CN102130140B - 固体摄像装置 - Google Patents

固体摄像装置 Download PDF

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Publication number
CN102130140B
CN102130140B CN201010565727.6A CN201010565727A CN102130140B CN 102130140 B CN102130140 B CN 102130140B CN 201010565727 A CN201010565727 A CN 201010565727A CN 102130140 B CN102130140 B CN 102130140B
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film
imaging device
solid
state imaging
opening
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Expired - Fee Related
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CN201010565727.6A
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Chinese (zh)
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CN102130140A (zh
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秋山健太郎
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Sony Semiconductor Solutions Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0234—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes that stop on pads or on electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0242—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes from the back sides of the chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0265—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the sidewall insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201010565727.6A 2008-01-21 2009-01-21 固体摄像装置 Expired - Fee Related CN102130140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008010904A JP4609497B2 (ja) 2008-01-21 2008-01-21 固体撮像装置とその製造方法、及びカメラ
JP2008-010904 2008-01-21

Related Parent Applications (1)

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CN2009100010869A Division CN101494234B (zh) 2008-01-21 2009-01-21 固体摄像装置、固体摄像装置制造方法以及照相机

Publications (2)

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CN102130140A CN102130140A (zh) 2011-07-20
CN102130140B true CN102130140B (zh) 2015-06-17

Family

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CN201010565727.6A Expired - Fee Related CN102130140B (zh) 2008-01-21 2009-01-21 固体摄像装置
CN2009100010869A Expired - Fee Related CN101494234B (zh) 2008-01-21 2009-01-21 固体摄像装置、固体摄像装置制造方法以及照相机

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Country Status (6)

