CN103035613A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN103035613A CN103035613A CN2012103670985A CN201210367098A CN103035613A CN 103035613 A CN103035613 A CN 103035613A CN 2012103670985 A CN2012103670985 A CN 2012103670985A CN 201210367098 A CN201210367098 A CN 201210367098A CN 103035613 A CN103035613 A CN 103035613A
- Authority
- CN
- China
- Prior art keywords
- fuse
- layer
- sealing ring
- semiconductor device
- teos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-218242 | 2011-09-30 | ||
JP2011218242 | 2011-09-30 | ||
JP2012-171416 | 2012-08-01 | ||
JP2012171416A JP5981260B2 (ja) | 2011-09-30 | 2012-08-01 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103035613A true CN103035613A (zh) | 2013-04-10 |
CN103035613B CN103035613B (zh) | 2016-12-21 |
Family
ID=47991779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210367098.5A Active CN103035613B (zh) | 2011-09-30 | 2012-09-28 | 半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8803281B2 (zh) |
JP (1) | JP5981260B2 (zh) |
KR (1) | KR101886444B1 (zh) |
CN (1) | CN103035613B (zh) |
TW (1) | TWI573241B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105977238A (zh) * | 2015-03-12 | 2016-09-28 | 精工半导体有限公司 | 半导体装置及其制造方法 |
CN107195619A (zh) * | 2017-05-10 | 2017-09-22 | 南京中感微电子有限公司 | 一种修调电路 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9478359B2 (en) * | 2013-12-10 | 2016-10-25 | Analog Devices Global | Phase corrector for laser trimming, an integrated circuit including such a phase corrector, and a method of providing phase correction in an integrated circuit |
CN113410209B (zh) * | 2021-06-09 | 2023-07-18 | 合肥中感微电子有限公司 | 一种修调电路 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722508A (ja) * | 1993-06-24 | 1995-01-24 | Hitachi Ltd | 半導体集積回路装置 |
US5990537A (en) * | 1991-09-04 | 1999-11-23 | Fujitsu Limited | Semiconductor device with fuse |
CN1359155A (zh) * | 2000-09-27 | 2002-07-17 | 株式会社东芝 | 半导体器件及其制造方法 |
US20030168715A1 (en) * | 2002-03-11 | 2003-09-11 | Myoung-Kwang Bae | Methods of forming fuse box guard rings for integrated circuit devices |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6044829B2 (ja) * | 1982-03-18 | 1985-10-05 | 富士通株式会社 | 半導体装置の製造方法 |
JPS6065545A (ja) * | 1983-09-21 | 1985-04-15 | Hitachi Micro Comput Eng Ltd | 半導体装置の製造方法 |
JPH0521605A (ja) * | 1991-07-12 | 1993-01-29 | Sony Corp | 半導体装置 |
JPH05235170A (ja) * | 1992-02-24 | 1993-09-10 | Nec Corp | 半導体装置 |
JPH09139431A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 半導体装置とその製造方法 |
KR100194676B1 (ko) | 1996-04-24 | 1999-07-01 | 윤종용 | 전송 게이트 장치 |
JP4015704B2 (ja) * | 1997-10-13 | 2007-11-28 | 富士通株式会社 | ヒューズを有する半導体装置およびその製造方法 |
US6423582B1 (en) * | 1999-02-25 | 2002-07-23 | Micron Technology, Inc. | Use of DAR coating to modulate the efficiency of laser fuse blows |
JP2000269342A (ja) * | 1999-03-12 | 2000-09-29 | Toshiba Microelectronics Corp | 半導体集積回路および半導体集積回路の製造方法 |
JP3931016B2 (ja) * | 1999-07-07 | 2007-06-13 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
JP3328249B2 (ja) * | 1999-11-24 | 2002-09-24 | エヌイーシーマイクロシステム株式会社 | 半導体装置およびその製造方法 |
