CN103119082A - 包括具有由立体有择多环2,3-二醇单体衍生的重复单元的聚碳酸酯的牺牲聚合物组合物 - Google Patents

包括具有由立体有择多环2,3-二醇单体衍生的重复单元的聚碳酸酯的牺牲聚合物组合物 Download PDF

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Publication number
CN103119082A
CN103119082A CN2011800459816A CN201180045981A CN103119082A CN 103119082 A CN103119082 A CN 103119082A CN 2011800459816 A CN2011800459816 A CN 2011800459816A CN 201180045981 A CN201180045981 A CN 201180045981A CN 103119082 A CN103119082 A CN 103119082A
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China
Prior art keywords
polymeric compositions
sacrificial polymeric
polymer
alkyl
sacrificial
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Pending
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CN2011800459816A
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English (en)
Chinese (zh)
Inventor
A·拜尔
R·A·希克
L·兰斯朵夫
K·塞托
W·C·P·桑
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Promerus LLC
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Promerus LLC
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Publication of CN103119082A publication Critical patent/CN103119082A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/02—Aliphatic polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/02—Aliphatic polycarbonates
    • C08G64/0208—Aliphatic polycarbonates saturated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0033—Additives activating the degradation of the macromolecular compound

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Polyethers (AREA)
CN2011800459816A 2010-08-06 2011-08-05 包括具有由立体有择多环2,3-二醇单体衍生的重复单元的聚碳酸酯的牺牲聚合物组合物 Pending CN103119082A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37121110P 2010-08-06 2010-08-06
US37148910P 2010-08-06 2010-08-06
US61/371,211 2010-08-06
US61/371,489 2010-08-06
PCT/US2011/046729 WO2012019091A1 (en) 2010-08-06 2011-08-05 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers

Publications (1)

Publication Number Publication Date
CN103119082A true CN103119082A (zh) 2013-05-22

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN2011800459816A Pending CN103119082A (zh) 2010-08-06 2011-08-05 包括具有由立体有择多环2,3-二醇单体衍生的重复单元的聚碳酸酯的牺牲聚合物组合物
CN201180045991.XA Expired - Fee Related CN103154081B (zh) 2010-08-06 2011-08-05 用于微电子组装件的聚合物组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201180045991.XA Expired - Fee Related CN103154081B (zh) 2010-08-06 2011-08-05 用于微电子组装件的聚合物组合物

Country Status (6)

Country Link
US (4) US8575248B2 (enExample)
EP (2) EP2601239A1 (enExample)
JP (2) JP5837069B2 (enExample)
KR (2) KR101650893B1 (enExample)
CN (2) CN103119082A (enExample)
WO (2) WO2012019091A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN111848933A (zh) * 2020-06-28 2020-10-30 吴君宇 一种可降解共聚酯的制备方法

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JP5837069B2 (ja) 2010-08-06 2015-12-24 プロメラス， エルエルシー 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物
US8535454B2 (en) * 2010-11-23 2013-09-17 Promerus, Llc Polymer composition for microelectronic assembly
WO2014007231A1 (ja) * 2012-07-04 2014-01-09 株式会社カネカ ポジ型感光性組成物、薄膜トランジスタ及び化合物
US9505948B2 (en) * 2012-12-17 2016-11-29 Promerus, Llc Thermally decomposable polymer compositions for forming microelectronic assemblies
TW201446876A (zh) * 2013-02-28 2014-12-16 Promerus Llc 具有聚環官能側基之高玻璃轉換溫度之光可成像聚碳酸酯類聚合物
JP6612533B2 (ja) * 2015-06-12 2019-11-27 三菱瓦斯化学株式会社 反応現像画像形成法、反応現像画像形成法に用いられる感光性樹脂組成物、および反応現像画像形成方法により製造された基板ならびに構造物
JP6807226B2 (ja) * 2016-12-09 2021-01-06 東京応化工業株式会社 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びｃｍｏｓイメージセンサ
KR101880151B1 (ko) * 2017-07-12 2018-07-20 주식회사 삼양사 폴리노보넨-폴리카보네이트 공중합체 및 그 제조방법
CN114161031A (zh) * 2021-12-30 2022-03-11 广东芯聚能半导体有限公司 助焊剂、助焊膜、预制焊片及其应用
JP2023135288A (ja) * 2022-03-15 2023-09-28 旭化成株式会社 メチレン鎖を含む脂環式ポリカーボネート樹脂
JPWO2024042951A1 (enExample) * 2022-08-23 2024-02-29
JP2023052255A (ja) * 2022-08-23 2023-04-11 サンアプロ株式会社 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物
WO2025203788A1 (ja) * 2024-03-26 2025-10-02 リンテック株式会社 分解性フィルムの使用方法およびレジストパターンの作製方法
JP7745814B1 (ja) * 2024-03-26 2025-09-29 リンテック株式会社 分解性フィルムの使用方法およびレジストパターンの作製方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111848933A (zh) * 2020-06-28 2020-10-30 吴君宇 一种可降解共聚酯的制备方法
CN111848933B (zh) * 2020-06-28 2022-08-23 吴君宇 一种可降解共聚酯的制备方法

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Publication number Publication date
EP2601238A1 (en) 2013-06-12
KR20130139234A (ko) 2013-12-20
WO2012019091A1 (en) 2012-02-09
JP5837069B2 (ja) 2015-12-24
JP2013540837A (ja) 2013-11-07
US8729166B2 (en) 2014-05-20
US20120031556A1 (en) 2012-02-09
CN103154081A (zh) 2013-06-12
JP5704495B2 (ja) 2015-04-22
US20140024750A1 (en) 2014-01-23
WO2012019092A1 (en) 2012-02-09
KR20130138192A (ko) 2013-12-18
EP2601238B1 (en) 2015-10-07
US20140024799A1 (en) 2014-01-23
KR101650893B1 (ko) 2016-08-25
JP2013535562A (ja) 2013-09-12
CN103154081B (zh) 2015-11-25
US8729215B2 (en) 2014-05-20
EP2601239A1 (en) 2013-06-12
KR101729065B1 (ko) 2017-04-21
US20120034387A1 (en) 2012-02-09
US8575297B2 (en) 2013-11-05
US8575248B2 (en) 2013-11-05

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Application publication date: 20130522