TW582122B - Light emitting diode package structure - Google Patents

Light emitting diode package structure Download PDF

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Publication number
TW582122B
TW582122B TW92101763A TW92101763A TW582122B TW 582122 B TW582122 B TW 582122B TW 92101763 A TW92101763 A TW 92101763A TW 92101763 A TW92101763 A TW 92101763A TW 582122 B TW582122 B TW 582122B
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TW
Taiwan
Prior art keywords
emitting diode
resin
package structure
patent application
scope
Prior art date
Application number
TW92101763A
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Chinese (zh)
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TW200414561A (en
Inventor
Ming-Der Lin
Jung-Kuei Hsu
San-Bao Lin
Original Assignee
Opto Tech Corp
Highlink Technology Corp
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Application filed by Opto Tech Corp, Highlink Technology Corp filed Critical Opto Tech Corp
Priority to TW92101763A priority Critical patent/TW582122B/en
Application granted granted Critical
Publication of TW582122B publication Critical patent/TW582122B/en
Publication of TW200414561A publication Critical patent/TW200414561A/en

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Abstract

A light emitting diode package structure includes an insulated carrier base formed with a recess or a through hole. The recess or the through hole has an enough depth for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for completely sealing the light emitting diode and the two wiring lines.

Description

582122 V. Description of the invention (1) 1. [Technical field to which the invention belongs] The present invention relates to a light-emitting diode, which relates to a kind of light-emitting diode that can enhance the development of the light-emitting diode and reduce production costs. Productivity is further improved. 2. [Previous technology] In general industry applications, light-emitting diodes provide more than white fluorescent lamps. * The body has developed various packaging structures and methods, such as surface-mount structures and flip-chip-type package structures. 1. FIG. 1 shows one of the conventional packaging structures of a light-emitting diode. Referring to FIG. 1, a light-emitting diode 10 is mounted on a package base 20 in a flip-chip manner. The light-emitting diode 10 has a substrate u, a conductive semiconductor layer 12 formed on the substrate 11, and a second conductive semiconductor layer 13 formed on the first conductive semiconductor layer 12. In addition, the first conductive A first electrode 14 is formed on a predetermined area of the semiconductor type semiconductor layer 12, and a second electrode 15 is formed on a predetermined area of one of the second conductivity type semiconductor layers 13. Light-emitting diodes; the manufacturing methods and operating methods of 10 are well known, so this article will not go into details. In the conventional package structure shown in FIG. 1, two metal solder balls 16 and 17 are respectively formed on the first electrode 14 and the second electrode 15 of the light emitting diode 10. Then, in a flip chip manner, the two metal solder balls 16 and 17 are aligned and bonded to the first pad 21 and the second pad 22 formed on the package base 20, respectively. most

582122 V Description of the invention (2) One after the other-a transparent resin 18 is used to seal the light-emitting diode package. When the power supply passes through the body 12 and the light emitting diode 10 is completed, the light emitting diode 10 ^ a pad for the substrate 11 and the transparent resin 18 to be emitted to the outside, "the line will be shown through. The conventional package structure shown in FIG. 1 indicated by the arrow in 1 has the following disadvantages. The first solder balls 16 and 17 may contact each other and cause the short circuit of the first electrode 14 and the second genus 15. Furthermore, the light emitting diode 1 ′ When flip chip is mounted on the second package base 20, it is necessary to ensure that the metal solder balls 16 and 17 are aligned ^ The pad 21 and the second 塾 22 'cause manufacturing to be more difficult and increase the heart: In addition, it is expected to provide a comparison diagram丨 The conventional package shown with the seal = good luminous efficiency of the light-emitting diode is used to construct the heat generated by the 彳 operation, thereby increasing the life and availability of the light-emitting diode. [Summary of the Invention] Yes In view of the foregoing problems, an object of the present invention is to provide a packaging structure for simplifying the packaging process of light emitting diodes, improving productivity and reducing production costs. 'Another object of the present invention is to provide a packaging structure of a light emitting diode', which has better light emitting efficiency of the light emitting diode, thereby reducing the heat generated by households during operation, thereby increasing the life of the light emitting diode. Shown 0 ^

