TW511299B - Metal substrate with double LED for double side light emission - Google Patents

Abstract

This invention discloses a package for light emitting diode mounted on double side of a metal substrate for double side light emission, one application for the package is to assemble a thin layer double side image display.

Description

511299 V. Description of the invention (l) 1 · Field of application of this technology This technology is applicable to two sides of a light-emitting surface, which are formed on two sides of a metal substrate to form two-sided light-emitting substrates. 2. Background note! Know =; photodiode wafers The package is a single-sided light-emitting package unit that is sealed with double-sided light. As shown in the figure !. The light-emitting diode wafer 10 shown in the conventional art is disposed on the -metal base '"the substrate 11 is electrically coupled to the wafer i 〇 surface: there is a second electrode in the form of a surface electrode, in a 13-wire manner = = Γ The second gold f substrate 12, the package of this conventional technique is to provide a cross-sectional view of FIG. 1. 'shows the first metal substrate u = the outer end is bent into an L-shape so as to produce a surface: a second-generation substrate 12 to the external motherboard. The encapsulation gel 丨 5 seals are used to couple the first metal substrate u and the second metal substrate. Each of this technology first conceives a "double-sided light emitting" unit that can be assembled into a thin film type. Double-sided traffic lights; =-double-sided light-emitting veneer, or thin-type double-sided display screen, the chip combination used in the surface display decoration unit can include black and white color changes, depending on the full-color light changes. ..... part of the color, and 3.

Page 4 511299 V. Description of the invention (2) " " —1-- Figure 3. · Double-sided placement of wafers in this technique-relative arrangement diagram shows light-emitting diode wafers 201 and 202, which are respectively placed on the first metal substrate The top and bottom of the material 211, and the metal substrate 21m is electrically coupled to the bottom surface electrodes of the wafers 201, 202. The wafers 201, 202 have second electrodes in the form of surface electrodes, which are respectively wired 231, The 2 32 method combines the surface electrode with the second metal substrate 212 and the third metal substrate 213 to provide a double-sided effect. Fig. 4 · 3 · The cross-sectional view shows that the wafers 20 and 20 are located at the top and bottom symmetrical positions of the first metal base material 211. The outer ends of the second metal base material 212 and the third gold earth material 213 are bent into a [-shape, so as to generate surface-adhesive pins, which are used to couple the external motherboard. The encapsulating gel 25 encapsulates and protects each element from exposing the second metal substrate 212 and the third metal substrate 21. The L-shaped part of the outer end and the outer end of the first metal base 211 are also bent into a ^ -shape (shown in FIG. 12). To fit the external circuit board. … Fig. 5 · Double-sided placement of wafers in this technique-staggered arrangement Unlike Fig. 4, the wafers 301, 302 are staggered up and down. The light-emitting diode wafers 301 and 302 shown in the figure are respectively disposed above and below the first metal 311, and the metal substrate 311 is electrically coupled to the bottom electrode of the wafer & i < B 302, the wafer 301. , 302 has a second electrode in the form of a surface electrode, and the surface electrode is coupled to the second metal substrate 312 and the third metal substrate 313 by wiring 331, 332 respectively, providing the effect of double-sided light emission.

Ｍ1299 5. Description of the invention

= '11 shows that the crystal ㈣1 '302 is located at the first metal base UQ * iO and is staggered below. The second metal substrate 3 12 and the third metal A are coupled to the outer end / curved into an L shape, so as to produce a surface-adhesive pin: for a mother board of 2 m 卩. The encapsulation colloid 35 encapsulates and protects each component. The outer ends of the L-shaped part of the metal substrate 311 and the outer end of the bare metal substrate 312 and the third metal substrate 313 are also bent into a [type (not shown in the figure for coupling to The use of external motherboards. = Type dome is an example of this technique. In actual production, it can also be a straight leg in the form of a plug. A can be bent inward to form a U-shaped pin. The shape of the pin is not the original. The characteristics of the technique, this technique is not only used to the essence of the technique is the range that the technique wants to keep thin. Figure 7 · The design of the concave cup added to this technique = the design of Figure 6, T to increase the capacity of the concave cup The wafer provides a light-gathering effect. The figure shows that the first metal substrate 411 has a concave cup above and below, respectively, to accommodate the wafers 401 and 402. The other descriptions are the same as the previous, that is, the wafer

401 and 402 are located in the concave cups staggered on the top and bottom of the first metal substrate 411, respectively. The first metal substrate 411 is electrically coupled to the bottom electrodes of the wafers 401, 402. The surface electrodes of the wafers 401 and 402 are coupled to the second metal substrate 412 and the third metal substrate 413 by wires 431 and 432, respectively. The outer ends of the second metal base material 412 and the third metal base material 413 are bent into an L shape so as to produce

