TW200414561A - Light emitting diode package structure - Google Patents

Abstract

A light emitting diode package structure includes an insulated carrier base formed with a recess or a through hole. The recess or the through hole has an enough depth for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for completely sealing the light emitting diode and the two wiring lines.

Description

200414561 V. Description of the invention (i) 1. [Technical field to which the invention belongs] The present invention relates to the sealing of a light-emitting diode, and the invention relates to a method that can enhance the light-emitting efficiency of the light-emitting diode. The present invention is particularly simplified. The advantages of the sealing process of the light-emitting diode, the second structure can reduce the production cost. Seeking productivity. 2. [Previous technology] In commercial and industrial applications, light emitting diodes provide a more efficient and lower cost light source for fluorescent lamps. In recent years, various types of cracking structures and methods have been developed, such as surface bonding with k and flip-chip package structures. i-seal Figure 1 shows a side view of one of the packaging structures of an unfamiliar light-emitting diode. Refer to the picture! A light-emitting diode 10 is flip-chip mounted on the package base 20. The light emitting diode 10 has a substrate n-type, one-conducting semiconductor layer 12 formed on the substrate u, and a one-type semiconductor layer 13 formed on the first conductive type semiconductor layer 12 overnight. A predetermined area of one of the semiconductor layers 12 is formed with one = 14, and one predetermined area of one of the second conductive type semiconductor layers 13 is provided. Second electrode i5. The manufacturing methods of the light-emitting diodes 10 are well known, so they will not be repeated here. In the conventional package structure shown in FIG. 1, two metal solder balls i 6 and J 7 are formed on the first electrode 14 and the second electrode 15 of the light emitting diode 10, respectively. Dust = In the manner of flip chip, two metal solder balls 16 and 17 are aligned and bonded to the first pad 21 and the second pad 22 formed on the package base 20, respectively. Page 7 200414561 V. Description of Invention (2)

Then, a transparent resin 18 is used to seal the light-emitting diode 10, M's light-emitting diode package. When the power source is connected to the light-emitting diode 10 through the first pad 21 and ^, the light-emitting diode 2 produced by the light-emitting diode 10 is supplied to the substrate 11 and the transparent resin 18 to be emitted to the outside, as shown in FIG. 1. By ,, > v meeting ,, by factory. The conventional package structure shown by the arrow in Fig. 1 has the following disadvantages. The solder balls 16 and 17 may come into contact with each other and cause the first electrode 14 to be short-circuited with the metal 15. Furthermore, when the light-emitting diode is mounted on the base 20 of the first electrode in a flip-chip manner, it is necessary to ensure that the metal solder ball 16 is placed on the :: pad 21 and the second pad 22, resulting in more manufacturing. In addition, it is expected to provide a package structure with better luminous efficiency than the conventional package shown in FIG. 1. By using the heat generated in 冓 t, the light-emitting diode can be increased in reliability. . 1 mI will use brother's life and can. 3. [Summary of the invention] In view of the foregoing _ 'the purpose of the present invention is to provide structure 1 to simplify the packaging process of light emitting diodes such as productivity and reduce production costs. Further = Ming U — The purpose is to provide a light-emitting diode with the light-emitting efficiency of the pole, in order to reduce the operation by 3 degrees. … ', Thereby increasing the life and reliability of the light emitting diode wmi

I Page 8 200414561 V. Description of the invention (3) According to the present invention, the method includes forming a light-emitting diode-receiving diode that is used to support the light-emitting diode. The surface of at least one seat is centered on a plane metal layer and a resin is filled in the recessed form. A recess is provided outside the recess ′ to provide a transparent substrate. One layer in the area of flat gold and the light-emitting sealed light-emitting diode according to the present invention are used to provide at least one wiring on the intermediate table to connect one of the two electrodes and the at least one wiring according to the present installation structure. The middle body of the surface of the light-emitting two-carrier and at least one of the other states is an intermediate mesa and is connected to at least one plane. One resin 〇 The other is formed under the body through a through hole. Located at least through holes. Like, concave. At least the metal layer of the groove is filled with a concave state, and the opening D of the through hole is not covered by a layer and a plane other than the plane. An encapsulation structure of a light-emitting diode. The bottom surface of the groove is deep enough to form a complete metal layer on the transparent insulating carrier. At least one wiring is connected to at least one of the two electrodes of the polar body. A portion of the surface metal layer has at least one stepped portion through which the groove is formed, and a planar metal layer is formed on at least one metal pad other than the at least one metal pad. To the middle layer and the groove of the light emitting diode, thereby sealing the light emitting diode to provide a deep metal layer forming an insulating carrying through hole on the area. Foremost—the at least one planar gold diode mount. The light-emitting diode is sufficient to complete a transparent insulation support and one wiring connection. One of the two electrodes is a part of the metal layer and one wiring. The through hole has at least one step. At least one planar metal layer is formed in one of the at least one planar metal layer. A resin fills the through-holes and seals the light-emitting diode according to still another aspect of the present invention to provide at least one intermediate