582122 V. Description of the invention (3) According to the present invention, including the formation of a flat metal Zhan-resin to fill the concave sealed light-emitting diodes which are used to support the surface of the light-emitting diode holder, and provide at least one One less wiring on the middle table connects one of the two electrodes and at least one wiring. According to the hair mounting structure, the substrate including the body faces at least one flat gold on the surface that fully accommodates the light-emitting two carriers. A resin filler is used to seal the light emitting diode according to the present invention to provide a light diode body with a groove. At least one layer and groove out of the groove and covering the body and at least one other state, an intermediate countertop, and connected to the at least one plane. One resin 〇 The other is formed under the body through a through hole. At least one of the through-hole metal layers is full of through-holes, and the light-emitting diode is another one, at least one in the middle, providing a light-emitting diode package structure and a transparent insulating carrier. The bottom surface of the groove. The depth of the grooves is sufficient to form a completely planar metal layer on the area of the transparent insulating carrier. At least one wiring is connected to at least one of the two electrodes of the light emitting diode. One part of the plane metal layer is missing for wiring. Like, concave. At least the groove metal layer fills the groove to have at least one stepped portion, and a planar metal layer is formed on at least one metal pad other than at least one. The grooves of the middle layer and the light emitting diode are used to seal the light emitting diode form, and provide an insulating opening of the light emitting diode through hole. A flat edge bearing seat. The depth layer of the hole is formed on the transparent layer and the light-emitting layer, and covers at least one and at least one configuration. The mesa penetrates the metal region. At least the encapsulation of the pole body and the light-emitting diode can be used to complete the insulation and wiring connection. One of the two electrodes of the pole body is a part of the planar metal layer. The hole has at least one step through, at least one planar metal layer is formed in

Page 9 582122 V. Description of the invention (4) Minorities _ * 塾.丨 on the mesa and connected to at least one metal located outside the through hole connected to at least one flat metal layer and two of the light emitting diode ", one. A resin fills the through hole to seal the light emitting diode and at least one One wiring. Four [Embodiments] The foregoing and other objects and examples of the invention. Illuminated side view of the example of the insulating bearing seat. The clear insulating bearing groove 31 has a clear insulating bearing surface, and the concave metal layer is formed on the flat gold edge area. As for the two examples of light emission, on the bottom surface 32, the light emitting alternative can be transparent to any preferred embodiment of the present invention. The first solid line A-A 'of the present invention is cut through one embodiment. Indentation 31. For example, indentation, the planes a and 3 5 b of the transparent bearing seat 30 are separated from each other and placed in the groove 31 and supported by the groove 31. The adhesive is fixed on the In the present invention, the type or structure, the following description and drawings will make the third feature and the advantages more obvious. The record will be described in detail with reference to the drawings. Figure 2 (a) shows the first embodiment of the present invention. Figure while 2 (b) shows a package structure according to a jade body. Referring to FIG. 2 (a) and FIG. 2 (a), according to the seat 30 of the present invention, a bottom surface 32 and two side wall surfaces 33a and 33 are formed in an approximately central area. 33b. Block 30 is made of glass. Two 34a and 34b are formed in the area other than the transparent insulation groove 31. In addition, two metal pads 35 are on the layers 34a and 34b, and are located on the transparent insulation with reference to FIG. 2 ( b), the substrate 11 of the light-emitting diode 10 is formed by the bottom surface of the groove 31, and the substrate 11 of the light-emitting diode 10 can be transparent to facilitate subsequent processes. It should be noted that 10 is not limited to the specific material

