CN101989537B - 液体处理装置和液体处理方法 - Google Patents

液体处理装置和液体处理方法 Download PDF

Info

Publication number
CN101989537B
CN101989537B CN201010239045.6A CN201010239045A CN101989537B CN 101989537 B CN101989537 B CN 101989537B CN 201010239045 A CN201010239045 A CN 201010239045A CN 101989537 B CN101989537 B CN 101989537B
Authority
CN
China
Prior art keywords
mentioned
liquid
pipe arrangement
open
close valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010239045.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN101989537A (zh
Inventor
松本和久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101989537A publication Critical patent/CN101989537A/zh
Application granted granted Critical
Publication of CN101989537B publication Critical patent/CN101989537B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Devices For Dispensing Beverages (AREA)
CN201010239045.6A 2009-07-31 2010-07-23 液体处理装置和液体处理方法 Expired - Fee Related CN101989537B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-179428 2009-07-31
JP2009179428 2009-07-31
JP2010127914A JP5474666B2 (ja) 2009-07-31 2010-06-03 液処理装置、液処理方法、プログラムおよびプログラム記録媒体
JP2010-127914 2010-06-03

Publications (2)

Publication Number Publication Date
CN101989537A CN101989537A (zh) 2011-03-23
CN101989537B true CN101989537B (zh) 2014-04-16

Family

ID=43525832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010239045.6A Expired - Fee Related CN101989537B (zh) 2009-07-31 2010-07-23 液体处理装置和液体处理方法

Country Status (5)

Country Link
US (1) US8425686B2 (enExample)
JP (1) JP5474666B2 (enExample)
KR (1) KR101470673B1 (enExample)
CN (1) CN101989537B (enExample)
TW (1) TWI460775B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6227895B2 (ja) * 2013-05-24 2017-11-08 株式会社荏原製作所 基板処理装置
JP6352143B2 (ja) * 2013-11-13 2018-07-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6090144B2 (ja) 2013-12-13 2017-03-08 東京エレクトロン株式会社 切替弁、液処理装置
JP6482979B2 (ja) * 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
CN109127599B (zh) * 2018-07-06 2023-09-26 江苏星A包装机械集团有限公司 用于旋转式洗瓶机的双通道介质分配机构
KR102087773B1 (ko) * 2018-07-13 2020-04-23 씨앤지하이테크 주식회사 액체 혼합 공급장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242841A (en) * 1979-07-30 1981-01-06 Ushakov Vladimir F Apparatus for preparing and feeding an abrasive-containing suspension into the zone of action of work tools of polishing and finishing lathes
JP2739419B2 (ja) 1992-09-25 1998-04-15 大日本スクリーン製造株式会社 基板処理装置
JPH1076153A (ja) * 1996-09-05 1998-03-24 Fujitsu Ltd 液体自動供給装置及びその異常検出装置
JP3841945B2 (ja) * 1997-10-29 2006-11-08 大日本スクリーン製造株式会社 基板処理装置
US6168048B1 (en) * 1998-09-22 2001-01-02 American Air Liquide, Inc. Methods and systems for distributing liquid chemicals
JP2002096030A (ja) * 2000-09-26 2002-04-02 Shibaura Mechatronics Corp ノズルを用いた処理装置
US6783429B2 (en) * 2001-08-17 2004-08-31 The Boc Group, Inc. Apparatus and method for sampling a chemical-mechanical polishing slurry
US6579446B1 (en) * 2002-04-04 2003-06-17 Agrimond, