载机构50上，此时可采对称或非对称排列的形式做布置，较佳的对称布置方式也就是将多个透明基板2所形成的发光组件以点对称或线对称的形式设置于承载机构50上。请参考图5A~D，其在各种不同形状的承载机构50上设置透明基板2，并且以点对称或线对称的形式让整体发光装置11的出光能够均匀(发光二极管芯片3省略示意)，所述发光装置11的出光效果还可通过改变第一夹角θ1的大小而再做进一步的调整与改善。另一实施例则以非对称布置方式将多个发光组件至少部分集中或分散设置，以达成发光装置于不同应用时的光形需要（图未示）。
在本发明中，承载座5是用以兼具承载、供电、链接以及散热等功能的基座，其材质可如一般市售的球泡灯的底座以金属打造，其中，较佳实施例之一采用一复合式可弯折金属基板作为承载基座，而外形也不限定为矩形，其也可为圆形、多边形，甚至为具有中空的圆形、多边形等，只要能让透明基板2立于其上即可。
另外，请参考图6，位于透明基板2上的多个发光二极管芯片3分别具有一发光面34，所述发光面34指在发光二极管芯片3的结构中，与透明基板2的承载面210大体上呈平行且暴露出的一面。在本发明中，第一主表面21或第二主表面22的面积为所述发光面34总和面积的五倍以上，这是兼顾到发光效率以及散热等条件而为较佳的配置比例。
请参考图7，本发明还包含一电路基板6与外部电源耦接，其设置于透明基板2与承载座5之间，并电性耦接于透明基板2上的第一连接导线23以及第二连接导线24（图未示），而与发光二极管芯片3电性连接，并供应发光所需电源；若没有设置所述电路基板6，发光二极管芯片3也可直接通过第一连接导线23以及第二连接导线24（图未示）而电性连接于承载座5，使外部电源可经由承载座5对所述发光二极管芯片3供电。
本发明在进一步的实际应用上，为了防止灰尘、水气等外界环境粒子污染、腐蚀或磨损透明基板2以及发光二极管芯片3等组件，因此可设置灯壳以保护及隔绝外部的环境污染物，所述灯壳与承载座5耦接，且透明基板2至少部分置于所述灯壳所形成的空间内。灯壳材质则无特殊的限制，只要能够透光即可，外观则可为灯管或是灯箱的形式。上述的波长转换层4也可选择涂布于所述灯壳上，也能发挥波长转换的效果。
请参考图8A，为本发明具体实施例的一的发光装置，所述发光装置为长形灯管，也就是将灯壳7设计为透光的管状结构，然后将发光组件1以及其承载机构50设置于其中，此图为放置单一个发光组件1的状态；再请参考图8B，当两个以上发光组件1设置于灯壳7内时，所述发光组件1的第一主表面21之间是以不互相平行的方式做排列。另外，发光组件1至少部分置于灯壳7所形成的空间内，且不紧贴灯壳7的内壁，较佳的实施例为发光组件1与灯壳7之间有一大于500微米(μm)的距离D；但也可设计以灌胶方式形成灯壳7，并使所述灯壳7至少部分包覆并直接接触于所述发光组件1。
本发明的另一具体实施例的发光装置为一双面需要光线的广告牌，请参考图9，用以当作广告牌的灯壳7具有至少一个罩面71，为主要印刷有广告的版面，再借助本发明的发光组件1的第一主表面21和第二主表面22所提供的光照形成罩面71的背光，其中，发光组件1与罩面71之间形成的第二夹角θ2的角度范围介于0°-45°(θ2于图中为0°，故未示)；也就是在设置上，发光组件1的第一主表面21和第二主表面22基本上是面向罩面71。而为了确保透明基板2以及多方向出光的发光二极管芯片3所组合成的发光组件1或发光板/发光片所产生的光能够较均匀的穿透灯壳7，发光组件1至少部分置于灯壳7所形成的空间内，且基本上不紧贴灯壳7的内壁，较佳的实施例为发光组件1与灯壳7之间有一大于500微米的距离D；但也可设计以灌胶方式形成灯壳7，并使灯壳7至少部分包覆并直接接触于透明基板2。
本发明的另一实施例如图10所示，设置一反射镜8于第二主表面22上，所述反射镜8可反射所述发光二极管芯片3所发出至少部分穿透所述透明基板2的所述光线，而使所述光线至少部分改由所述第一主表面21射出。所述反射镜8可包括至少一金属层或一布拉格反射镜(Bragg reflector)，但不以此为限。举例而言，布拉格反射镜可由多层具有不同折射率的介电薄膜所堆栈而构成，或是由多层具有不同折射率的介电薄膜与多层金属氧化物所堆栈而构成。所述反射镜8可提高发光效率并可改善发光二极管的光型不佳的问题。
请参考图11，承载面210以及第二主表面22上可选择性地设置有一类金刚石碳膜(diamond-like carbon, DLC) 9，用以增加导热及散热效果。
请参考图12A~C，当本发明中的透明基板2设置于承载座5上时，较佳实施例为可通过插接或是黏接的方式来达成两者的接合。