Page 10 582122 V. Description of the invention (5) Material type or structure. For example, the material type of the light-emitting diode 10 can be indium gallium indium type, indium gallium indium type, indium gallium nitride type, gallium gallium type, or carbonized type. The configuration of the light emitting diode 10 is a configuration in which two electrodes are on the same side and have a transparent substrate. Furthermore, the light emitting diode 10 must be designed to emit light from the front or the back. In addition, the light emitting diode 10 further includes a reflective layer and a transparent conductive layer. The groove 31 according to the present invention has a sufficient depth so that the light emitting diode 10 can be completely accommodated in the groove 31 and not exposed from the opening of the groove 31. For example, the depth of the groove 31 is less than 10 m. The wiring 36a is used to connect the first electrode 14 and the planar metal layer 34a, and the wiring 36b is used to connect the second electrode η to the planar metal layer 34b. The resin 37 fills the groove 31 and covers the portions of the wirings 36a and 36b that expose the groove 31, so that the light-emitting diodes 10 and the wirings 36a and 36b are sealed in the resin 37. For example, the resin 37 may be made of epoxy resin. A material having high thermal conductivity may be added to the resin 37 to enhance the heat dissipation performance of the sealing structure. Further, a material having high reflectivity 'may be added to the resin 37 so that a portion of the light generated by the light emitting diode 10 toward the resin 37 is reflected to improve the light emitting efficiency. In addition, in order to further improve the light emitting efficiency, a reflective layer (not shown) may be coated on the resin 37 to reflect the light generated by the light emitting diode 10 toward the bottom surface 32. When the power is supplied to the light-emitting diode 10 through the protruding metal pads 35 & 351), the light generated by the light-emitting diode 10 will be emitted to the outside through the substrate 11 and the transparent insulation, and the carrier 30, as shown in Figure 2. The arrow f in (b) indicates f = Compared to the conventional package shown in Figure 1, i. * 封 魅 m ^ ^ Pair structure, according to the light-emitting diode and foot of the present invention, β 9 is simple Complete packaging process without the need to use precision

582122

V. Description of the invention (6) Alignment technology, which will increase productivity and reduce production costs. Fig. 3 (a) shows a top view of a transparent insulating carrier 40 according to a second practical example of the present invention, and Fig. 3 (b) shows a packaging fabrication diagram of a light emitting diode according to a second embodiment of the present invention. Sectional view of line BB in 3 (a). Only the differences between the second embodiment and the first embodiment will be described below. 3 (a) and 3 (b), the second embodiment according to the present invention is different from the first embodiment according to the present invention in that two step portions are formed in the groove 41 according to the second embodiment of the present invention. Specifically, the lower sidewall surface 43a, the intermediate mesa surface 44a, and the upper sidewall surface 45a constitute a stepped portion, and the lower sidewall surface 43b, the intermediate mesa surface 44b, and the upper sidewall surface 45b constitute another stepped portion. Furthermore, the planar metal layer 46a is formed on the intermediate mesa 44a and the upper side wall surface 45a, and the planar metal layer 46b is formed on the intermediate mesa 44b and the upper side wall surface 45b. On the surface of the transparent insulating carrier 30, two metal pads 47a and 47b separated from each other are formed in an area other than the groove 31. The metal hafnium 47a is connected to the planar metal layer 46a, and the metal pad 47b is connected to the planar metal layer 46b. The light emitting diode 10 is placed in the groove 41 so that the substrate 11 of the light emitting diode 10 is supported by the bottom surface 42 of the groove 41. The wiring 4 8 a is used to connect the portion of the first electrode 14 and the planar metal layer 4 6 a on the intermediate mesa 4 4 a, and the wiring 48 b is used to connect the second electrode 15 and the planar metal layer 46 b on the intermediate mesa 44. Part b. With such a design of the groove 41 having two stepped portions, the wirings 48a and 48b can be completely accommodated in the groove 41. Finally, the resin 49 fills the groove 41 and covers the wirings 48a and 48b, so that the light emitting diodes 10 and the wirings 48a and 48b are sealed in the resin 49. For example, resin 49 must be made of epoxy

Page 12 582122 V. Description of the invention (7) Resin. A material having high thermal conductivity may be added to the resin 49 to enhance the heat dissipation performance of the package structure. In addition, a highly reflective material may be added to the resin 49, so that the light generated by the light emitting diode 10 is directed toward the center; a portion of the resin 49 is reflected to improve the light emitting efficiency. In addition, in order to further improve the light emitting efficiency, a reflective layer (not shown) may be coated on the resin 49 to reflect the light generated by the light emitting diode 10 toward the bottom surface 42. As can be seen from the comparison between FIG. 2 (b) and FIG. 3 (b), since the wiring and 48b can all be located in the groove 41, the packaging structure of the light emitting diode of the second embodiment has a size smaller than that of the first embodiment. .