Page 6 Description of the Invention (4) Surface, contact pins for coupling to an external motherboard. The encapsulating gel 45 encapsulates and protects each component, exposing the second metal base material 412 and the third metal material 41 3 l-shaped portions at the outer ends. The outer end of the first metal substrate 411 is also the same as the L-shaped (not shown) for coupling to an external circuit board. Figure 8 · This technology uses multiple chips

One side of this technology can contain multiple chips, and individual chips can be used to provide high-brightness light, and light chips of different colors can also be used to provide the effect of color change. When the luminous colors of multiple wafers are red (R), green (G), and blue (B), full-color light can be provided. When the luminous color of multiple chips is any two colors of colored light, the color change can be provided. Other instructions are the same as before, that is, the wafers 501, 502, and 503 are located on the first metal substrate 511. The first metal substrate 511 is electrically coupled to the bottom electrodes of the wafers 501, 502, and 503. The surface electrodes of the wafers 501, 502, and 503 are coupled to the second metal substrate 512, the fourth metal substrate 514, and the sixth metal substrate with wires 5 3 1, 5 3 2, 53 3, respectively.材 516. The third metal substrate 513, the fifth metal substrate 515, and the seventh metal substrate 5 17 are provided as three wafers on the back surface. Metal substrates 511, 512, 513, 514, 515, 516, 517 The outer end is bent into an L-shape (as shown in Figures 4, 6, and 7) 'in order to produce surface-adhesive pins.

511299 V. Description of the invention (5) Use of I to external mother circuit board. Sealing skin Xia Xia 楚 Chu made U protect the components from the encapsulant 55 and exposed the L-shaped part of the outer end of the metal substrate. Figure 9 · Double-sided chip wiring common electrode pin shows the back of the wafer 504. 50 5. 506 are coupled to the second electrode 512, the fourth electrode 514, and the sixth electrode 5ΐ6. By wiring 534. 535. 536, respectively, and the front side The corresponding wafer shares an extension electrode. Figure 10 · Double-bottom electrode contact coupling shows that the wafer 501.502.503 contacts the coupling wafer with the wafer-covering technique. The third electrode and the first electrode to the first metal electrode 5 μm and another metal electrode 51 2. 514 · 516. The wafer on the back side also covers the first electrode and the second electrode to the first metal electrode 5m and another metal electrode 513 · 515 · 517 in a wafer cover type. Figure 11 · Double-sided wafer-covered common electrode pins show that both sides are covered with the technology, and the electrodes of three wafers 501, 502, 503 are electrically coupled to the first metal electrode 511, the second metal electrode 512, and the fourth metal electrode, respectively. 514. The sixth metal electrode 516.

Fig. 12 · Adds a concave cup to the design of Fig. 8 · Unlike Fig. 8 ·, this design adds a concave cup to accommodate wafers, which improves the effect. The rest of the description is the same.

511299 V. Description of the invention (6) Fig. 1 · The concave cup of this technique can accommodate more than one wafer. The concave cup 6 2 has three red, green and blue wafers. In actual use, wafers of the same color can also be placed. When designing with fewer color variations, it is also possible to place only two wafers of different colors of light. The figure shows that the bottom electrodes of the two chips, red, green, and monitor, consume the first metal substrate 6 11 'at the bottom of the concave cup, and the surface electrodes are coupled to the wires 6 3 1, 6 3 2, and 6 3 3 respectively. The second metal substrate 613, the fourth metal substrate 614, and the seventh metal substrate 6 1 7.

The concave cup 601_ is opposite to the concave cup 602, and also contains red, green, and blue chrysanthemum wafers. The bottom electrode of the three wafers is coupled to the first metal difference material 611 at the bottom of the concave cup, and the surface electrodes are coupled by wire. To the second metal substrate 612, the fifth metal substrate 615, and the sixth metal substrate 616. Color display screen (color Figure 14 · Shows that this technique is applied to thin-plate dual display) Circuits are printed on the printed circuit board 70 (Li Yuzhi's through hole 讪 2, which is not shown in Figure 82 of this technique) '㉟ 有Regularly arranged + double-sided full-color luminous mushrooms in Figure 8 or Figure 9. One-to-one correspondences are placed in the through hole 702 in the mouth of J 殳 甶 王 and I 九 Early Out-coupled to the circuit board The form of a double-sided color display screen and the extension electrode circuit of the unit can form a thin sheet. The description reveals that the preferred embodiment of the present invention and the design pattern are only two e, and the design pattern, but The scope of the right to invention technology is here, =: For example, it is not used to limit this, where everyone implements this 511299 with equal skill