200414561 V. Description of the invention (4) ------- At least one intermediate table and connected to at least one metal J outside the through hole. = One less wiring connects at least one planar metal layer and two of the light emitting diodes, one of which is extremely. A resin fills the through hole, # to seal the light emitting diode and at least one wiring. 4. [Embodiment] The features and advantages of the following embodiments will be described with reference to FIG. 2 (a), which shows a top view of 30, and the packaging structure of the diode is referred to FIG. 2 (a) the seat 30 is at about the center bottom surface 3 2 and 2 side seats 30 are areas 34a and 34b other than the groove 31 made of glass. In addition, the metal layers 34a and 34b are referred to FIG. 2 (b) The substrate 11 of the polar body 10 is the base of the photodiode 10 for the convenience of subsequent processes. The 10 is not limited to the purpose shown in the figure and other preferred embodiments. The light-emitting sectional view of the embodiment of the insulating carrier. The transparent insulating bearing groove 31 has a transparent insulating bearing surface, and a concave planar metal layer is formed on a peripheral area of the planar gold. For example, the light-emitting diodes, which are issued on the bottom surface 32, and the light-emitting diodes, and are given any description and drawings will make the foregoing of the present invention obvious. Fig. 2 (b) shows a detailed explanation according to the present invention compared with the first embodiment according to the present invention. Fig. 2 (b) shows the first construction according to the present invention along the line A-A in Fig. 2 (a). A groove W is formed in the region of the embodiment. Wall surfaces 33a and 33b. For example, formed. In the transparent insulating carrier 30, two metal pads 35a and 35b are formed separately from each other. The two metal pads 35a and 35b are respectively located in the transparent insulating carrier 30. The light emitting diode 10 is placed in the groove 31 and the bottom surface of the groove 31 is formed. Supported by 32. The plate 11 can be fixed by a transparent adhesive. Attention should be paid to the specific material type or structure shown in the present invention

Page 10 200414561

5. Description of the invention (5) Material type or structure. For example, the material type of the 'light emitting diode 10' can be aluminum gallium indium phosphide type, aluminum gallium indium nitride type, indium gallium nitride type, Kunhuan inscription type, or broken silicon type. The configuration of the light emitting diode 10 is a configuration in which two electrodes are on the same side and have a transparent substrate. Furthermore, the light emitting diode 10 must be designed to emit light from the front or the back. In addition, the light emitting diode 10 further includes a reflective layer and a transparent conductive layer. The groove 31 according to the present invention has a sufficient depth so that the light emitting diode 10 can be completely accommodated in the groove 31 and not exposed from the opening of the groove 31. For example, the depth of the groove 31 is less than 10 mm. The wiring 36a is used to connect the first electrode 14 and the planar metal layer 34a, and the wiring 36b is used to connect the second electrode $ plane metal layer 34b. Resin 37 fills the groove 31 and covers the wiring 3 6a and ::: out of the groove 31, so that the light-emitting diode 10 and the wiring are cleaned and 'resin 37 can be added with a highly reflective anti-reflective " ί ΐ: The part of the light generated by the body 1 ° facing the resin 3 7 = the efficiency shown in Fig. 1. In addition, the luminous efficiency is further improved. The reflective layer (not shown) must be coated on the resin 37 to produce the hand body 10 The light is directed to the bottom surface 32. 乂 Reflects the first diode. When the power source passes through the protruding metal | 10, the light emitting diode 10 is supplied to the light emitting diode edge carrier 30 and is emitted to the substrate ','. The wire will pass through the substrate 11 and transparent than the conventional package structure shown in Figure 1. According to the arrow in the middle, the package structure can be compared with the light-emitting diode invented by Yu Wei. Packaging process is completed, no need to use precision