FIG. 4 shows a cross-sectional view of a packaging structure of a light emitting diode according to a third embodiment of the present invention. In the following, only the third embodiment differs from the first embodiment. Referring to FIG. 4, the third embodiment according to the present invention is different from the first embodiment according to the present invention in that the insulating carrier 50 according to the third embodiment of the present invention does not need to be transparent and a through hole 51 is formed at an approximately central area. . The through hole 51 passes through the insulating carrier 50 to form a lower opening 52 & and an upper opening 5 2 b. It should be noted that in the present invention, the pore size of the lower opening 5 2 a is larger than, equal to, or smaller than the pore size of the upper opening 52 b, and is not limited to the example shown in FIG. 4. When the lower opening 52a is sealed, the transparent resin 53a is injected into the through-hole 51 from the upper opening 52b so that the through-hole 51 is only partially filled. Then, the light-emitting diode 10 is placed in the through-hole 51 through the upper opening 52b, so that the substrate of the light-emitting diode 10 is supported by the transparent resin 53a. After the transparent resin 5 3 a is hardened by the baking treatment, the light-emitting diode is fixed.

Page 13 582122 V. Description of the invention (8) Yu Bei, ^ 51 on the transparent resin 53a. Finally, the wiring connection process is performed. The transparent resin 53b fills the through-hole 51 and covers the portions of the wiring holes 51a and 36b, so that the light-emitting diode 10 and the wirings 36a and 36b are sealed in the transparent resin 53a and Within 53b. When the S power is supplied to the light emitting diode 10 through the protruding metal pads 35a and 35b, the light generated by the light emitting diode 10 will be emitted to the outside through the substrate 11 and the transparent tree 5a, as shown by the arrow in FIG. Indicated. Since the light does not need to be emitted to the outside through the insulating support base 50, the insulating support base 50 according to the third embodiment of the present invention is not limited to being formed of a transparent material such as glass, but may also be made of ceramics, A1N, Sic, Plastic, resin, or printed circuit, and a combination of materials. In addition, the insulating carrier 50 may also be composed of a plurality of components, for example, formed by covering a metal core with an outer film of an insulating material. FIG. 5 is a cross-sectional view showing a package structure of a light emitting diode according to a fourth embodiment of the present invention. Only the differences between the fourth embodiment and the second embodiment will be described below. ^ Referring to FIG. 5 'The fourth embodiment according to the present invention is different from the second embodiment according to the present invention in that the insulating carrier 60 according to the fourth embodiment of the present invention does not need to be transparent and a through-hole is formed at an approximately central area. 61. The through hole 61 passes through the insulating carrier 60 and forms a lower opening 62a and an upper opening 62b. It should be noted that, in the present invention, the aperture size of the lower opening 62a is larger than, equal to, or smaller than the aperture size of the upper opening 62b, and is not limited to the example shown in FIG. Like the groove 41 of the second embodiment, two through holes 61 are also formed.

