CN111317427A

CN111317427A - Medical endoscope illuminating mechanism and manufacturing process thereof

Info

Publication number: CN111317427A
Application number: CN201811523518.8A
Authority: CN
Inventors: 林荣德
Original assignee: Foshan Panpower Technology Co ltd
Current assignee: Foshan Panpower Technology Co ltd
Priority date: 2018-12-13
Filing date: 2018-12-13
Publication date: 2020-06-23

Abstract

The invention discloses a medical endoscope lighting mechanism and a manufacturing process thereof, comprising the following steps: a circuit board having a circuit layout; the image capturing equipment is fixed on the circuit board and is electrically connected with the circuit layout; at least one LED bare chip arranged on the circuit board and electrically connected with the circuit layout through a plurality of conductive pieces; and at least one colloid arranged on the circuit board and coating the LED bare chip and the plurality of conductive pieces. The LED bare chip is firstly fixed at a specific position of the circuit board, then is electrically connected with the circuit layout of the circuit board by utilizing the conductive piece, and finally is finished by arranging the colloid on the circuit board and solidifying the colloid after coating the LED bare chip and the conductive pieces. By using the technology of the invention, the size of the medical endoscope can be obviously reduced.

Description

Medical endoscope illuminating mechanism and manufacturing process thereof

Technical Field

The present invention relates to an endoscope, and more particularly to an illumination mechanism for medical endoscope and a manufacturing process thereof.

Background

An endoscope (endoscopy) is a common medical device, and extends into a human body through an elongated optical lens to perform medical actions. Some endoscopes can be used for medical actions such as treatment. Common endoscopes include cystoscopes, gastroscopes, colonoscopes, bronchoscopes, laparoscopes, and the like.

Since the endoscope medical practice mentioned above must insert an elongated optical lens into the body, it is often uncomfortable. In order to reduce the discomfort described above, some patients use a thinner endoscope, and some patients are anesthetized or sedated.

Generally, an optical lens of an endoscope has an image capturing device and at least one light source. Nowadays, a common image capturing device is a micro-CMOS, and a common light source is an LED. The method for disposing the light source includes disposing an LED die on a circuit board by Surface-mount technology (SMT).

The size of the endoscope manufactured by the aforementioned technology is limited and cannot meet the current miniaturization design.

Disclosure of Invention

The main object of the present invention is to provide an illumination mechanism for medical endoscope and the manufacturing process thereof, which can effectively reduce the size of the endoscope.

In order to achieve the purposes and effects, the invention adopts the following technical scheme:

an illumination mechanism for a medical endoscope, comprising: a circuit board having a circuit layout; the image capturing equipment is fixed on the circuit board and is electrically connected with the circuit layout; at least one LED bare chip, which is arranged on the circuit board and is electrically connected with the circuit layout through a plurality of conductive pieces respectively; and at least one colloid which is arranged on the circuit board and coats the LED bare chips and the conductive pieces.

In one embodiment, an adhesive is disposed between the circuit board and the LED die.

In one embodiment, the circuit layout of the circuit board has a plurality of bonding pads (bonding pads), one end of each of the conductive members is connected to the bonding pads, and the encapsulant encapsulates the bonding pads.

In one embodiment, the gel is transparent or has a specific color.

A process for manufacturing an illumination mechanism of a medical endoscope comprises the following steps:

fixing an LED bare chip on a specific position on the circuit board;

secondly, using a plurality of conductive parts to electrically connect the LED bare chip and the circuit layout of the circuit board;

coating a colloid on the circuit board and coating the LED bare chip and the conductive pieces in the circuit board; and

and (IV) curing the colloid.

In one embodiment, the circuit board is cleaned and destaticized prior to performing step (one).

In one embodiment, step (one) comprises: disposing an adhesive on a specific position of the circuit board; disposing the LED bare chip on the adhesive; and heating the adhesive to cure the adhesive.

In one embodiment, after the step (ii), a procedure of detecting the electrical connection between the LED die and the circuit layout of the circuit board is further included.

In one embodiment, in the step (ii), one end of the conductive members is connected to the gold finger of the circuit layout; in the third step, the colloid covers the gold fingers.

In an embodiment, after the step (iv), the method further includes detecting the quality of the cured encapsulant and detecting the electrical connection between the LED die and the circuit layout of the circuit board.