Page 11 200414561 V. Description of the invention (6) Alignment technology to improve productivity and reduce production costs. Fig. 3 (a) shows a top view of the first-⑼ Mo 依据 according to the present invention, and 嶋) =; transparent: = bearing; seat two, the package structure is along Fig. 3 (a): two = = only the first case The embodiment is different from the first embodiment. Β μΪ According to r (a) and 3 (b), the second embodiment according to the present invention is different from that according to 2 :; Two stepped portions are formed in the solid groove 41. Specifically, the lower side wall surface, the middle mesa surface 44a, and the upper side wall surface 45a constitute a stepped portion, while the lower side wall surface 43b, the middle side surface 44b, and the upper side wall surface 45b are It constitutes another stepped portion. In addition, a 'planar metal layer 46a is formed on the intermediate mesa 44a and the upper side wall surface ..., and a planar metal layer 46b is formed on the intermediate mesa 44b and the upper side wall surface 45b. The surface of the transparent insulating carrier 30 In the area other than the groove, two metal pads 47a and 47b are formed separately from each other. The metal pad 47a is connected to the planar metal layer 46a, and the metal pad 47b is connected to the planar metal layer 46b. The light-emitting diode 10 is placed in the groove 41 so that the substrate 11 of the light-emitting diode is supported by the bottom surface 42 of the groove 41 The wiring 48a is used to connect the portion of the first electrode 14 and the planar metal layer 46a on the intermediate mesa 44a, and the wiring 48b is used to connect the portion of the second electrode 15 and the planar metal layer 46b on the intermediate mesa 44b. This design of the groove 41 with two stepped portions' wirings 4 8 a and 4 8 b can be completely contained in the grooves 41. Finally, the resin 4 9 fills the grooves 41 and covers the wirings 4 8 a and 4 8 b, so that the light-emitting diode 10 and the wiring 48a and 48b are sealed in the resin 49. For example, the resin 49 may be formed of epoxy on page 12 200414561 V. Description of the invention (7) resin. Adding a material with high thermal conductivity to enhance the heat dissipation performance of the package structure. Also, a material with high reflectivity can be added to the resin 4 9 to make the light generated by the light emitting diode 1 Q toward the resin 4 g It is reflected to improve the luminous efficiency. In addition, in order to further improve the luminous efficiency, a reflective layer (not shown) must be coated on the resin 49 to reflect the light generated by the light emitting diode 1 〇 toward the bottom surface 4 2. The comparison between Figure 2 (b) and Figure 3 (b) shows that, because The wires 48a and 48b can all be located in the groove 41, so the package structure of the light emitting diode of the second embodiment has a size smaller than that of the first embodiment. Fig. 4 shows a light emitting diode according to a third embodiment of the present invention. A cross-sectional view of the package structure. Only the third embodiment is different from the first embodiment in the following. Referring to FIG. 4 ′, the third embodiment according to the present invention is different from the first embodiment according to the present invention in that the third embodiment is different from the first embodiment. The insulating carrier of the three embodiments does not need to be transparent and a through hole 51 is formed at an approximately central region. The through hole 51 passes through the insulating bearing base 50 to form a lower opening 52a and an upper opening 52b. It should be noted that in the present invention, the aperture size of the lower opening 52 & The example shown in Figure 4. When the lower opening 52a is sealed, the transparent resin 53a is injected into the through-hole 51 from the upper opening 52b, so that the through-hole 51 is only partially filled. Then, the light emitting diode 10 is placed in the through hole 51 through the upper opening 52b, so that the substrate of the light diode 10 is supported by the transparent resin 53a. After the transparent resin 53a is hardened by the baking process, the light-emitting diode 10 is fixed.