Page 14

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582122 V. Description of invention (9) Stepped part. By a manufacturing method similar to the third embodiment, the substrate 11 of the light-emitting diode 10 is supported by the transparent resin 63a, and then the transparent resin 63b fills the through-hole 61 and covers the wirings 48a and 48b, so that the light-emitting diode 10 The wirings 48a and 48b are sealed in transparent resins 63a and 63b. The insulating carrier 60 is not limited to being formed of a transparent material such as glass, but may also be formed of, for example, ceramic, A1N, SIC, plastic, resin, or printed circuit board, and a combination of the foregoing materials. In addition, the insulating carrier 60 must be composed of a plurality of components, for example, formed by covering a metal core with an outer film of an insulating material. As can be seen from the comparison between Fig. 4 and Fig. 5, since the wirings 48a and 48b can be completely located in the through-hole 61, the package structure of the light emitting diode of the fourth embodiment has a size smaller than that of the third embodiment. FIG. 6 shows a cross-sectional view of a packaging structure of a light emitting diode according to a fifth embodiment of the present invention. In the following, only the fifth embodiment differs from the third embodiment. In the fifth embodiment, the resin used to seal the light emitting diode 10 and the wiring 3 β a and 36 b is composed of a lower resin portion 73 a and an upper resin portion 73 b. The lower resin portion 73 a is formed of a transparent material. Used as a light exit channel. It is preferable to select a material having a high refractive index matching with the substrate 11 to form the lower resin portion 73a, which can reduce the total reflection of light at the interface between the substrate 11 and the lower resin portion 73a. The upper resin portion 73b may be formed of a reflective material or a resin doped with a highly reflective material to reflect light toward the lower resin portion 73a. In addition, in order to further improve the luminous efficiency, a reflective layer (not shown) must be coated on the resin 73b to reflect the light emitting diode 10 generated.

582122 V. The light of the invention description (ίο) faces the lower opening 52a. Furthermore, a refractive lens 74 must be disposed at the opening 52a below the through-hole 51 to control the light emitted from the package structure of the light emitting diode. FIG. 7 shows a cross-sectional view of a packaging structure of a light emitting diode according to a sixth embodiment of the present invention. In the following, only the sixth embodiment is different from the fourth embodiment. In the sixth embodiment, the resin used to seal the light emitting diode 10 and the wirings 48a and 48b is composed of a lower resin portion 83a and an upper resin portion 83b. The lower resin portion 8 3 a is formed of a transparent material and serves as a light emission path. It is preferable to select a material having a high refractive index matching with the substrate 丨 to form the lower resin portion 83a, which can reduce the light at the interface between the substrate u and the lower resin portion 83 & The upper resin portion 83b may be formed of a reflective material or a resin doped with a highly reflective material to reflect light toward the lower resin portion 83a. In addition, a fluorescent material such as a phosphor or a fluorescent layer 84 is doped in the lower resin portion 83a and is applied to the openings * under the through-hole 61. Based on the porosity of the fluorescent substance and the thickness of the coating, the wavelength of the light emitted from the package structure of the two & It is expected that although the present invention has been exemplified by preferred embodiments, it should be understood that the present invention is not limited to the actual disclosure disclosed herein. The present invention is intended to cover the opposite of those skilled in the art, This modification is similar to the configuration. Therefore, the patent application of Fanyuan Erji = Xuan's various interpretations to accommodate all such modifications and similar targets ... The board is based on the insulating bearing seat, groove and most according to the present invention. For example, the opening above the Beton hole and

582122 V. Description of the invention (π) The planar shape of the opening underneath is not limited to a rectangle and may be any shape such as a circle, an oval, or a polygon. 582122 Brief description of the diagram 5. [Simplified description of the diagram] FIG. 1 shows a cross-sectional view of an example of a conventional packaging structure of a light emitting diode; FIG. 2 (e) shows a transparent insulation according to a first embodiment of the present invention Top view of the carrier, FIG. 2 (b) shows a cross-sectional view of the packaging structure of the light-emitting diode according to the first embodiment of the present invention along the line AA ′ in FIG. 2 (a); FIG. 3 (a) Showing a top view of a transparent insulating carrier according to a second embodiment of the present invention,

FIG. 3 (b) shows a cross-sectional view of the packaging structure of the light emitting diode according to the second embodiment of the present invention along the line BB ′ in FIG. 3 (a); FIG. 4 shows a package according to the third embodiment of the present invention. Sectional view of a packaging structure of a light emitting diode; FIG. 5 shows a sectional view of a packaging structure of a light emitting diode according to a fourth embodiment of the present invention; FIG. 6 shows a packaging of a light emitting diode according to a fifth embodiment of the present invention Structural section; and

Fig. 7 is a cross-sectional view showing a packaging structure of a light emitting diode according to a sixth embodiment of the present invention. Symbol and symbol description: 10 Light-emitting diode 11 Substrate 12 First conductive semiconductor layer

