JP5837069B2 - 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 - Google Patents
立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 Download PDFInfo
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- JP5837069B2 JP5837069B2 JP2013524128A JP2013524128A JP5837069B2 JP 5837069 B2 JP5837069 B2 JP 5837069B2 JP 2013524128 A JP2013524128 A JP 2013524128A JP 2013524128 A JP2013524128 A JP 2013524128A JP 5837069 B2 JP5837069 B2 JP 5837069B2
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- 239000000178 monomer Substances 0.000 title claims description 98
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- 238000000034 method Methods 0.000 claims description 44
- 229910052739 hydrogen Inorganic materials 0.000 claims description 32
- 239000001257 hydrogen Substances 0.000 claims description 32
- 150000002009 diols Chemical class 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 22
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- 125000000592 heterocycloalkyl group Chemical group 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
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- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 8
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- ZMOJTPABCOWEOS-UHFFFAOYSA-N tris(4-tert-butylphenyl)sulfanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC(=CC=1)C(C)(C)C)C1=CC=C(C(C)(C)C)C=C1 ZMOJTPABCOWEOS-UHFFFAOYSA-N 0.000 claims description 3
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- HFKJQIJFRMRSKM-UHFFFAOYSA-N [3,5-bis(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 HFKJQIJFRMRSKM-UHFFFAOYSA-N 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims description 2
- UQWLFOMXECTXNQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane Chemical compound FC(F)(F)S(=O)(=O)[C-](S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F UQWLFOMXECTXNQ-UHFFFAOYSA-N 0.000 claims description 2
- LBYUWLDBALFUSJ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane;triphenylsulfanium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.FC(F)(F)S(=O)(=O)[C-](S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F LBYUWLDBALFUSJ-UHFFFAOYSA-N 0.000 claims description 2
- ZOBIQZZKCFPQAR-UHFFFAOYSA-N dimethyl-(2-oxo-2-phenanthren-2-ylethyl)sulfanium Chemical compound C1=CC=C2C3=CC=C(C(=O)C[S+](C)C)C=C3C=CC2=C1 ZOBIQZZKCFPQAR-UHFFFAOYSA-N 0.000 claims description 2
- ACCDBHBOYZJSDT-UHFFFAOYSA-N n-(4-bromophenyl)-2-fluoroacetamide Chemical compound FCC(=O)NC1=CC=C(Br)C=C1 ACCDBHBOYZJSDT-UHFFFAOYSA-N 0.000 claims description 2
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 claims description 2
- IWBWUYDWYFYWIO-UHFFFAOYSA-N triphenacylsulfanium Chemical compound C=1C=CC=CC=1C(=O)C[S+](CC(=O)C=1C=CC=CC=1)CC(=O)C1=CC=CC=C1 IWBWUYDWYFYWIO-UHFFFAOYSA-N 0.000 claims description 2
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 claims 3
- WOAGDWWRYOZHDS-UHFFFAOYSA-N 4,4,5,5,6,6-hexafluoro-1,3,2-dithiazinane 1,1,3,3-tetraoxide Chemical compound FC1(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C1(F)F WOAGDWWRYOZHDS-UHFFFAOYSA-N 0.000 claims 1
- RDVQQLFCDHSWJY-UHFFFAOYSA-N 4,4,5,5,6,6-hexafluoro-1,3,2-dithiazinane 1,1,3,3-tetraoxide;triphenylsulfanium Chemical compound FC1(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C1(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 RDVQQLFCDHSWJY-UHFFFAOYSA-N 0.000 claims 1