200414561

On the transparent resin 53a in the through hole 51. Finally, the wiring connection process is performed so that the transparent resin 53b fills the through-hole 51 and covers the portion of the wiring 36a and 36b that exposes the through-hole 51, so that the light-emitting diode 10 and the wiring 36a and 36b are sealed in the transparent resin 53a and 53b. Inside. When the power is supplied to the light emitting diode 10 through the protruding metal pads 35a and 3 5b, the light generated by the 'light emitting diode 10' will be emitted to the outside through the substrate and the transparent resin 53a, as shown in FIG. 4 It is indicated by the arrow. Since light does not need to be emitted to the outside through the insulating bearing base 50, the insulating bearing base 50 according to the third embodiment of the present invention is not limited to being formed of a transparent material such as glass, but may also be made of, for example, ceramics, A1 N, S i C, plastic, resin, or printed circuit board, and a combination of the foregoing materials. In addition, the insulating carrier 50 may also be composed of a plurality of components, such as by using an outer film of an insulating material It is formed by covering a metal core. FIG. 5 shows a cross-sectional view of a packaging structure of a light emitting diode according to a fourth embodiment of the present invention. Only the fourth embodiment is different from the second embodiment with reference to FIG. 5. 'The fourth embodiment according to the present invention is different from the second embodiment according to the present invention in that the insulating carrier 60 according to the fourth embodiment of the present invention does not need to be transparent and formed at an approximately central area. Through-hole 61. The through-hole 61 passes through the insulating carrier 60 to form a lower opening 62a and an upper opening 62b. It should be noted that in the present invention, the aperture size of the lower opening 62a is greater than, equal to, or smaller than the aperture of the upper opening 62b. The size is not limited to the example shown in FIG. 5. Like the groove 41 of the second embodiment, two through holes 61 are also formed.

200414561 V. Description of invention (9) Stepped part. By a manufacturing method similar to the third embodiment, the substrate 1 1 of the light emitting diode 10 is supported by a transparent resin 6 3a, and then the transparent resin 6 3b fills the through-hole 6 1 and covers the wiring 4 8 a and 4 8 b, so that the light emitting diodes 10 and the wirings 48 a and 48 b are sealed in the transparent resins 638 and 63 b. The insulating carrier 60 is not limited to being formed of a transparent material such as glass, but may be formed of, for example, ceramic, A 1 N, Si C, plastic, resin, or printed circuit board, and a combination of the foregoing materials. In addition, the insulating bearing seat 60 may also be composed of a plurality of components, for example, formed by covering a metal core with an outer film of an insulating material. * As can be seen from the comparison between FIG. 4 and FIG. 5, because the wirings 4 8 a and 4 8 b can be completely located in the through-hole 61, the packaging of the light emitting diode of the fourth embodiment has a size smaller than that of the third embodiment. . FIG. 6 is a cross-sectional view showing a package structure of a light emitting diode according to a fifth embodiment of the present invention. Only the fifth embodiment is described below, which is different from the third embodiment. In the fifth embodiment, the resin used to seal the light-emitting diode 10 and the wiring 36 is made of a lower resin portion 73a and an upper resin portion 73b. . The bottom part 73a is formed of a transparent material. For light emission, it is better to choose a material with a high refractive index matching to the substrate. 3: m73a, which can reduce the light on the substrate 11 and the lower resin. Inter-ministry total reflection. The upper resin portion 73b may be formed of a reflective material or a resin having a reflective material. : Fat section 73a. In addition, in order to further improve the luminous efficiency, the reflection moon :: picture) must be coated on the tree moon H, and the light emitting diode 10 produced by 卩 reflects ^

200414561 V. Description of the invention (10) The light is directed to the lower opening 52a. Furthermore, a refractive lens 74 must be disposed at the opening 52a below the through-hole 51 to control the light emitted from the package structure of the light emitting diode. FIG. 7 shows a cross-sectional view of a packaging structure of a light emitting diode according to a sixth embodiment of the present invention. In the following, only the sixth embodiment is different from the fourth embodiment. In the sixth embodiment, the resin used to seal the light emitting diode 10 and the wiring 48a is composed of a lower resin portion 83a and an upper resin portion 83b. The lower resin portion 83a is formed of a transparent material and serves as a light emission path. It is preferable to select a material having a high refractive index matching with the substrate u to form the lower resin portion 83a, which can reduce total reflection of light at the interface between the substrate 丨 and the lower resin portion 83a. The upper resin portion 83b may be formed of a reflective material or a resin doped with a highly reflective material to reflect light toward the lower tree portion 83a. In addition, a fluorescent material such as a phosphor or a fluorescent layer 84 is doped in the lower resin portion 83a to be applied to the opening 62 below the through hole 61. Based on the porosity and coating thickness of the fluorescent substance, the wavelength of the light emitted from the light emitting package structure is changed to provide light of a desired color. Although the present invention has been made by a better reader, the present invention is not limited to this. The present invention is intended to cover modifications and similar configurations that are familiar to those skilled in the art. Therefore, the extensive explanation is based on the embodiment of the insulating bearing seat and the concave housing that accommodates all such repairs according to the present invention as an example, and the disclosed embodiments. Conversely, the scope of the range of benefits that is obvious to the skilled person should be based on changes and similar configurations. For example, two grooves and two through holes are formed on the through hole.