如第图12A所示，当透明基板2布置于承载座5上时，其单孔式插接于承载座5的插槽51，而所述插槽51具有与发光二极管芯片3通过第一连接导线以及第二连接导线电性连接而对其供电的功能。此时透明基板2上的发光二极管芯片3为了要与承载座5的电源供应相耦接，因此将第一连接导线以及第二连接导线沿着透明基板2的表面而集中至其边缘并整合为具有若干个导电触片的金手指结构，也就是电性端口。而插槽51则可让透明基板2插入，使得发光二极管芯片3在获得承载座5供电的同时，透明基板2也被固定于承载座5的插槽51。
接着，请参考图12B，其为通过多孔式插接透明基板2于承载座5上的结构示意图。此时透明基板2汇集有连接发光二极管芯片3的线路的一端具有至少一双插脚结构，其中一个插脚为正极，另一个则为负极，两处皆为具有导电触片作为端口。而相对应地，在承载座5则具有至少两个与插脚大小相等的插槽51，使得透明基板2可以顺利接合于承载座5上，并让发光二极管芯片3获得供电。
请参考图12C，其改以黏接的方式将透明基板2接合于承载座5。在黏接的过程中，可以通过金、锡、铟、铋、银等金属做焊接辅助而接合，或是使用具导电性的硅胶或是环氧树脂辅助固定透明基板2。这种以黏接的方式接合透明基板2接合于承载座5可获致较佳的散热效果，优于其他各种插接的形式。
请参考图13A~B，本发明中的承载座5为一复合式可弯折金属基板所构成的非平面结构，其可具有至少一翘曲体52，位于承载座5的表面或是侧边，可为与承载座分离或一体化的机构件。所述翘曲体52为一可弯折的铝质基板。由于承载座5具有翘曲体52，因此增加了在应用时的灵活性，有利于针对不同场合的需求而推出具有变化性的发光装置11。当承载座5具有翘曲体52时，透明基板2可通过黏接的方式与翘曲体52相耦接，也就是通过黏接物53的辅助而将透明基板2固定于承载座5，并与承载座5非翘曲的部分的表面维持具有第一夹角θ1；另外，透明基板2也可通过插接（图未示）的方式与翘曲体52相连接，也就是通过连接器的辅助而将透明基板2固定于承载座5，而与承载座5非翘曲的部分的表面维持具有第一夹角θ1。
最后，请参考图14A~D，其为将图13B所示的发光装置11进一步设置灯壳7以及底座54，而形成球泡灯的实施例。在图14A中，发光组件1具有灯壳7，且所述灯壳7与承载座5相连接，但也可将承载座5进一步设置于一般球泡灯的底座54上，再使灯壳7与灯泡球的底座54连接。底座54的形式不拘，可为平台或是另有承载突部。在图14C中，灯壳7的内侧涂布有波长转换层4，可让发光二极管芯片3所产生的光线至少有部分在离开灯壳7之前会被转换波长。而在图14D中，则揭示了使用双层灯壳7的设计，可在花纹和色彩上做进一步变化。
本发明所揭示的发光组件的结构，将发光二极管芯片设置于透明基板上而形成的发光组件或发光板/发光片可获致有效且充分的灵活运用；并且发光组件的两个主要面方向皆可出光，因此能在最少的供电下获得最大的出光效率，并有均匀的出光效果，而无论是在应用于灯泡、灯管、广告牌等领域，皆可展现其发光效果佳、低耗电量以及出光均匀等优点，确实为一具经济和实用价值的发光组件。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (26)

1.一种发光组件，其特征在于，包括：
一蓝宝石基板，具有一承载面；以及
至少一发光二极管芯片，设置于所述蓝宝石基板的所述承载面上，而形成发光的一第一主表面；
其中，所述发光二极管芯片的一出光角度大于180°，且所述蓝宝石基板容许所述发光二极管芯片所发出的光线穿透所述蓝宝石基板相对应所述第一主表面的一第二主表面。
2.根据权利要求1所述的发光组件，其特征在于，所述蓝宝石基板的厚度大于或等于200微米。
3.根据权利要求1所述的发光组件，其特征在于，所述发光二极管芯片包括一第一电极与一第二电极。
4.根据权利要求3所述的发光组件，其特征在于，所述第一电极与所述第二电极分别与所述蓝宝石基板上的一第一连接导线以及一第二连接导线电性连接。
5.根据权利要求4所述的发光组件，其特征在于，所述第一连接导线以及所述第二连接导线位于所述承载面上。
6.根据权利要求1所述的发光组件，其特征在于，所述第一主表面与所述第二主表面的光线色温差异等于或小于1500K。
7.根据权利要求1所述的发光组件，其特征在于，还包含一波长转换层，可选择地至少设置于所述发光二极管芯片、所述第一主表面或所述第二主表面上，所述波长转换层至少部分吸收所述发光二极管芯片所发出的光，并转换为另一波长范围的光。