- ZOBVJNCEEVORQV-UHFFFAOYSA-N bis[2-(4-methoxyphenyl)-2-oxoethyl]-methylsulfanium Chemical compound C1=CC(OC)=CC=C1C(=O)C[S+](C)CC(=O)C1=CC=C(OC)C=C1 ZOBVJNCEEVORQV-UHFFFAOYSA-N 0.000 claims 1
- DCANOBZVYGAUDP-UHFFFAOYSA-N spiro[1,3-dioxane-5,3'-bicyclo[2.2.1]heptane]-2-one Chemical compound C1OC(=O)OCC11C(C2)CCC2C1 DCANOBZVYGAUDP-UHFFFAOYSA-N 0.000 claims 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- VRQDPNKOUPEWOC-UHFFFAOYSA-N spiro[bicyclo[2.2.2]octane-3,3'-piperidine] Chemical compound C1CCNCC21C(CC1)CCC1C2 VRQDPNKOUPEWOC-UHFFFAOYSA-N 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000005063 tetradecenyl group Chemical group C(=CCCCCCCCCCCCC)* 0.000 description 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 125000005040 tridecenyl group Chemical group C(=CCCCCCCCCCCC)* 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/02—Aliphatic polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/02—Aliphatic polycarbonates
- C08G64/0208—Aliphatic polycarbonates saturated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0033—Additives activating the degradation of the macromolecular compound
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyesters Or Polycarbonates (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Polyethers (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37121110P | 2010-08-06 | 2010-08-06 | |
| US37148910P | 2010-08-06 | 2010-08-06 | |
| US61/371,211 | 2010-08-06 | ||
| US61/371,489 | 2010-08-06 | ||
| PCT/US2011/046729 WO2012019091A1 (en) | 2010-08-06 | 2011-08-05 | Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013535562A JP2013535562A (ja) | 2013-09-12 |
| JP2013535562A5 JP2013535562A5 (enExample) | 2014-04-24 |
| JP5837069B2 true JP5837069B2 (ja) | 2015-12-24 |
Family
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|---|---|---|---|
| JP2013524128A Expired - Fee Related JP5837069B2 (ja) | 2010-08-06 | 2011-08-05 | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
| JP2013524129A Expired - Fee Related JP5704495B2 (ja) | 2010-08-06 | 2011-08-05 | マイクロエレクトロニクス組立用のポリマー組成物 |
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| JP2013524129A Expired - Fee Related JP5704495B2 (ja) | 2010-08-06 | 2011-08-05 | マイクロエレクトロニクス組立用のポリマー組成物 |
Country Status (6)
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| US (4) | US8575248B2 (enExample) |
| EP (2) | EP2601239A1 (enExample) |
| JP (2) | JP5837069B2 (enExample) |
| KR (2) | KR101650893B1 (enExample) |
| CN (2) | CN103119082A (enExample) |
| WO (2) | WO2012019091A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5837069B2 (ja) | 2010-08-06 | 2015-12-24 | プロメラス， エルエルシー | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
| US8535454B2 (en) * | 2010-11-23 | 2013-09-17 | Promerus, Llc | Polymer composition for microelectronic assembly |
| WO2014007231A1 (ja) * | 2012-07-04 | 2014-01-09 | 株式会社カネカ | ポジ型感光性組成物、薄膜トランジスタ及び化合物 |
| US9505948B2 (en) * | 2012-12-17 | 2016-11-29 | Promerus, Llc | Thermally decomposable polymer compositions for forming microelectronic assemblies |
| TW201446876A (zh) * | 2013-02-28 | 2014-12-16 | Promerus Llc | 具有聚環官能側基之高玻璃轉換溫度之光可成像聚碳酸酯類聚合物 |
| JP6612533B2 (ja) * | 2015-06-12 | 2019-11-27 | 三菱瓦斯化学株式会社 | 反応現像画像形成法、反応現像画像形成法に用いられる感光性樹脂組成物、および反応現像画像形成方法により製造された基板ならびに構造物 |
| JP6807226B2 (ja) * | 2016-12-09 | 2021-01-06 | 東京応化工業株式会社 | 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びｃｍｏｓイメージセンサ |