200414561 V. Description of the invention (11) The planar shape of the lower opening is not limited to a rectangle, but may be any shape such as a circle, a sugar circle, or a polygon. 200414561 Brief description of the diagram 5. [Simplified description of the diagram] Section 1 of an example of the package structure of a polar body 1 shows a conventional two-sided light-emitting diagram; FIG. 2 (a) shows a top view of the moon according to the present invention; Transparent insulation carrier of the first embodiment FIG. 2 (b) shows a cross-sectional view of a light emitting diode according to the first embodiment of the present invention, taken along line a—a, in FIG. 2 (a); FIG. 3 (a) a top view showing a transparent insulating carrier according to a second embodiment of the present invention;

FIG. 3 (b) shows a cross-sectional view of the packaging structure of the light emitting diode according to the second embodiment of the present invention along the line BB ′ in FIG. 3 (a); FIG. 4 shows the light emitting diode according to the third embodiment of the present invention Cross-sectional view of a package structure of a polar body; FIG. 5 shows a cross-sectional view of a package structure of a light-emitting diode according to a fourth embodiment of the present invention; FIG. 6 shows a package structure of a light-emitting diode according to a fifth embodiment of the present invention Sectional view;

FIG. 7 shows a cross-sectional view of a packaging structure of a light emitting diode according to a sixth embodiment of the present invention. Description of component symbols: 10 light-emitting diode 11 substrate 12 first conductive semiconductor layer

Page 18 200414561 Brief description of the drawing 13 Second conductive semiconductor 14, 15 Electrode 16, 17 Metal ball 18 Transparent resin 20 Package base 21, 22 Pad 30, 40 Transparent insulation carrying 31, 41 Groove 32, 42 Bottom surface 3 3a, 33b side wall surfaces 34a, 34b flat metal layers 35a, 35b metal pads 3 6a, 36b wiring 37, 49 resin 43a, 43b lower side wall surfaces 44a, 44b middle mesa 4 5a, 45b upper side wall surfaces 4 6a, 46b flat metal layers 47a, 47b Metal 塾 48a, 48b Wiring 50, 60 Insulating carrier 51, 61 Through hole 52a Lower opening 52b Upper opening

Page 19

200414561 Brief description of drawings 53a, 53b, 63a, 63b Transparent resin 62a lower opening 62b upper opening 73a lower resin section 73b upper resin section 7 4 refractive lens 83a lower resin section 83b upper resin section 84 fluorescent layer

I Page 20

Claims (1)

