CN102347287B - 多层布线基板 - Google Patents

多层布线基板 Download PDF

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Publication number
CN102347287B
CN102347287B CN201110225099.1A CN201110225099A CN102347287B CN 102347287 B CN102347287 B CN 102347287B CN 201110225099 A CN201110225099 A CN 201110225099A CN 102347287 B CN102347287 B CN 102347287B
Authority
CN
China
Prior art keywords
resin insulating
insulating layer
main surface
surface side
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110225099.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102347287A (zh
Inventor
前田真之介
平野训
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN102347287A publication Critical patent/CN102347287A/zh
Application granted granted Critical
Publication of CN102347287B publication Critical patent/CN102347287B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201110225099.1A 2010-08-02 2011-08-02 多层布线基板 Expired - Fee Related CN102347287B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-173305 2010-08-02
JP2010173305A JP5079059B2 (ja) 2010-08-02 2010-08-02 多層配線基板

Publications (2)

Publication Number Publication Date
CN102347287A CN102347287A (zh) 2012-02-08
CN102347287B true CN102347287B (zh) 2015-01-28

Family

ID=45525552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110225099.1A Expired - Fee Related CN102347287B (zh) 2010-08-02 2011-08-02 多层布线基板

Country Status (5)

Country Link
US (1) US8530751B2 (https=)
JP (1) JP5079059B2 (https=)
KR (1) KR101322126B1 (https=)
CN (1) CN102347287B (https=)
TW (1) TWI461117B (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8780576B2 (en) 2011-09-14 2014-07-15 Invensas Corporation Low CTE interposer
KR101939236B1 (ko) * 2011-11-10 2019-01-16 삼성전자 주식회사 기판 및 이를 포함하는 전자 장치
DE112011105967T5 (de) * 2011-12-20 2014-09-25 Intel Corporation Mikroelektronisches Gehäuse und gestapelte mikroelektronische Baugruppe und Rechensystem mit denselben
US9117730B2 (en) * 2011-12-29 2015-08-25 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
KR101331669B1 (ko) * 2012-03-08 2013-11-20 삼성전기주식회사 전력 모듈용 기판
JP5955102B2 (ja) * 2012-05-29 2016-07-20 京セラ株式会社 配線基板およびその製造方法
US9615447B2 (en) * 2012-07-23 2017-04-04 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic support structure with integral constructional elements
TW201409633A (zh) * 2012-08-24 2014-03-01 景碩科技股份有限公司 晶片及載板的封裝結構
JP2014063844A (ja) * 2012-09-20 2014-04-10 Sony Corp 半導体装置、半導体装置の製造方法及び電子機器
US8802504B1 (en) 2013-03-14 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. 3D packages and methods for forming the same
US9299649B2 (en) 2013-02-08 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. 3D packages and methods for forming the same
CN104218016A (zh) * 2013-06-04 2014-12-17 宏启胜精密电子(秦皇岛)有限公司 Ic载板及具有该ic载板的半导体器件
KR102149793B1 (ko) * 2013-10-24 2020-08-31 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 휨 제어방법
JP6352447B2 (ja) 2014-12-24 2018-07-04 ルネサスエレクトロニクス株式会社 半導体装置
CN105789058A (zh) * 2015-01-14 2016-07-20 钰桥半导体股份有限公司 中介层嵌置于加强层中的线路板及其制作方法
US20160204056A1 (en) * 2015-01-14 2016-07-14 Bridge Semiconductor Corporation Wiring board with interposer and dual wiring structures integrated together and method of making the same
CN105870075A (zh) * 2015-01-22 2016-08-17 恒劲科技股份有限公司 基板结构
CN106034374B (zh) * 2015-03-12 2018-10-16 日立汽车系统(苏州）有限公司 防基板变形结构
TWI603505B (zh) * 2015-04-07 2017-10-21 矽品精密工業股份有限公司 封裝基板
JP2016219452A (ja) * 2015-05-14 2016-12-22 富士通株式会社 多層基板及び多層基板の製造方法
US10109588B2 (en) * 2015-05-15 2018-10-23 Samsung Electro-Mechanics Co., Ltd. Electronic component package and package-on-package structure including the same
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法
JP6819599B2 (ja) * 2015-09-25 2021-01-27 大日本印刷株式会社 実装部品、配線基板、電子装置、およびその製造方法
KR102512228B1 (ko) * 2015-10-01 2023-03-21 삼성전기주식회사 절연재 및 이를 포함하는 인쇄회로기판
US9711458B2 (en) * 2015-11-13 2017-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and formation method for chip package
KR101912278B1 (ko) * 2015-12-21 2018-10-29 삼성전기 주식회사 전자 부품 패키지 및 그 제조방법
US9761535B1 (en) * 2016-06-27 2017-09-12 Nanya Technology Corporation Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same
KR102456322B1 (ko) * 2017-11-08 2022-10-19 삼성전기주식회사 기판 스트립 및 이를 포함하는 전자소자 패키지
US10242964B1 (en) 2018-01-16 2019-03-26 Bridge Semiconductor Corp. Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
TWI655739B (zh) * 2018-04-19 2019-04-01 南亞電路板股份有限公司 封裝結構及其形成方法
JP7099359B2 (ja) * 2019-02-20 2022-07-12 株式会社村田製作所 コイル部品
US11094649B2 (en) * 2020-01-21 2021-08-17 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
US11233035B2 (en) * 2020-05-28 2022-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
GB202018676D0 (en) * 2020-11-27 2021-01-13 Graphcore Ltd Controlling warpage of a substrate for mounting a semiconductor die
WO2024209540A1 (ja) * 2023-04-04 2024-10-10 三菱電機株式会社 高周波パッケージおよび高周波パッケージの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356569A (ja) 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP4342366B2 (ja) * 2004-04-09 2009-10-14 日本特殊陶業株式会社 配線基板の製造方法
JP2006287056A (ja) * 2005-04-01 2006-10-19 Ngk Spark Plug Co Ltd 配線基板および配線基板の製造方法
JP2008078683A (ja) 2005-08-29 2008-04-03 Shinko Electric Ind Co Ltd 多層配線基板
JP4072176B2 (ja) 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
JP2008118155A (ja) 2007-12-20 2008-05-22 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP2008118154A (ja) 2007-12-20 2008-05-22 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP5290017B2 (ja) 2008-03-28 2013-09-18 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5179920B2 (ja) * 2008-03-28 2013-04-10 日本特殊陶業株式会社 多層配線基板
US8129828B2 (en) 2008-09-29 2012-03-06 Ngk Spark Plug Co., Ltd. Wiring substrate with reinforcement
JP5306789B2 (ja) 2008-12-03 2013-10-02 日本特殊陶業株式会社 多層配線基板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2005-302968A 2005.10.27 *
JP特开2006-287056A 2006.10.19 *
JP特开2009-239224A 2009.10.15 *
JP特许第4473935号B1 2010.06.02 *

Also Published As

Publication number Publication date
JP5079059B2 (ja) 2012-11-21
JP2012033790A (ja) 2012-02-16
CN102347287A (zh) 2012-02-08
KR20120022593A (ko) 2012-03-12
KR101322126B1 (ko) 2013-10-28
US8530751B2 (en) 2013-09-10
TW201220980A (en) 2012-05-16
US20120024582A1 (en) 2012-02-02
TWI461117B (zh) 2014-11-11

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