| KR101880151B1 (ko) * | 2017-07-12 | 2018-07-20 | 주식회사 삼양사 | 폴리노보넨-폴리카보네이트 공중합체 및 그 제조방법 |
| CN111848933B (zh) * | 2020-06-28 | 2022-08-23 | 吴君宇 | 一种可降解共聚酯的制备方法 |
| CN114161031A (zh) * | 2021-12-30 | 2022-03-11 | 广东芯聚能半导体有限公司 | 助焊剂、助焊膜、预制焊片及其应用 |
| JP2023135288A (ja) * | 2022-03-15 | 2023-09-28 | 旭化成株式会社 | メチレン鎖を含む脂環式ポリカーボネート樹脂 |
| JPWO2024042951A1 (enExample) * | 2022-08-23 | 2024-02-29 | ||
| JP2023052255A (ja) * | 2022-08-23 | 2023-04-11 | サンアプロ株式会社 | 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物 |
| WO2025203788A1 (ja) * | 2024-03-26 | 2025-10-02 | リンテック株式会社 | 分解性フィルムの使用方法およびレジストパターンの作製方法 |
| JP7745814B1 (ja) * | 2024-03-26 | 2025-09-29 | リンテック株式会社 | 分解性フィルムの使用方法およびレジストパターンの作製方法 |
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| US3492330A (en) * | 1965-12-09 | 1970-01-27 | Union Carbide Corp | Norbornane diisocyanates |
| UST896033I4 (en) * | 1971-05-07 | 1972-03-14 | Defensive publication | |
| DE68924887D1 (de) | 1988-09-02 | 1996-01-04 | Kuraray Co | Polycarbonat- oder Polyestercarbonatharze. |
| JPH0269519A (ja) * | 1988-09-02 | 1990-03-08 | Kuraray Co Ltd | ポリカーボネート系樹脂 |
| US5004508A (en) | 1989-12-12 | 1991-04-02 | International Business Machines Corporation | Thermally dissipated soldering flux |
| US5004509A (en) | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| US4994119A (en) | 1990-05-09 | 1991-02-19 | International Business Machines Corporation | Water soluble soldering flux |
| US5122200A (en) | 1990-09-17 | 1992-06-16 | Motorola, Inc. | Method of cleaning printed circuit boards using formic acid |
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| JP2859038B2 (ja) * | 1992-06-09 | 1999-02-17 | 株式会社クラレ | ポリカーボネート系樹脂のフィルムまたはシート |
| DE4338225A1 (de) | 1993-11-09 | 1995-05-11 | Linde Ag | Verfahren zum Wellenlöten mit bleifreien Lotmaterialien |
| US5615827A (en) | 1994-05-31 | 1997-04-01 | International Business Machines Corporation | Flux composition and corresponding soldering method |
| JP3989088B2 (ja) * | 1998-05-25 | 2007-10-10 | 住友ベークライト株式会社 | フォトレジスト用被膜形成材料、フォトレジスト組成物及びパターン形成方法 |
| US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
| TWI250968B (en) * | 2000-04-04 | 2006-03-11 | Asahi Kasei Corp | Coating composition for use in producing a silica insulating thin film and method for producing a silica insulating thin film |
| KR100812891B1 (ko) * | 2000-04-28 | 2008-03-11 | 메르크 파텐트 게엠베하 | 무기물 표면용 에칭 페이스트 |
| EP1330327B1 (de) | 2000-10-06 | 2010-03-17 | Pac Tech - Packaging Technologies GmbH | Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip |
| GB2380964B (en) | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
| US6592090B1 (en) | 2002-08-23 | 2003-07-15 | Chin-Chu Li | Object supporting structure |
| US7799516B2 (en) * | 2002-10-16 | 2010-09-21 | Georgia Tech Research Corporation | Polymers, methods of use thereof, and methods of decomposition thereof |
| EP1567580A4 (en) * | 2002-11-01 | 2008-04-30 | Georgia Tech Res Inst | OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME |
| US7157025B2 (en) * | 2003-03-27 | 2007-01-02 | Toda Kogyo Corporation | Transparent coloring composition and color filter |
| EP1758814A4 (en) * | 2004-03-15 | 2010-12-15 | Georgia Tech Res Inst | CAPACITY FOR ELECTRO-MECHANICAL MICROSYSTEMS AND MANUFACTURING METHOD THEREFOR |
| WO2006066026A1 (en) * | 2004-12-15 | 2006-06-22 | E. I. Du Pont De Nemours And Company | Durable coating compositions containing novel aspartic amine compounds |