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Brief description of the drawings 4. Brief description of the drawings Figure 1. Known techniques Figure 2. Figure 1 · Cross-sectional view Figure 3 · Double-sided placement of wafers in this technology-relative arrangement Figure 4 · Figure 3 · Sectional view Figure 5. This technology double-sided placement of wafers-staggered arrangement Figure 6 · Figure 5 · cross-sectional view Figure 7 · This technology adds a concave cup design Figure 8. This technology uses multiple wafers Figure 9 · Double-sided wafer wiring common electrode pins Figure 10. Double-bottom electrode contact coupling Figure 11 • Double-sided wafer-covered common electrode pin Figure 12 • Figure 8 • Design of a concave cup is added Figure 13 • The concave cup of this technology can accommodate more than one wafer Figure 1 4 • Show this Application of technology in color display on both sides of sheet

5.Element No. Table Luminous Diode Wafer 10.201.202.301.3 02.401.402.501.502.503.504.505.506 Electrode 11.12 · 211 · 212 · 21 Stand · 311 · 312 · 313 · 411 · 412 · 413 · 511 · 512. 513. 514. 515. 516. 517. Line 13.231. 232. 331.332.431.432.531.532.533.534.535.536

Page 11 511299 Brief description of drawings Concave cup 6 01 · 6 0 2 · Circuit board 70 Through hole 702 Page 12

Claims (1)

511299 VI. Application Patent Scope 1. A double-sided light-emitting unit with LEDs arranged on both sides of a metal substrate, including at least two light-emitting diode wafers, each of which has a first electrode and a second electrode The first metal substrate, the first side of which carries at least one of the aforementioned wafers, and is electrically coupled to the first electrode of the aforementioned wafer; the second side of which carries at least one of the aforementioned wafers, and is electrically coupled to the aforementioned The first electrode of the wafer; the second metal substrate is electrically coupled to the aforementioned second electrode of the wafer located on the first surface of the first metal substrate; the third metal substrate is electrically coupled to the foregoing located The second electrode of the wafer on the second f-side of the first metal substrate; and a sealing gel, which protects the aforementioned components, and exposes the foregoing first metal substrate, the second metal substrate, and the third metal substrate. The ends serve as extension electrodes; when the aforementioned first and second wafers emit light, they exhibit the effect of emitting light on both sides. 2. A double-sided light-emitting unit in which LEDs are arranged on both sides of a metal substrate as described in item 1. of the scope of the patent application, wherein the positions of the wafers on the first and second sides of the first metal substrate are as described above. , Are arranged symmetrically up and down. 3. A double-sided light-emitting unit in which L E D is mounted on both sides of a metal substrate as described in item 1. of the scope of the patent application, wherein the knitting means: wire bonding | horse-joint 0 Page 13 511299 6. Scope of patent application 4. As described in item 1 of the scope of patent application, a double-sided light-emitting unit with LEDs arranged on both sides of a metal substrate, where the coupling refers to: contact coupling . 5. A double-sided light-emitting unit in which an LED is mounted on both sides of a metal substrate as described in item 1. of the scope of patent application, wherein the coupling refers to a combination of wire coupling and contact coupling. 6. A double-sided light-emitting unit in which LEDs are arranged on both sides of a metal substrate as described in item 1. of the scope of the patent application, wherein the wafers located on the first side and the second side of the first metal substrate are Arranged at intervals. 7. A double-sided light-emitting unit in which LEDs are arranged on both sides of a metal substrate as described in item 6. of the scope of the patent application, wherein the two sides of the first substrate further include a concave cup to accommodate the aforementioned wafer, Provides a spotlight effect. 8. A double-sided light-emitting unit in which an LED is mounted on both sides of a metal substrate as described in item 1 of the scope of the patent application, wherein the first side of the first substrate includes at least two wafers. 9. A double-sided light-emitting unit in which an LED is mounted on both sides of a metal substrate as described in item 8 of the scope of the patent application, wherein the two wafers each emit light of the same color. Page 14 511299 VI. Application scope of patent 10. As described in item 8. of the scope of application for patent, a double-sided light-emitting unit with LEDs arranged on both sides of a metal substrate, wherein the two chips are emitted separately People with different colors of light. 11. The double-sided light-emitting unit of an LED is arranged on both sides of a metal substrate as described in item 1. of the scope of patent application, wherein the first side of the first substrate includes at least three wafers. Stomach 1 2. A double-sided light-emitting unit with LEDs arranged on both sides of a metal substrate as described in item 11 of the scope of the patent application, wherein the three wafers each emit light of the same color. 1 3. A double-sided light-emitting unit in which LEDs are arranged on both sides of a metal substrate as described in item 11 of the scope of the patent application, wherein the three chips emit red, green, and blue, respectively. Light color, constitutes a full-color changer0 Page 15