TW200717854A - Surface mount light emitting diode package - Google Patents

Surface mount light emitting diode package

Info

Publication number
TW200717854A
TW200717854A TW094137595A TW94137595A TW200717854A TW 200717854 A TW200717854 A TW 200717854A TW 094137595 A TW094137595 A TW 094137595A TW 94137595 A TW94137595 A TW 94137595A TW 200717854 A TW200717854 A TW 200717854A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
leadframe
surface mount
diode package
Prior art date
Application number
TW094137595A
Other languages
Chinese (zh)
Inventor
Hua-Hsin Su
Kuan-Yu Huang
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Priority to TW094137595A priority Critical patent/TW200717854A/en
Publication of TW200717854A publication Critical patent/TW200717854A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)

Abstract

A surface mount light emitting diode package including a leadframe, a light emitting diode chip, multiple conductors and an encapsulant is provided. The light emitting diode chip having an active surface and multiple electrodes is disposed on the leadframe such that the active surface faces the leadframe and the electrodes are disposed on the active surface. In addition, the conductors are disposed between the leadframe and the light emitting diode chip. The electrodes are electrically connected with the leadframe through the conductors. The light emitting diode chip and portions of the leadframe are encapsulated by the encapsulant. Thus, the surface mount light emitting diode package has better luminescence efficiency.
TW094137595A 2005-10-27 2005-10-27 Surface mount light emitting diode package TW200717854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094137595A TW200717854A (en) 2005-10-27 2005-10-27 Surface mount light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094137595A TW200717854A (en) 2005-10-27 2005-10-27 Surface mount light emitting diode package

Publications (1)

Publication Number Publication Date
TW200717854A true TW200717854A (en) 2007-05-01

Family

ID=57911775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137595A TW200717854A (en) 2005-10-27 2005-10-27 Surface mount light emitting diode package

Country Status (1)

Country Link
TW (1) TW200717854A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103453357A (en) * 2012-05-29 2013-12-18 璨圆光电股份有限公司 Light emitting assembly
TWI425676B (en) * 2011-05-12 2014-02-01 Advanced Optoelectronic Tech Structure of the semiconductir package
TWI455380B (en) * 2011-07-29 2014-10-01 矽品精密工業股份有限公司 Light-emitting diode (led) package structure and its packaging method
CN111317427A (en) * 2018-12-13 2020-06-23 全景科技有限公司 Medical endoscope illuminating mechanism and manufacturing process thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425676B (en) * 2011-05-12 2014-02-01 Advanced Optoelectronic Tech Structure of the semiconductir package
TWI455380B (en) * 2011-07-29 2014-10-01 矽品精密工業股份有限公司 Light-emitting diode (led) package structure and its packaging method
CN103453357A (en) * 2012-05-29 2013-12-18 璨圆光电股份有限公司 Light emitting assembly
CN103453357B (en) * 2012-05-29 2017-04-12 晶元光电股份有限公司 Light emitting assembly
CN111317427A (en) * 2018-12-13 2020-06-23 全景科技有限公司 Medical endoscope illuminating mechanism and manufacturing process thereof

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