Page 18 582122 Brief description of the diagram 13 Second conductive semiconductor layer 14, 15 Electrode 16, 17 Metal solder ball 18 Transparent resin 20 Package base 21, 22 Pad 30, 40 Transparent insulation carrier 31, 41 Groove 32, 42 Bottom surface 33a, 33b Side wall surface 34a, 3 4 b Flat metal layer 35a, 35b Metal pad 3 6 a, 3 6 b Wiring 37, 49 Resin 43a, 43b Lower side wall surface 44a, 44b Intermediate table surface 45a, 45b Upper side wall surface 46a , 46b Flat metal layers 47a, 47b Metal pads 48a, 48b Wiring 50, 60 Insulating bases 51, 61 Through holes 52a Lower opening 52b Upper opening

Page 19 582122 Brief description of drawings 53a, 53b, 63a, 6 3b Transparent resin 62a lower opening 62b upper opening 73a lower resin portion 73b upper resin portion 74 refractive lens 8 3ε lower resin portion 8 3b upper resin portion 84 fluorescent layer

Page 20

Claims (1)

  1. People ^ 921017fi.q, the scope of patent application j Duo Zhengyi The package structure of the first scope of the patent application, the adhesive is used to fix the substrate. Gas; please encapsulation structure of the patent scope item 1, formed by emulsion resin. Wherein, the bottom surface is made of a material which has a high thermal conductivity, as in the case where the resin is made of a ring. h If there is patent application scope No. 1, there is a material with 焉 reflection. Item of the package structure, wherein the resin is added to enhance the heat dissipation property of the package structure, and the resin is added to reflect the light-emitting diode. The packaging structure, wherein the material type of the light emitting diode is aluminum gallium indium phosphide type, aluminum gallium indium nitride type, indium gallium nitride type, broken gallium type, silicon carbide type, or the like. π · If the package structure of the first patent application scope includes a reflective layer 'coated on the resin to reflect the light generated by the light emitting diode, the substrate and one of the two electrodes are emitted.
    12 · A packaging structure for packaging
    582122
    --- Case No. 921017 Car repair on the day of the month 6. Application for a patented photodiode, the package structure includes: a transparent insulating carrier, formed with a groove, the groove has a surface and at least one connected to the bottom surface A stepped part, the at least ~ b ~ bottom has a lower side wall surface, which is connected to the bottom face, an intermediate table, and the stepped part wall face, wherein the bottom face is used to support the substrate, and the two of the grooves are sufficient for the upper part. To fully accommodate the light-emitting diode; at least one flat metal layer is formed on the at least one stepped portion and the upper side wall surface; at least one metal pad is formed on the transparent insulating bearing seat矣, the hyperbola is located on the area outside the groove and is connected to the at least one planar metal layer · at least one wiring for connecting the middle two portions of the at least one planar metal layer to the middle mesa and the two electrodes One of them; and a resin filling the groove, thereby sealing the light emitting diode and the at least one wiring. 1 3 · The package structure according to item 12 of the patent application scope, wherein the transparent insulation carrier is formed of glass. 14. The package structure according to item 12 of the patent application scope, wherein the depth of the groove is less than 10 mm. 15. The package structure according to item 12 of the patent application scope, wherein the groove is formed in an approximately central danger zone of the transparent insulating carrier.
    Page 23 582122 Amendment-Case No. 92101763 6. Scope of patent application 16. The package structure of item 12 in the scope of patent application, where the bottom surface is fixed by a transparent adhesive to fix the substrate. 17. The packaging structure according to item 12 of the patent application scope, wherein the resin is formed of epoxy resin. 18. As claimed, the package structure of item 12 of the patent, wherein the resin is added with a material with high thermal conductivity to enhance the heat dissipation performance of the package structure. 19. As claimed, the packaging structure of item 12 of the patent, wherein a highly reflective material is added to the resin to reflect the light generated by the light emitting diode. 20. The package structure according to item 12 of the application, wherein the material type of the light emitting diode is aluminum gallium indium phosphide, aluminum gallium indium nitride, indium gallium nitride, aluminum gallium arsenide, or Silicon carbide type and so on. 21. The package structure according to item 12 of the scope of patent application, further comprising a reflective layer coated on the resin to reflect the light generated by the light emitting diode. 22. A packaging structure for packaging a light emitting diode having a substrate and one electrode, the packaging structure includes:
    Page 582122
    It is a hard-loading seat, formed with a continuous opening and a hole called a m-hole with a bottom two, wherein the substrate is oriented toward the lower opening, and the ice of the through-hole is sufficient to fully accommodate the light-emitting diode, and _ ΐ ^ The flat, metal layer is formed on the surface of the insulating bearing seat at a position other than the 7 ... Hubei through hole. The Ding Yi plate is connected to the Li: line 1 to connect one of the at least one planar metal layer-layer, To form one of an electrode; and a resin to fill the through hole and cover the at least one planar gold portion to seal the light emitting diode and the at least one wiring. Say
    23. The package structure according to item 22 of the scope of patent application, further comprising: a thin metal pad is formed on the portion of the at least one metal layer that is not covered by the tree moon. 24. The package structure according to item 22 of the scope of patent application, wherein the insulating carrier is formed of glass, ceramic, A1N, SiC, plastic, resin, or printed circuit board, and a combination of the foregoing materials. 25. The package structure according to item 22 of the application, wherein the insulating carrier is formed by covering a metal core with an outer film of an insulating material. Lu 26. The package structure according to item 22 of the patent application scope, wherein the depth of the through hole is less than 10 mm.
    Page 582 122
    The package structure of Item 22 of the second patent is amended, wherein the through hole # is formed in an area about the center of A of the insulating edge bearing seat ^. 2. Pore system 2 "oxygen = package structure of the 22nd item range" ㊣ The resin is added to the resin in 2: package structure of the 22nd range item '*. q guide ..., a material that enhances the heat dissipation of the package structure; the package structure of item 22 of the patent scope, where the resin's median = hair 5 diode and the lower opening Part of it is formed of a material having a high emissivity matching to the substrate to reduce total reflection occurring at the interface between the substrate and the tree. For example, the package structure of the 22nd item of the patent application, wherein the resin is in the middle position; the part between the upper opening and the light-emitting diode is added with a highly reflective material 'to reflect the light-emitting diode. Light. 3 2 · The package structure according to item 22 of the scope of patent application, further comprising a reflective layer 'coated on the resin to reflect the light generated by the light emitting diode. 33. If the package structure in the scope of patent application No. 22 includes a refractive lens
    Page 26 582122 Amendment No. 921017 Anti-patent scope mirror, set at the lower opening of the through-hole 34. For the package structure of the scope of patent application No. 22, it also includes a hair layer 'coated on the through-hole The lower opening of the hole is used to provide light of the desired color. 'Main 35. If the package structure of the 22nd scope of the patent application, # the resin is doped with a glare material in the part between the light-emitting diode and the lower opening' to provide light with a desired color . 36. For example, the package structure of the scope of application for patent No. 22, wherein the material type of the light-emitting diode is aluminum gallium indium phosphide, aluminum gallium indium nitride, indium nitride, aluminum gallium halide, or carbide Silicon type and the like. '' A packaging structure for packaging a light-emitting diode with a substrate and two electrodes, the packaging structure includes an insulating carrier, and a through-hole is formed, the through-hole has a lower upper opening and is connected to the lower opening At least one stepped portion from the upper opening, the at least one stepped portion has a lower side wall surface connected to the lower opening, an intermediate table surface, and an upper side wall surface connected to the upper opening, wherein the substrate faces the Open down Π, and the depth of the through hole is sufficient to fully accommodate the light-emitting diode; ^ at least one planar metal layer is formed on the intermediate mesa and the upper side wall surface of the at least one stepped portion, ·