ZUU4i4:) () l 6. Patent application scope Transparent insulation support base with open earth, ancient ηπ Μ — surface, 1 in the linen product is formed with a groove, the groove has a bottom ', used on 12 sides To support the substrate, and the depth of the groove is sufficient to fully accommodate the light-emitting diode; at least one planar metal layer is formed on the surface of the transparent insulating carrier on the area outside the groove, and at least one wiring For connecting one of the at least one planar metal layer and one of the two electrodes; and a resin filling the groove and covering a part of the at least one planar metal layer, thereby sealing the light emitting diode and the At least one wiring. 2. The package structure according to item 1 of the scope of patent application, further comprising: at least one metal pad formed on a portion of the at least one planar metal layer that is not covered by the resin. 3. The package structure according to item 1 of the patent application scope, wherein the transparent insulating carrier is made of glass. 4. For the package structure according to item 1 of the patent application scope, wherein the depth of the groove is less than 10 mm. Page 21 1 If the scope of patent application is the first! The package structure of the item, wherein the groove is formed in an approximately central region of the transparent insulating carrier. 200414561 6. Scope of patent application 6 · The package structure of the first scope of patent application, wherein the bottom surface is fixed by a transparent adhesive. 7. The package structure according to item 1 of the patent application scope, wherein the resin is formed of an epoxy resin. 8. The packaging structure of item 1 in the scope of the patent application, wherein the resin is added with a material having high thermal conductivity to enhance the heat dissipation performance of the packaging structure. 9. The packaging structure according to item 1 of the scope of patent application, wherein a highly reflective material is added to the resin to reflect light generated by the light emitting diode. W · The package structure of item 1 of the scope of patent application, wherein the material type of the light emitting diode is aluminum gallium indium phosphide, aluminum gallium indium nitride, indium gallium nitride, aluminum gallium arsenide, or Silicon carbide type and so on. For example, the package structure of the scope of application for patent item i includes a reflection, that is, coated on the resin to reflect the light generated by the light-emitting diode 1 2 · A package structure is used to package a substrate with a substrate and One of the two electrodes Page 22 200414561 VI. Patent application scope Photodiode, the transparent insulation surface is connected to the wall surface with the lower side wall, which is sufficient to completely accommodate at least one flat table and the upper at least one gold outside the groove at least One part of the middle table is provided with one resin, and one less wiring. # 装 结构 包 边 套 座 ， At least the bottom surface is connected to the bottom surface to receive the light-emitting two-sided metal layer, and the side wall surface is a pad, and the area is formed by a line to connect the two electrical filling The full groove includes: a recessed stepped portion of the bottom surface, a substrate pole supporting the substrate; formed on the as far as the transparent insulator and connected to one of the at least one pole, thereby sealing the groove, the groove is provided with / At least -44 middle mesa, and 'depth; ^ At least one flat metal layer on the surface of the middle edge bearing seat of at least one stepped portion. The planar metal layer is located in the; and the light-emitting diode and the transparent insulation and the groove of the package structure as in Item 12 of the patent application, wherein the carrier is formed of glass. 14. The package structure according to item 12 of the patent application scope, wherein the depth is less than 10 nun.威 ί: —shape Page 23 200414561 The surface is based on the bottom 6. The scope of patent application 16. The packaging structure of item 12 of the patent scope is fixed by a transparent adhesive. 17 · The package structure according to item 12 of the patent application scope, wherein the epoxy resin is formed. & The purpose of the month is as follows: • If the package structure of the patent application No. 12 range, where the resin, '^ has a material with high thermal conductivity to enhance the package structure's heat = 2 The packaging structure of item 12, wherein Z is added to the resin with a highly reflective material to reflect the light of the light-emitting body.玍 2 • If the package structure of item 12 of the patent application scope, the material type of the light emitting diode is aluminum gallium phosphide type, aluminum gallium indium type, indium gallium nitride, aluminum gallium arsenide type, Or silicon carbide type and so on. The shaving structure, such as the 12th item in the scope of the patent application, further includes a reflective coating on the resin to reflect the light generated by the light-emitting diode. _ A kind of packaging structure for packaging a substrate With one electrode body of the two electrodes, the package structure contains ... 200414561 6. Scope of patent application The edge bearing IK has a through hole, the through hole has a top opening, where the substrate is facing the lower opening, and the depth of the hole is sufficient to fully accommodate the light emitting diode; the shell The at least one planar metal layer is formed through the insulation outside the through-hole, and the surface of π-tightness is at least-wiring, so as to connect one of the at least one planar metal layer and one of the far electrodes. And Shuyue Yue fills up the through hole and covers a part of the at least one planar metal layer, thereby sealing the light emitting diode and the at least one wiring. 23. If the package structure of the 22nd scope of the patent application, it further includes : At least one metal 塾 Λ is formed on the part of the at least one metal layer that is not covered by the resin. 