JP4374117B2 (ja) * | 2000-06-21 | 2009-12-02 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法及び半導体装置 |
JP2002313924A (ja) * | 2001-04-09 | 2002-10-25 | Seiko Instruments Inc | 半導体装置 |
JP2003264230A (ja) * | 2002-03-11 | 2003-09-19 | Ricoh Co Ltd | 半導体装置及びその製造方法 |
KR100534096B1 (ko) * | 2003-06-24 | 2005-12-06 | 삼성전자주식회사 | 반도체 기억소자의 퓨즈 영역 및 그 제조방법 |
JP4673557B2 (ja) * | 2004-01-19 | 2011-04-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2005209903A (ja) * | 2004-01-23 | 2005-08-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
KR100519799B1 (ko) * | 2004-03-25 | 2005-10-10 | 삼성전자주식회사 | 반도체 소자의 퓨즈영역 및 그 제조방법 |
KR100534102B1 (ko) * | 2004-04-21 | 2005-12-06 | 삼성전자주식회사 | 반도체 기억소자의 퓨즈 영역들 및 그 제조방법들 |
JP2006156960A (ja) * | 2004-10-26 | 2006-06-15 | Nec Electronics Corp | 半導体装置 |
JP4830455B2 (ja) * | 2005-11-10 | 2011-12-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5133569B2 (ja) * | 2006-02-22 | 2013-01-30 | セイコーインスツル株式会社 | 半導体装置とその製造方法 |
JP5139689B2 (ja) * | 2007-02-07 | 2013-02-06 | セイコーインスツル株式会社 | 半導体装置とその製造方法 |
JP5507178B2 (ja) * | 2009-09-25 | 2014-05-28 | セイコーインスツル株式会社 | 半導体集積回路装置およびその製造方法 |
-
2012
- 2012-08-01 JP JP2012171416A patent/JP5981260B2/ja active Active
- 2012-09-24 TW TW101134940A patent/TWI573241B/zh active
- 2012-09-27 US US13/628,137 patent/US8803281B2/en active Active
- 2012-09-27 KR KR1020120107806A patent/KR101886444B1/ko active IP Right Grant
- 2012-09-28 CN CN201210367098.5A patent/CN103035613B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5990537A (en) * | 1991-09-04 | 1999-11-23 | Fujitsu Limited | Semiconductor device with fuse |
JPH0722508A (ja) * | 1993-06-24 | 1995-01-24 | Hitachi Ltd | 半導体集積回路装置 |
CN1359155A (zh) * | 2000-09-27 | 2002-07-17 | 株式会社东芝 | 半导体器件及其制造方法 |
US20030168715A1 (en) * | 2002-03-11 | 2003-09-11 | Myoung-Kwang Bae | Methods of forming fuse box guard rings for integrated circuit devices |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105977238A (zh) * | 2015-03-12 | 2016-09-28 | 精工半导体有限公司 | 半导体装置及其制造方法 |
CN105977238B (zh) * | 2015-03-12 | 2021-04-27 | 艾普凌科有限公司 | 半导体装置及其制造方法 |
CN107195619A (zh) * | 2017-05-10 | 2017-09-22 | 南京中感微电子有限公司 | 一种修调电路 |
CN107195619B (zh) * | 2017-05-10 | 2019-06-28 | 南京中感微电子有限公司 | 一种修调电路 |
Also Published As
Publication number | Publication date |
---|---|
JP2013084908A (ja) | 2013-05-09 |
TWI573241B (zh) | 2017-03-01 |
TW201334148A (zh) | 2013-08-16 |
US20130082349A1 (en) | 2013-04-04 |
JP5981260B2 (ja) | 2016-08-31 |
CN103035613B (zh) | 2016-12-21 |
KR20130035926A (ko) | 2013-04-09 |
US8803281B2 (en) | 2014-08-12 |
KR101886444B1 (ko) | 2018-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160310 Address after: Chiba County, Japan Applicant after: DynaFine Semiconductor Co.,Ltd. Address before: Chiba, Chiba, Japan Applicant before: Seiko Instruments Inc. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Patentee after: ABLIC Inc. Address before: Chiba County, Japan Patentee before: DynaFine Semiconductor Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Nagano Patentee after: ABLIC Inc. Address before: Chiba County, Japan Patentee before: ABLIC Inc. |
|
CP02 | Change in the address of a patent holder |