CN102270562B - 基板处理系统和基板处理方法 - Google Patents

基板处理系统和基板处理方法 Download PDF

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Publication number
CN102270562B
CN102270562B CN201110153507.7A CN201110153507A CN102270562B CN 102270562 B CN102270562 B CN 102270562B CN 201110153507 A CN201110153507 A CN 201110153507A CN 102270562 B CN102270562 B CN 102270562B
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processing unit
carrier
substrate
carrying
time
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CN201110153507.7A
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Chinese (zh)
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CN102270562A (zh
Inventor
月野木涉
山本雄一
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201110153507.7A 2010-06-01 2011-06-01 基板处理系统和基板处理方法 Active CN102270562B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-126034 2010-06-01
JP2010126034A JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法

Publications (2)

Publication Number Publication Date
CN102270562A CN102270562A (zh) 2011-12-07
CN102270562B true CN102270562B (zh) 2015-03-04

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CN201110153507.7A Active CN102270562B (zh) 2010-06-01 2011-06-01 基板处理系统和基板处理方法

Country Status (5)

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US (1) US8909364B2 (enExample)
JP (1) JP5392190B2 (enExample)
KR (1) KR101535317B1 (enExample)
CN (1) CN102270562B (enExample)
TW (1) TWI502624B (enExample)

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JP5793527B2 (ja) * 2013-03-26 2015-10-14 東京エレクトロン株式会社 搬送装置制御システム及び搬送装置のアクセス位置を調整する方法
JP6298318B2 (ja) * 2014-02-25 2018-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR20160050948A (ko) 2014-10-31 2016-05-11 세메스 주식회사 기판 처리 장치의 에이징 방법
JP6562803B2 (ja) 2015-09-30 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
JP6849378B2 (ja) 2016-10-11 2021-03-24 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6838922B2 (ja) 2016-10-11 2021-03-03 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6821378B2 (ja) * 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6821377B2 (ja) 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6759044B2 (ja) 2016-10-11 2020-09-23 キヤノン株式会社 画像読取装置、及び画像形成装置
US10542168B2 (en) 2016-10-11 2020-01-21 Canon Kabushiki Kaisha Image reading device and image forming apparatus
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6981918B2 (ja) * 2018-05-11 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、およびコンピュータプログラム
JP6993580B2 (ja) * 2018-08-03 2022-01-13 日本電信電話株式会社 制御システム及び制御方法
CN113039486B (zh) 2018-11-14 2024-11-12 朗姆研究公司 可用于下一代光刻法中的硬掩模制作方法
CN113227909B (zh) 2018-12-20 2025-07-04 朗姆研究公司 抗蚀剂的干式显影
TWI869221B (zh) 2019-06-26 2025-01-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
TWI862745B (zh) * 2019-12-13 2024-11-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
KR20250007037A (ko) 2020-01-15 2025-01-13 램 리써치 코포레이션 포토레지스트 부착 및 선량 감소를 위한 하부층
CN116626993A (zh) 2020-07-07 2023-08-22 朗姆研究公司 用于图案化辐射光致抗蚀剂图案化的集成干燥工艺
JP7546427B2 (ja) * 2020-09-24 2024-09-06 東京エレクトロン株式会社 搬送方法及び処理システム
JP7562696B2 (ja) 2020-11-13 2024-10-07 ラム リサーチ コーポレーション フォトレジストのドライ除去用プロセスツール
CN113299587B (zh) * 2021-05-21 2022-04-26 无锡亚电智能装备有限公司 一种晶圆清洗工艺任务排列方法及装置
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US12474640B2 (en) 2023-03-17 2025-11-18 Lam Research Corporation Integration of dry development and etch processes for EUV patterning in a single process chamber

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Also Published As

Publication number Publication date
JP5392190B2 (ja) 2014-01-22
KR20110132220A (ko) 2011-12-07
TW201209885A (en) 2012-03-01
KR101535317B1 (ko) 2015-07-08
TWI502624B (zh) 2015-10-01
US20110292356A1 (en) 2011-12-01
JP2011253897A (ja) 2011-12-15
US8909364B2 (en) 2014-12-09
CN102270562A (zh) 2011-12-07

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