24. The package structure according to item 22 of the patent application scope, wherein the insulating carrier is made of glass, ceramic, AIN , SiC, plastic, resin, or printed circuit board, and a combination of the foregoing materials. 25 'The package structure according to item 22 of the application, wherein the insulating carrier is formed by covering a metal core with an outer film of an insulating material. 26. The package structure according to item 22 of the patent application scope, wherein the depth of the through hole is less than 10 mm. Page 25 ZUU414 :) 丄 、 6. Scope of Patent Application 28. For example, the seal, earth, and Ganshan station of the 22nd scope of patent application are formed by epoxy resin. Weep " The resin is publicly available = encapsulation structure of item 22 in item 1 The resin can be added with a thermal property of 有 'to enhance the heat dissipation of the package structure 3: the range The envelope structure of item 22, wherein the resin's median heart rate i if, ί the lower opening σ is formed by a material having a grease for the substrate, which is used to reduce the substrate and the tree. Total reflections that occur at the interface. The package structure of item 22 of the patent, wherein a part between the resin's median 2-pole sweat mouth and the light emitting diode is added with a highly reflective material to reflect the light generated by the light emitting diode. . 3 2 · If the seal structure of item 2 of the scope of patent application, it also includes a reflection I coated on the lime tree to reflect the light green produced by the light-emitting diode. Package structure of 22 items, including a refractive lens Page 26 200414561 6. Scope of patent application The mirror is set at the lower opening of the through hole. It also contains a glorious light to provide the desired color. 34. The packaging structure layer ′ such as item 22 of the scope of patent application is applied to the lower opening of the through hole, with a light of color. M. The package structure according to item 22 of the scope of patent application, wherein a portion of the resin between the light emitting diode and the lower opening is doped with a fluorescent material to provide light having a desired color. 36. The package structure according to item 22 of the application, wherein the material type of the light-emitting diode is aluminum gallium indium phosphide, aluminum gallium indium nitride, indium nitride, gallium type, or Carbonized fossils and the like. 37 · A packaging structure for packaging a light-emitting diode having a substrate and two electrodes, the packaging structure includes: an insulating carrier 'is formed with a through hole, the through hole has a lower opening, an upper opening, and a connection At least one stepped portion between the lower opening and the upper opening, the at least one stepped portion has a lower side wall surface connected to the lower opening, an intermediate table surface, and an upper side wall surface connected to the upper opening, wherein the substrate is Towards the lower opening 'and the depth of the through hole is sufficient to fully accommodate the light emitting diode; at least one planar metal layer is formed on the intermediate mesa and the upper sidewall of the at least one stepped portion, 2UU414561 6. The scope of application for patent penetration = formed on the surface of the insulating mounting seat is located in the mi ί: "connected to the at least-plane metal layer. The eighth Hr of the middle table is located in the at least-plane metal layer. The gap between the Y-shaped hawthorn surface and one of the two electrodes, and at least one wiring I ;: Fill the through hole 'to seal the light-emitting diode and the 38. As in the 37th scope of the patent application |椹 、 生 ^ _ Block is made of glass, pottery, A1N, Sic 2 'where the insulation bearing, 2 wins, trees' moon purpose, or insignia, 1 thunder board, and a combination of other materials 3: The seal structure of item 37 of the transmission range, in which the insulating bearing seat is formed by covering the metal core with an outer film of an insulating material. The depth is less than 10 mm. / 、 Mesquite through-hole 41. If the seal in the scope of the patent application No. 37 is formed in the approximately central dagger of the insulating bearing seat ... The through-hole system 42. If the scope of the patent application is 37 Xiang Zhifeng was built from the ground, and it was formed thanks to Ht. Zongshan epoxy resin. H, in which the fat is made of the packaging structure of item 37 in the patent scope of Tim. 200414561 6. Scope of patent application = There is a material with high thermal conductivity _ to enhance the heat dissipation of the package structure H · Xi Yan! In the seal structure of item 37, the part between the resin mid-diode and the lower opening is formed of a material having two refractive index matching degrees for the substrate ′ to reduce Total reflection occurs at the interface between the substrate and the resin. 45. The package structure according to item 37 of the scope of the patent application, wherein a part of the resin between the upper opening and the 30H light emitting monopole is added with a highly reflective material to reflect the light emitting diode body. Generated light. 46. If the package structure of the scope of patent application No. 37, further includes a reflective layer, coated on the resin, to reflect the light generated by the light-emitting diode 0 47 The Feng Pei structure further includes a refractive lens disposed at the lower opening of the through hole. 48. The package structure according to item 37 of the patent application scope further includes a fluorescent layer, which is applied to the lower opening of the through hole to provide light with a desired color. Bit 49 · The package structure according to item 37 of the patent application scope, wherein the resin Page 29 200414561 6. Scope of patent application = The part between the light-emitting diode and the lower opening is doped 'to provide light with a desired color. Baifei Xianmao 50. For example, the package structure of the 37th in the scope of patent application, where the type of: material type is aluminum gallium indium type, aluminum gallium indium type, aluminum: gallium, aluminum gallium arsenide Type, or silicon carbide type. Page 30