8.根据权利要求7所述的发光组件，其特征在于，所述波长转换层与所述发光二极管芯片直接相接触。
9.根据权利要求7所述的发光组件，其特征在于，所述波长转换层与所述发光二极管芯片不相接触。
10.根据权利要求7所述的发光组件，其特征在于，所述波长转换层设置于所述第一主表面与所述第二主表面上，且位于不同表面上的波长转换层所含荧光粉比例为1比0.5至1比3。
11.根据权利要求2所述的发光组件，其特征在于，所述光线的波长范围大于或等于420纳米，或所述光线的波长范围小于或等于470纳米时，所述蓝宝石基板的光穿透率大于或等于70%。
12.根据权利要求1所述的发光组件，其特征在于，所述发光二极管芯片为若干个，每个发光二极管芯片均具有一发光面，所述第一主表面或所述第二主表面的面积为所述发光二极管芯片的发光面的总面积5倍以上。
13.一种发光组件，其特征在于，包括：
一透明基板，具有一承载面； 
其中，至少一发光二极管芯片，设置于所述透明基板的所述承载面上，而形成发光的一第一主表面，所述发光二极管芯片的一出光角度大于180°，且所述透明基板容许所述发光二极管芯片所发出的光线穿透所述透明基板相对应所述第一主表面的一第二主表面；以及
一波长转换层，可选择地至少设置于所述发光二极管芯片、所述第一主表面或所述第二主表面上，所述波长转换层至少部分吸收所述发光二极管芯片所发出的光，并转换为另一波长范围的光。
14.根据权利要求13所述的发光组件，其特征在于，所述透明基板的厚度大于或等于200微米。
15.根据权利要求13所述的发光组件，其特征在于，所述透明基板的材质包括选自于氧化铝、蓝宝石、玻璃、塑料或橡胶之任一。
16.根据权利要求13所述的发光组件，其特征在于，所述第一主表面与所述第二主表面的光线色温差异等于或小于1500K。
17.根据权利要求13所述的发光组件，其特征在于，所述波长转换层设置于所述第一主表面与所述第二主表面上，且位于不同表面上的波长转换层所含荧光粉比例为1比0.5至1比3。
18.根据权利要求13所述的发光组件，其特征在于，所述发光二极管芯片为若干个，每个发光二极管芯片均具有一发光面，所述第一主表面或所述第二主表面的面积为所述发光二极管芯片的发光面的总面积5倍以上。
19.一种发光组件，其特征在于，包括：
一透明基板，具有一承载面；以及
若干个发光二极管芯片，设置于所述透明基板的所述承载面上，每个发光二极管芯片均具有一发光面，而形成发光的一第一主表面；
其中，所述发光二极管芯片的一出光角度大于180°，且所述透明基板容许所述发光二极管芯片所发出的光线穿透所述透明基板相对应所述第一主表面的一第二主表面，且所述第一主表面或所述第二主表面的面积为所述发光二极管芯片的发光面的总面积5倍以上。
20.根据权利要求19所述的发光组件，其特征在于，所述透明基板的厚度大于或等于200微米。
21.根据权利要求19所述的发光组件，其特征在于，所述透明基板的材质包括选自于氧化铝、蓝宝石、玻璃、塑料或橡胶之任一。
22.根据权利要求19所述的发光组件，其特征在于，所述第一主表面与所述第二主表面的光线色温差异等于或小于1500K。
23.根据权利要求19所述的发光组件，其特征在于，还包含一波长转换层，可选择地至少设置于所述发光二极管芯片、所述第一主表面或所述第二主表面上，所述波长转换层至少部分吸收所述发光二极管芯片所发出的光，并转换为另一波长范围的光。
24.根据权利要求23所述的发光组件，其特征在于，所述波长转换层设置于所述第一主表面与所述第二主表面上，且位于不同表面上的波长转换层所含荧光粉比例为1比0.5至1比3。
25.一种发光组件，其特征在于，包括：
一透明基板，具有一承载面；
至少一类金刚石碳膜，设置于所述透明基板上；以及
至少一发光二极管芯片，设置于所述透明基板的承载面上，而形成发光的一第一主表面；
其中，所述发光二极管芯片的一出光角度大于180°，且所述透明基板容许所述发光二极管芯片所发出的光线穿透所述透明基板上相对应所述第一主表面的一第二主表面。
26.一种发光组件，其特征在于，包括：
一透明基板，具有一承载面；
至少一发光二极管芯片，设置于所述透明基板的承载面上，而形成发光的一第一主表面；以及
一反射镜，设置于所述透明基板上相对应所述第一主表面的一第二主表面上； 
其中，所述发光二极管芯片的一出光角度大于180°，且所述透明基板容许所述发光二极管芯片所发出的光线穿透。
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