CN102076774B - 辐射敏感树脂组合物、叠层体及其制造方法、以及半导体器件 - Google Patents

辐射敏感树脂组合物、叠层体及其制造方法、以及半导体器件 Download PDF

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Publication number
CN102076774B
CN102076774B CN200980124825.1A CN200980124825A CN102076774B CN 102076774 B CN102076774 B CN 102076774B CN 200980124825 A CN200980124825 A CN 200980124825A CN 102076774 B CN102076774 B CN 102076774B
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compound
group
resin
acid
methyl
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CN102076774A (zh
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矶贝幸枝
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Zeon Corp
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Nippon Zeon Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
CN200980124825.1A 2008-04-28 2009-04-27 辐射敏感树脂组合物、叠层体及其制造方法、以及半导体器件 Active CN102076774B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008117537 2008-04-28
JP117537/08 2008-04-28
PCT/JP2009/058262 WO2009133843A1 (ja) 2008-04-28 2009-04-27 感放射線樹脂組成物、積層体及びその製造方法ならびに半導体デバイス

Publications (2)

Publication Number Publication Date
CN102076774A CN102076774A (zh) 2011-05-25
CN102076774B true CN102076774B (zh) 2014-07-09

Family

ID=41255059

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980124825.1A Active CN102076774B (zh) 2008-04-28 2009-04-27 辐射敏感树脂组合物、叠层体及其制造方法、以及半导体器件

Country Status (5)

Country Link
JP (1) JP5488460B2 (ko)
KR (1) KR101586871B1 (ko)
CN (1) CN102076774B (ko)
TW (1) TWI488905B (ko)
WO (1) WO2009133843A1 (ko)

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JP2009302164A (ja) * 2008-06-11 2009-12-24 Mitsubishi Chemicals Corp 半導体発光装置用部材形成液、硬化物、半導体発光装置、半導体発光装置の製造方法、照明装置、および画像表示装置
JP5585112B2 (ja) * 2009-04-01 2014-09-10 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜及びその形成方法
JP2012049300A (ja) * 2010-08-26 2012-03-08 Nippon Zeon Co Ltd 半導体素子基板
JP5664173B2 (ja) * 2010-11-26 2015-02-04 日本ゼオン株式会社 半導体素子基板
WO2012133617A1 (ja) * 2011-03-30 2012-10-04 日本ゼオン株式会社 樹脂組成物および半導体素子基板
WO2013012035A1 (ja) * 2011-07-20 2013-01-24 日本ゼオン株式会社 ネガ型感光性樹脂組成物、樹脂膜及び電子部品
TWI568763B (zh) * 2012-03-19 2017-02-01 奇美實業股份有限公司 感光性樹脂組成物、彩色濾光片及其液晶顯示元件
CN102618200B (zh) * 2012-03-21 2013-11-13 东华大学 一种有机硅-环氧-聚酰亚胺胶粘剂及其制备方法
WO2014142163A1 (ja) * 2013-03-15 2014-09-18 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置
TW201445249A (zh) * 2013-05-31 2014-12-01 Chi Mei Corp 感光性樹脂組成物及其應用
KR20160036558A (ko) * 2013-07-31 2016-04-04 제온 코포레이션 수지 조성물 및 게이트 절연막
KR102381904B1 (ko) * 2014-03-20 2022-03-31 제온 코포레이션 감방사선 수지 조성물 및 전자 부품
US10151977B2 (en) * 2015-02-19 2018-12-11 Zeon Corporation Resin composition, resin film, and electronic device
TWI694101B (zh) * 2015-08-28 2020-05-21 日商富士軟片股份有限公司 硬化膜的製造方法、再配線層用層間絕緣膜的製造方法及半導體元件的製造方法
KR102159253B1 (ko) * 2016-11-01 2020-09-23 동우 화인켐 주식회사 필름 안테나 장치 및 그의 제조 방법
KR102420415B1 (ko) 2017-10-17 2022-07-15 덕산네오룩스 주식회사 부착력 또는 접착성이 향상된 감광성 수지 조성물 및 그것들을 사용한 광 차단 층
KR102158304B1 (ko) * 2018-08-30 2020-09-22 동우 화인켐 주식회사 고주파용 필름 전송 선로, 이를 포함하는 안테나 및 안테나가 결합된 화상 표시 장치
CN110333647B (zh) * 2019-07-03 2023-04-14 波米科技有限公司 一种正型感光性树脂组合物
KR102243537B1 (ko) * 2020-09-15 2021-04-21 동우 화인켐 주식회사 고주파용 필름 전송 선로, 이를 포함하는 안테나 및 안테나가 결합된 화상 표시 장치
KR102243738B1 (ko) * 2020-09-16 2021-04-23 동우 화인켐 주식회사 필름 안테나 장치 및 그의 제조 방법
CN114647094B (zh) * 2022-05-23 2022-08-05 人民百业科技有限公司 一种能实现显示屏裸眼3d效果的斜纹光学膜及其制备方法
US11747522B1 (en) 2022-05-23 2023-09-05 People Baiye Technology Co., Ltd. Twill optical film capable of realizing 3D effect of naked eye of display screen and preparation method thereof

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WO2007122929A1 (ja) * 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物

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CA2033403A1 (en) * 1990-01-26 1991-07-27 Michael J. Mcfarland Photoresist containing aliphatic di- and tri-esters of aliphatic and aromatic di-and tri-acids and alcohols
JP4262097B2 (ja) * 2002-02-26 2009-05-13 日本化薬株式会社 感光性樹脂，樹脂組成物並びにその硬化物
JP4070515B2 (ja) * 2002-06-05 2008-04-02 旭化成エレクトロニクス株式会社 耐熱性樹脂前駆体組成物
JP2005534802A (ja) * 2002-07-31 2005-11-17 エクソンモービル・ケミカル・パテンツ・インク シラン架橋性ポリエチレン
KR20050058062A (ko) * 2003-12-11 2005-06-16 삼성전자주식회사 유기절연막 형성용 조성물 및 이를 사용하여 제조된유기절연막
JP2005292277A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
WO2007122929A1 (ja) * 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物

Also Published As

Publication number Publication date
TWI488905B (zh) 2015-06-21
JP5488460B2 (ja) 2014-05-14
KR101586871B1 (ko) 2016-01-19
CN102076774A (zh) 2011-05-25
KR20110008286A (ko) 2011-01-26
JPWO2009133843A1 (ja) 2011-09-01
WO2009133843A1 (ja) 2009-11-05
TW201005019A (en) 2010-02-01

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