CN102250319A - 电镀液及电镀方法 - Google Patents

电镀液及电镀方法 Download PDF

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Publication number
CN102250319A
CN102250319A CN2011101158165A CN201110115816A CN102250319A CN 102250319 A CN102250319 A CN 102250319A CN 2011101158165 A CN2011101158165 A CN 2011101158165A CN 201110115816 A CN201110115816 A CN 201110115816A CN 102250319 A CN102250319 A CN 102250319A
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CN
China
Prior art keywords
copper
alkyl
aryl
reaction product
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101158165A
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English (en)
Chinese (zh)
Inventor
Z·I·尼亚齐比托瓦
E·H·纳贾尔
M·A·热兹尼科
E·雷丁顿
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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Filing date
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Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of CN102250319A publication Critical patent/CN102250319A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
CN2011101158165A 2010-03-15 2011-03-15 电镀液及电镀方法 Pending CN102250319A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/661,301 2010-03-15
US12/661,301 US20110220512A1 (en) 2010-03-15 2010-03-15 Plating bath and method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210395534.XA Division CN102888629B (zh) 2010-03-15 2011-03-15 电镀液及电镀方法

Publications (1)

Publication Number Publication Date
CN102250319A true CN102250319A (zh) 2011-11-23

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ID=43984124

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2011101158165A Pending CN102250319A (zh) 2010-03-15 2011-03-15 电镀液及电镀方法
CN201210395534.XA Active CN102888629B (zh) 2010-03-15 2011-03-15 电镀液及电镀方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201210395534.XA Active CN102888629B (zh) 2010-03-15 2011-03-15 电镀液及电镀方法

Country Status (6)

Country Link
US (2) US20110220512A1 (enExample)
EP (1) EP2366692B1 (enExample)
JP (1) JP6054594B2 (enExample)
KR (1) KR101739410B1 (enExample)
CN (2) CN102250319A (enExample)
TW (1) TWI428326B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104053313A (zh) * 2013-03-14 2014-09-17 罗门哈斯电子材料有限公司 填充通孔的方法
CN105002527A (zh) * 2015-07-31 2015-10-28 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
CN105517371A (zh) * 2014-10-13 2016-04-20 罗门哈斯电子材料有限责任公司 填充通孔
CN109234770A (zh) * 2017-07-10 2019-01-18 罗门哈斯电子材料有限责任公司 具有阳离子聚合物的镍电镀组合物和电镀镍的方法
CN109952390A (zh) * 2016-09-22 2019-06-28 麦克德米德乐思公司 在微电子件中的铜的电沉积
CN111892706A (zh) * 2020-07-23 2020-11-06 中国科学院大学温州研究院(温州生物材料与工程研究所) 一种peg偶联杂环化合物及其在酸性光亮镀铜中的应用
CN115894908A (zh) * 2021-09-30 2023-04-04 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
CN119663384A (zh) * 2024-12-16 2025-03-21 哈尔滨工业大学 一种咪唑基表面处理添加剂及其制备方法与应用

Families Citing this family (28)

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US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8454815B2 (en) 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method
JP6027613B2 (ja) * 2012-07-09 2016-11-16 四国化成工業株式会社 銅被膜形成剤及び銅被膜の形成方法
KR20140092626A (ko) 2013-01-16 2014-07-24 삼성전자주식회사 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
US20140262801A1 (en) * 2013-03-14 2014-09-18 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US9403762B2 (en) * 2013-11-21 2016-08-02 Rohm And Haas Electronic Materials Llc Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
US9273407B2 (en) 2014-03-17 2016-03-01 Hong Kong Applied Science and Technology Research Institute Company Limited Additive for electrodeposition
CN104005061B (zh) * 2014-06-05 2016-05-18 中节能太阳能科技有限公司 一种用于太阳能电池前电极电镀铜的负整平剂
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
EP3135709B1 (en) * 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10512174B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
CN107236976B (zh) * 2017-07-25 2018-11-16 上海新阳半导体材料股份有限公司 整平剂、含其的金属电镀组合物及制备方法、应用
CN107217283B (zh) * 2017-07-25 2018-11-16 上海新阳半导体材料股份有限公司 整平剂、含其的金属电镀组合物、制备方法及应用
JP7808062B2 (ja) 2021-02-15 2026-01-28 株式会社Adeka 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
KR102339867B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
CN114381769B (zh) * 2021-12-24 2023-06-09 广州市慧科高新材料科技有限公司 一种超速填孔镀铜整平剂的合成方法以及应用
US20230279577A1 (en) 2022-03-04 2023-09-07 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104053313A (zh) * 2013-03-14 2014-09-17 罗门哈斯电子材料有限公司 填充通孔的方法
CN105517371A (zh) * 2014-10-13 2016-04-20 罗门哈斯电子材料有限责任公司 填充通孔
TWI589204B (zh) * 2014-10-13 2017-06-21 羅門哈斯電子材料有限公司 塡充通孔
CN105002527A (zh) * 2015-07-31 2015-10-28 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
CN109952390A (zh) * 2016-09-22 2019-06-28 麦克德米德乐思公司 在微电子件中的铜的电沉积
CN109234770A (zh) * 2017-07-10 2019-01-18 罗门哈斯电子材料有限责任公司 具有阳离子聚合物的镍电镀组合物和电镀镍的方法
CN109234770B (zh) * 2017-07-10 2020-10-30 罗门哈斯电子材料有限责任公司 具有阳离子聚合物的镍电镀组合物和电镀镍的方法
CN111892706A (zh) * 2020-07-23 2020-11-06 中国科学院大学温州研究院(温州生物材料与工程研究所) 一种peg偶联杂环化合物及其在酸性光亮镀铜中的应用
CN115894908A (zh) * 2021-09-30 2023-04-04 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
WO2023051756A1 (zh) * 2021-09-30 2023-04-06 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
CN119663384A (zh) * 2024-12-16 2025-03-21 哈尔滨工业大学 一种咪唑基表面处理添加剂及其制备方法与应用

Also Published As

Publication number Publication date
TWI428326B (zh) 2014-03-01
EP2366692A3 (en) 2011-11-02
US8268158B2 (en) 2012-09-18
US20110220512A1 (en) 2011-09-15
CN102888629A (zh) 2013-01-23
US20110290660A1 (en) 2011-12-01
TW201139382A (en) 2011-11-16
KR101739410B1 (ko) 2017-05-24
EP2366692A2 (en) 2011-09-21
JP2011190260A (ja) 2011-09-29
JP6054594B2 (ja) 2016-12-27
CN102888629B (zh) 2014-12-31
KR20110103891A (ko) 2011-09-21
EP2366692B1 (en) 2013-02-20

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Application publication date: 20111123