    Page 27 582122-^^ 92ΐ〇Πβ 3, March 6th, the scope of the patent application for at least one area i other than the metal through-hole, formed in the surface of the insulating bearing seat on the at least one wiring [^: and connected to The at least one planar metal layer; a portion of the intermediate mesa = connected to the resin in the at least one planar metal layer and filled = one of 7 electrodes; and at least one wiring. ^ Beitong holes are used to seal the light-emitting diode and the 38. If the patent application Fanyuan seat is made of glass, ceramic, Ain packaging structure, where the insulating carrier plate, and a, plastic, resin, Or formed by printing e. 39. For example, the base of the scope of the patent application is formed by using an outer cavity of an insulating material and a packaging structure material, wherein the insulating carrier is covered with a metal core. 40. The package structure with a depth of less than 10 mm as in the scope of the patent application, 41, of which 41 of the through hole. The seal structure with the scope of the 37th aspect of the patent application. , Where the through-hole system is in the region of the force center. 42. It is formed by the epoxy resin under item 37 of the scope of patent application. And packaging structure, in which the resin is made of Ref. 43. For example, the packaging structure in item 37 of the patent application scope, in which the resin is added on page 28 582122
    Add a material with high thermal conductivity to increase the heat dissipation of the package structure
    44. If the application for a patent is based on the packaging structure of item 37 at the interface between the light-emitting diode and the high refractive index matching medium, the packaging structure is formed by a part of the material between the lower openings, reflection. 'Wherein the resin's median & has a package structure for reducing the substrate and the tree 45, such as the 37th in the scope of patent application, wherein a portion of the resin between the upper opening and the light emitting diode is added There is a highly reflective material to reflect the light generated by the light emitting diode. 46. If the package structure of the scope of patent application No. 37, further includes a reflective layer, coated on the resin, to reflect the light generated by the light-emitting diode 0 47. If the package of scope of the patent application No. 37 The structure further includes a refractive lens disposed at the lower opening of the through hole. 4 8. The package structure according to item 37 of the scope of patent application, further comprising a fluorescent layer 'coated on the lower opening of the through hole to provide light with a desired color. 4 9 · The package structure according to item 37 of the scope of patent application, wherein the resin is in the middle position
    Page 29 582122 ^ S_92101763
    Scope of patent application ---------
    In this light-emitting diode, $ ^ --- Zou Miao between Xun Xiao and the reading opening will provide a mixed color with the desired color—fluorescent material 50. Such as the cover of the 37th patent application #hibi, The raw Gansu chain structure, wherein the material type of the light emitting diode calendar is aluminum gallium indium phosphide type, aluminum gallium indium nitride type, indium gallium nitride type, aluminum gallium arsenide type, silicon carbide type, or the like.
    Page 30
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115911B2 (en) 2004-10-29 2006-10-03 Lighthouse Technology Co., Ltd LED module and method of packaging the same
US8432089B2 (en) 2010-12-08 2013-04-30 Au Optronics Corp. Light source module and backlight module
US9741699B2 (en) 2012-05-29 2017-08-22 Epistar Corporation Light emitting device

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Publication number Priority date Publication date Assignee Title
TWI398026B (en) * 2010-04-28 2013-06-01 Advanced Optoelectronic Tech Light emitting element and light emitting module having the same
WO2012011363A1 (en) * 2010-07-23 2012-01-26 シャープ株式会社 Light-emitting device and manufacturing method therefor
CN203300693U (en) 2012-05-29 2013-11-20 璨圆光电股份有限公司 Light emitting diode chip capable of multi-direction light extraction and luminescent device thereof
TWI570350B (en) * 2013-08-29 2017-02-11 晶元光電股份有限公司 Illumination device
TWI570352B (en) * 2014-11-28 2017-02-11 宏齊科技股份有限公司 Light emitting diode device and light emitting device using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115911B2 (en) 2004-10-29 2006-10-03 Lighthouse Technology Co., Ltd LED module and method of packaging the same
US8432089B2 (en) 2010-12-08 2013-04-30 Au Optronics Corp. Light source module and backlight module
US9741699B2 (en) 2012-05-29 2017-08-22 Epistar Corporation Light emitting device
US10247395B2 (en) 2012-05-29 2019-04-02 Epistar Corporation Light emitting device

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