The invention has the beneficial effects that: the invention can obviously reduce the diameter of the circuit board so as to reduce the size of the medical endoscope.

Drawings

Fig. 1 is an exploded view of a first preferred embodiment of the present invention.

Fig. 2 is a front view of the first preferred embodiment of the present invention.

FIG. 3 is a flow chart of the first preferred embodiment of the present invention.

Fig. 4 is a front view of a second preferred embodiment of the present invention.

Fig. 5 is a front view of a third preferred embodiment of the present invention.

1,2,3 medical endoscope lighting mechanism

10 casing

12,30,50 circuit board

14,34,52 image capture device

16,36,54LED bare chip

18,40,56 colloid

20,32 circuit layout

22 golden finger

24,38 conductive element

Detailed Description

Referring to fig. 1, a medical endoscope illumination mechanism 1 according to a first preferred embodiment of the present invention includes: a housing 10, a circuit board 12, an image capturing device 14, an LED die 16 and a molding compound 18 are disposed inside the housing 10. Referring to fig. 2, the image capturing device 14, the LED die 16 and the encapsulant 18 are disposed on the circuit board 12, the circuit board 12 has a circuit layout 20, and the circuit layout 20 has a plurality of gold fingers (bonding pads)22 electrically connected to the image capturing device 14 and the LED die 16.

Referring to fig. 3, the LED die 16 is disposed on the circuit board 12 by the following steps:

an LED die 16 is fixed to a specific position on the circuit board 12.

In a first preferred embodiment, the circuit board 12 is cleaned and destaticized, and then an adhesive (not shown) is disposed at the specific location. Then, after the LED die 16 is disposed on the adhesive, the circuit board 12 is sent into a baking oven (not shown) to be heated, so that the adhesive is cured, thereby firmly fixing the LED die 16 on the circuit board 12. The temperature and time of heating will depend on the composition of the adhesive.

Second, using a plurality of conductive members 24 to electrically connect the LED bare chip 16 and the circuit layout 20 of the circuit board 12:

the LED die 16 is electrically connected to the circuit layout 20 of the circuit board 12 by: wire Bonding (WireBonding), Flip Chip (Flip Chip), Tape Automated Bonding (TAB), and the like. In the first preferred embodiment, the LED die 16 is electrically connected to the circuit layout 20 of the circuit board 12 by wire bonding. The conductive members 24 are a plurality of gold wires, one end of each gold wire is connected to the LED die 16, and the other end is connected to the gold finger 22 of the circuit layout 20 of the circuit board 12.

After the LED die 16 is electrically connected to the circuit layout 20 of the circuit board 12, a detection procedure for electrically connecting the LED die 16 to the circuit layout 20 of the circuit board 12 is performed to determine whether the LED die 16 is electrically connected to the circuit layout 20 of the circuit board 12 correctly. The subsequent procedures can be carried out by the detector; if the failed person passes the detection, the failed person can be repaired and detected again; or to discard.

(III) coating a glue 18 on the circuit board 12 and encapsulating the LED die 16 and the conductive members 24 therein:

in the first embodiment, the liquid adhesive 18 is coated on the circuit board 12 and covers the LED die 16, the gold wires (conductive member 24) and the gold fingers 22. The gel 18 may be transparent or have a particular color, such as: red, blue, yellow, etc. to control the color of light emitted by the LED die 16.

(IV) curing the gel 18:

in the first embodiment, the circuit board 12 coated with the glue 18 is sent to a baking oven (not shown) to be heated, so that the glue 18 is cured. The temperature and time of heating will depend on the composition of the gel 18. The cured gel 18 is circular.

After the glue 18 is cured, a detection procedure is performed, including detecting the quality of the cured glue 18 and detecting the electrical connection between the LED die 16 and the circuit layout 20 of the circuit board 12. Similarly, the LED bare chip 16 is set by the inspection device; if the failed person passes through the test, the failed person needs to be repaired and then detected again; or to discard.

