CN102835013B - 电力转换装置 - Google Patents

电力转换装置 Download PDF

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Publication number
CN102835013B
CN102835013B CN201180017521.2A CN201180017521A CN102835013B CN 102835013 B CN102835013 B CN 102835013B CN 201180017521 A CN201180017521 A CN 201180017521A CN 102835013 B CN102835013 B CN 102835013B
Authority
CN
China
Prior art keywords
power
flow path
module
cooling medium
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180017521.2A
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English (en)
Chinese (zh)
Other versions
CN102835013A (zh
Inventor
中嶋贤市郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN102835013A publication Critical patent/CN102835013A/zh
Application granted granted Critical
Publication of CN102835013B publication Critical patent/CN102835013B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
CN201180017521.2A 2010-04-01 2011-03-30 电力转换装置 Expired - Fee Related CN102835013B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-084777 2010-04-01
JP2010084777A JP5422466B2 (ja) 2010-04-01 2010-04-01 電力変換装置
PCT/JP2011/058095 WO2011125779A1 (ja) 2010-04-01 2011-03-30 電力変換装置

Publications (2)

Publication Number Publication Date
CN102835013A CN102835013A (zh) 2012-12-19
CN102835013B true CN102835013B (zh) 2015-05-20

Family

ID=44762719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180017521.2A Expired - Fee Related CN102835013B (zh) 2010-04-01 2011-03-30 电力转换装置

Country Status (5)

Country Link
US (1) US9007767B2 (https=)
EP (1) EP2555407A4 (https=)
JP (1) JP5422466B2 (https=)
CN (1) CN102835013B (https=)
WO (1) WO2011125779A1 (https=)

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JP5417314B2 (ja) * 2010-12-27 2014-02-12 日立オートモティブシステムズ株式会社 電力変換装置
JP5506740B2 (ja) * 2011-05-31 2014-05-28 日立オートモティブシステムズ株式会社 電力変換装置
JP5338932B2 (ja) * 2011-07-26 2013-11-13 株式会社デンソー 電力変換装置
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Also Published As

Publication number Publication date
US20130021749A1 (en) 2013-01-24
JP2011217548A (ja) 2011-10-27
JP5422466B2 (ja) 2014-02-19
CN102835013A (zh) 2012-12-19
EP2555407A4 (en) 2013-10-30
US9007767B2 (en) 2015-04-14
WO2011125779A1 (ja) 2011-10-13
EP2555407A1 (en) 2013-02-06

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Address after: Ibaraki

Patentee after: Hitachi astemo Co.,Ltd.

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Granted publication date: 20150520