Country Link
US (2) US8300127B2 (https=)
EP (1) EP2081229B1 (https=)
JP (1) JP4609497B2 (https=)
KR (1) KR101556628B1 (https=)
CN (2) CN102130140B (https=)
TW (1) TWI407554B (https=)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609497B2 (ja) * 2008-01-21 2011-01-12 ソニー株式会社 固体撮像装置とその製造方法、及びカメラ
US8293122B2 (en) * 2009-01-21 2012-10-23 Taiwan Semiconductor Manufacturing Company, Ltd. Dual metal for a backside package of backside illuminated image sensor
JP2010182790A (ja) * 2009-02-04 2010-08-19 Fujifilm Corp 固体撮像素子、撮像装置、固体撮像素子の製造方法
JP2010182789A (ja) * 2009-02-04 2010-08-19 Fujifilm Corp 固体撮像素子、撮像装置、固体撮像素子の製造方法
US8426938B2 (en) 2009-02-16 2013-04-23 Samsung Electronics Co., Ltd. Image sensor and method of fabricating the same
JP5985136B2 (ja) 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
JP2010238848A (ja) * 2009-03-31 2010-10-21 Sony Corp 固体撮像装置および電子機器
JP2010267736A (ja) * 2009-05-13 2010-11-25 Panasonic Corp 固体撮像素子
JP5306123B2 (ja) * 2009-09-11 2013-10-02 株式会社東芝 裏面照射型固体撮像装置
JP2011086709A (ja) * 2009-10-14 2011-04-28 Toshiba Corp 固体撮像装置及びその製造方法
JP5442394B2 (ja) 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5568969B2 (ja) * 2009-11-30 2014-08-13 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2011124946A (ja) * 2009-12-14 2011-06-23 Panasonic Corp 固体撮像素子およびこれを備えたカメラ
JP5566093B2 (ja) 2009-12-18 2014-08-06 キヤノン株式会社 固体撮像装置
JP5489705B2 (ja) * 2009-12-26 2014-05-14 キヤノン株式会社 固体撮像装置および撮像システム
KR20110077451A (ko) * 2009-12-30 2011-07-07 삼성전자주식회사 이미지 센서, 그 제조 방법, 및 상기 이미지 센서를 포함하는 장치
JP5446915B2 (ja) * 2010-01-21 2014-03-19 セイコーエプソン株式会社 生体情報検出器及び生体情報測定装置
JP5630027B2 (ja) * 2010-01-29 2014-11-26 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器、半導体装置
JP2011198854A (ja) 2010-03-17 2011-10-06 Fujifilm Corp 光電変換膜積層型固体撮像素子及び撮像装置
JP5853351B2 (ja) * 2010-03-25 2016-02-09 ソニー株式会社 半導体装置、半導体装置の製造方法、及び電子機器
JP5663925B2 (ja) 2010-03-31 2015-02-04 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
US8748946B2 (en) 2010-04-29 2014-06-10 Omnivision Technologies, Inc. Isolated wire bond in integrated electrical components
US8318580B2 (en) * 2010-04-29 2012-11-27 Omnivision Technologies, Inc. Isolating wire bonding in integrated electrical components
JP5582879B2 (ja) * 2010-06-09 2014-09-03 株式会社東芝 半導体装置及びその製造方法
JP2010212735A (ja) * 2010-06-17 2010-09-24 Sony Corp 固体撮像装置とその製造方法、及びカメラ
JP5327146B2 (ja) * 2010-06-17 2013-10-30 ソニー株式会社 固体撮像装置とその製造方法、及びカメラ
JP5585232B2 (ja) * 2010-06-18 2014-09-10 ソニー株式会社 固体撮像装置、電子機器
JP5693060B2 (ja) * 2010-06-30 2015-04-01 キヤノン株式会社 固体撮像装置、及び撮像システム
JP2012023251A (ja) * 2010-07-15 2012-02-02 Sony Corp 固体撮像素子及び固体撮像素子の製造方法、電子機器
TWI463646B (zh) * 2010-07-16 2014-12-01 United Microelectronics Corp 背照式影像感測器
US8847380B2 (en) * 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
JP2012084609A (ja) * 2010-10-07 2012-04-26 Sony Corp 固体撮像装置とその製造方法、及び電子機器
JP5640630B2 (ja) 2010-10-12 2014-12-17 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、及び電子機器
JP5716347B2 (ja) * 2010-10-21 2015-05-13 ソニー株式会社 固体撮像装置及び電子機器
JP5857399B2 (ja) * 2010-11-12 2016-02-10 ソニー株式会社 固体撮像装置及び電子機器
US9165970B2 (en) * 2011-02-16 2015-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Back side illuminated image sensor having isolated bonding pads
JP2012174800A (ja) * 2011-02-18 2012-09-10 Sony Corp 半導体装置、製造装置、及び製造方法
JP2012175078A (ja) * 2011-02-24 2012-09-10 Sony Corp 固体撮像装置、および、その製造方法、電子機器、半導体装置
US8710612B2 (en) 2011-05-20 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having a bonding pad and shield structure of different thickness
US8664736B2 (en) * 2011-05-20 2014-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same
KR20120135627A (ko) * 2011-06-07 2012-12-17 삼성전자주식회사 이미지 센서 및 그 제조 방법
US8435824B2 (en) * 2011-07-07 2013-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Backside illumination sensor having a bonding pad structure and method of making the same
US9013022B2 (en) 2011-08-04 2015-04-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips
JP6205110B2 (ja) * 2012-04-23 2017-09-27 オリンパス株式会社 撮像モジュール
CN103531597B (zh) * 2012-07-03 2016-06-08 台湾积体电路制造股份有限公司 降低了侧壁引发的泄漏的背面照明图像传感器
US8710607B2 (en) 2012-07-12 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for image sensor packaging
JP6007694B2 (ja) * 2012-09-14 2016-10-12 ソニー株式会社 固体撮像装置及び電子機器
US9232122B2 (en) * 2012-09-19 2016-01-05 Lg Innotek Co., Ltd. Camera module having an array sensor
JP2014099582A (ja) 2012-10-18 2014-05-29 Sony Corp 固体撮像装置
US9722099B2 (en) * 2013-03-14 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Light sensing device with outgassing hole in a light shielding layer and an anti-reflection film
TWI612649B (zh) * 2013-03-18 2018-01-21 新力股份有限公司 半導體裝置及電子機器
JP6200188B2 (ja) * 2013-04-08 2017-09-20 キヤノン株式会社 固体撮像装置、その製造方法及びカメラ
JP6120094B2 (ja) * 2013-07-05 2017-04-26 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP5956968B2 (ja) * 2013-09-13 2016-07-27 株式会社東芝 受光素子および光結合型信号絶縁装置
US9247116B2 (en) * 2014-03-14 2016-01-26 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor device with light guiding structure
JP2015179700A (ja) * 2014-03-18 2015-10-08 キヤノン株式会社 固体撮像素子の製造方法
US9324755B2 (en) * 2014-05-05 2016-04-26 Semiconductor Components Industries, Llc Image sensors with reduced stack height
KR102720747B1 (ko) * 2015-03-12 2024-10-23 소니그룹주식회사 촬상 장치, 제조 방법 및 전자 기기
JP6176313B2 (ja) * 2015-12-02 2017-08-09 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
JP6650779B2 (ja) * 2016-02-19 2020-02-19 キヤノン株式会社 撮像装置、撮像システム、撮像装置の駆動方法
US10109666B2 (en) 2016-04-13 2018-10-23 Taiwan Semiconductor Manufacturing Co., Ltd. Pad structure for backside illuminated (BSI) image sensors
JP2018011018A (ja) * 2016-07-15 2018-01-18 ソニー株式会社 固体撮像素子および製造方法、並びに電子機器
JP6236181B2 (ja) * 2017-04-05 2017-11-22 キヤノン株式会社 固体撮像装置およびその製造方法
JP6663887B2 (ja) * 2017-07-11 2020-03-13 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
WO2019017147A1 (ja) * 2017-07-18 2019-01-24 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法
US11227836B2 (en) * 2018-10-23 2022-01-18 Taiwan Semiconductor Manufacturing Company, Ltd. Pad structure for enhanced bondability
CN110429091B (zh) * 2019-07-29 2023-03-03 上海集成电路研发中心有限公司 一种具有挡光结构的全局像元结构及形成方法
JP7603382B2 (ja) * 2019-11-18 2024-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像素子および撮像素子の製造方法
KR102784209B1 (ko) 2020-01-30 2025-03-24 삼성전자주식회사 이미지 센서 및 그 제조 방법
US11652127B2 (en) * 2020-04-17 2023-05-16 Taiwan Semiconductor Manufacturing Company Limited Image sensor device and methods of forming the same
US20230411431A1 (en) * 2022-05-17 2023-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked cmos image sensor and method of manufacturing the same
CN119208344B (zh) * 2024-11-25 2025-04-04 浙江创芯集成电路有限公司 一种背照式工艺流程的优化方法及半导体器件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1992212A (zh) * 2005-12-28 2007-07-04 东部电子股份有限公司 制造cmos图像传感器的方法
CN101494234B (zh) * 2008-01-21 2011-01-26 索尼株式会社 固体摄像装置、固体摄像装置制造方法以及照相机