| EP1893355A1 (en) * | 2005-06-16 | 2008-03-05 | Advanced Technology Materials, Inc. | Dense fluid compositions for removal of hardened photoresist, post-etch residue and/or bottom anti-reflective coating layers |
| US20090071837A1 (en) * | 2005-11-18 | 2009-03-19 | Mikael Fredenberg | Master electrode and method of forming it |
| US7601482B2 (en) * | 2006-03-28 | 2009-10-13 | Az Electronic Materials Usa Corp. | Negative photoresist compositions |
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| JP5433945B2 (ja) * | 2007-12-12 | 2014-03-05 | 三菱化学株式会社 | ポリカーボネートからなる車両用ランプレンズ |
| US20090294515A1 (en) * | 2008-05-30 | 2009-12-03 | Prack Edward R | Mounting integrated circuit components on substrates |
| US7971347B2 (en) | 2008-06-27 | 2011-07-05 | Intel Corporation | Method of interconnecting workpieces |
| US8575245B2 (en) | 2008-12-23 | 2013-11-05 | Novomer, Inc. | Tunable polymer compositions |
| JP5339355B2 (ja) | 2009-03-31 | 2013-11-13 | Ｙｋｋ Ａｐ株式会社 | 門 |
| TWI479259B (zh) * | 2009-06-15 | 2015-04-01 | Sumitomo Bakelite Co | A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same |
| KR101071401B1 (ko) * | 2010-07-07 | 2011-10-07 | 주식회사 엘지화학 | 광반응성 노보넨계 공중합체, 이의 제조 방법 및 이를 포함하는 배향막 |
| JP5837069B2 (ja) * | 2010-08-06 | 2015-12-24 | プロメラス， エルエルシー | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
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2011
- 2011-08-05 JP JP2013524128A patent/JP5837069B2/ja not_active Expired - Fee Related
- 2011-08-05 EP EP11749044.1A patent/EP2601239A1/en not_active Withdrawn
- 2011-08-05 KR KR1020137005707A patent/KR101650893B1/ko not_active Expired - Fee Related
- 2011-08-05 WO PCT/US2011/046729 patent/WO2012019091A1/en not_active Ceased
- 2011-08-05 JP JP2013524129A patent/JP5704495B2/ja not_active Expired - Fee Related
- 2011-08-05 CN CN2011800459816A patent/CN103119082A/zh active Pending
- 2011-08-05 KR KR1020137005706A patent/KR101729065B1/ko not_active Expired - Fee Related
- 2011-08-05 US US13/204,036 patent/US8575248B2/en not_active Expired - Fee Related
- 2011-08-05 US US13/204,044 patent/US8575297B2/en not_active Expired - Fee Related
- 2011-08-05 EP EP11745659.0A patent/EP2601238B1/en not_active Not-in-force
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2013
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- 2013-09-27 US US14/039,433 patent/US8729166B2/en not_active Expired - Fee Related
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| EP2601238A1 (en) | 2013-06-12 |
| KR20130139234A (ko) | 2013-12-20 |
| WO2012019091A1 (en) | 2012-02-09 |
| JP2013540837A (ja) | 2013-11-07 |
| US8729166B2 (en) | 2014-05-20 |
| US20120031556A1 (en) | 2012-02-09 |
| CN103154081A (zh) | 2013-06-12 |
| JP5704495B2 (ja) | 2015-04-22 |
| US20140024750A1 (en) | 2014-01-23 |
| WO2012019092A1 (en) | 2012-02-09 |
| KR20130138192A (ko) | 2013-12-18 |
| EP2601238B1 (en) | 2015-10-07 |
| US20140024799A1 (en) | 2014-01-23 |
| KR101650893B1 (ko) | 2016-08-25 |
| JP2013535562A (ja) | 2013-09-12 |
| CN103154081B (zh) | 2015-11-25 |
| CN103119082A (zh) | 2013-05-22 |
| US8729215B2 (en) | 2014-05-20 |
| EP2601239A1 (en) | 2013-06-12 |
| KR101729065B1 (ko) | 2017-04-21 |
| US20120034387A1 (en) | 2012-02-09 |
| US8575297B2 (en) | 2013-11-05 |
| US8575248B2 (en) | 2013-11-05 |
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