Through the above steps, the LED die 16 can be directly fixed on the circuit board 12, so that the diameter of the circuit board 12 can be reduced. According to the inventor's experiments, the diameter of the circuit board 12 of the endoscope manufactured by the known technology needs at least 3 mm; however, the diameter of the circuit board 12 can be reduced to 2.6mm by the process disclosed in the present invention. In other words, the diameter of the endoscope manufactured by the technology of the invention can be reduced by about 10% compared with the traditional endoscope.

Referring to fig. 4, a second preferred embodiment of the present invention provides an illumination mechanism 2 for a medical endoscope, which has a structure similar to that of the first preferred embodiment, and comprises: a circuit board 30 having a circuit layout 32, an image capturing device 34 fixed on the circuit board 32 and electrically connected to the circuit layout of the circuit board 32, four LED dies 36 disposed on the circuit board 32 and surrounding the image capturing device 34 and electrically connected to the circuit layout through a plurality of conductive members 38, and four colloids 40 disposed on the circuit board 32 and respectively encapsulating the LED dies 36 and the conductive members 38. The LED die 36 of the second preferred embodiment is disposed on the circuit board 32 by the process disclosed in the first preferred embodiment. The difference is that: the number of the LED dies 36 of the second embodiment is increased to four, and the cured gel 40 has an oval shape. In addition, according to the experiment of the inventor, the diameter of the circuit board 32 of the second preferred embodiment can be maintained at about 2.6mm as well.

Referring to fig. 5, a third preferred embodiment of the present invention provides an illumination mechanism 3 for a medical endoscope, which has a structure similar to that of the first and second preferred embodiments, and comprises: a circuit board 50, an image capturing device 52, eight LED dies 54, and eight colloids 56. The difference is that: the number of the LED dies 54 of the third embodiment is increased to eight, and the cured gel 56 has an irregular shape. The diameter of the circuit board 52 can also be maintained at about 26 mm.

The foregoing is directed to the preferred embodiment and design drawings of the present invention, which are provided for illustration only and not for the purpose of limiting the invention as defined by the appended claims.

Claims

1. A medical endoscope illumination mechanism, characterized in that: comprises the following steps:

a circuit board having a circuit layout;

the image capturing equipment is fixed on the circuit board and is electrically connected with the circuit layout;

at least one LED bare chip arranged on the circuit board and electrically connected with the circuit layout through a plurality of conductive pieces; and

at least one colloid is arranged on the circuit board and covers the LED bare chip and the plurality of conductive pieces.

2. The medical endoscope illumination mechanism according to claim 1, characterized in that: an adhesive is arranged between the circuit board and the LED bare chip.

3. The medical endoscope illumination mechanism according to claim 1, characterized in that: the circuit layout of the circuit board is provided with a plurality of golden fingers, one end of each conductive piece is connected with one golden finger, and the colloid coats the plurality of golden fingers.

4. The medical endoscope illumination mechanism according to claim 1, characterized in that: the colloid is transparent or has a specific color.

5. A process for manufacturing an illumination mechanism of a medical endoscope is characterized in that: comprises the following steps:

fixing an LED bare chip on a specific position on the circuit board;

coating a colloid on the circuit board and coating the LED bare chip and the plurality of conductive pieces in the circuit board; and

and (IV) curing the colloid.

6. The process for manufacturing the illumination mechanism of the medical endoscope according to the claim 5, characterized in that: before the step (one), the circuit board is cleaned and destaticized.

7. The process for manufacturing the illumination mechanism of the medical endoscope according to the claim 5, characterized in that: the step (one) comprises the following steps:

arranging an adhesive on a specific position of the circuit board;

disposing the LED bare chip on the adhesive; and

heating the adhesive to cure the adhesive.

8. The process for manufacturing the illumination mechanism of the medical endoscope according to the claim 5, characterized in that: after the step (two), a procedure of detecting the electrical connection between the LED bare chip and the circuit layout of the circuit board is further included.

9. The process for manufacturing the illumination mechanism of the medical endoscope according to the claim 5, characterized in that: in the step (two), one end of the plurality of conductive parts is connected with the golden fingers of the circuit layout; in the third step, the colloid covers the plurality of gold fingers.

10. The process for manufacturing the illumination mechanism of the medical endoscope according to the claim 9, characterized in that: after the step (IV), the method further comprises the procedures of detecting the quality of the solidified colloid and detecting the electrical connection between the LED bare chip and the circuit layout of the circuit board.