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821168A (en) * 1997-07-16 1998-10-13 Motorola, Inc. Process for forming a semiconductor device
JP3324581B2 (ja) * 1999-09-21 2002-09-17 日本電気株式会社 固体撮像装置及びその製造方法
JP4776752B2 (ja) * 2000-04-19 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
JP4040261B2 (ja) * 2001-03-22 2008-01-30 富士フイルム株式会社 固体撮像装置とその駆動方法
JP4383959B2 (ja) * 2003-05-28 2009-12-16 キヤノン株式会社 光電変換装置およびその製造方法
JP4046069B2 (ja) 2003-11-17 2008-02-13 ソニー株式会社 固体撮像素子及び固体撮像素子の製造方法
JP4432502B2 (ja) * 2004-01-20 2010-03-17 ソニー株式会社 半導体装置
JP4389626B2 (ja) * 2004-03-29 2009-12-24 ソニー株式会社 固体撮像素子の製造方法
JP2005347707A (ja) 2004-06-07 2005-12-15 Sony Corp 固体撮像素子及びその製造方法
JP2005353631A (ja) 2004-06-08 2005-12-22 Sony Corp 固体撮像装置の製造方法
JP4466213B2 (ja) * 2004-06-14 2010-05-26 ソニー株式会社 固体撮像装置の製造方法
JP4270105B2 (ja) * 2004-10-29 2009-05-27 ソニー株式会社 固体撮像素子
TWI382455B (zh) * 2004-11-04 2013-01-11 Semiconductor Energy Lab 半導體裝置和其製造方法
JP4714502B2 (ja) * 2005-04-26 2011-06-29 パナソニック株式会社 固体撮像装置
JP5082855B2 (ja) 2005-11-11 2012-11-28 株式会社ニコン 反射防止膜を有する固体撮像装置および表示装置並びにその製造方法
TWI284390B (en) * 2006-01-10 2007-07-21 Ind Tech Res Inst Manufacturing method of charge store device
JP4774311B2 (ja) * 2006-02-17 2011-09-14 富士フイルム株式会社 固体撮像素子及びその駆動方法並びに撮像装置
JP2007299840A (ja) * 2006-04-28 2007-11-15 Fujifilm Corp Ｃｃｄ型固体撮像素子及びその製造方法
JP4697068B2 (ja) 2006-06-27 2011-06-08 ソニー株式会社 無線通信システム、無線通信装置及び無線通信方法、並びにコンピュータ・プログラム
JP2008172580A (ja) * 2007-01-12 2008-07-24 Toshiba Corp 固体撮像素子及び固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1992212A (zh) * 2005-12-28 2007-07-04 东部电子股份有限公司 制造cmos图像传感器的方法
CN101494234B (zh) * 2008-01-21 2011-01-26 索尼株式会社 固体摄像装置、固体摄像装置制造方法以及照相机

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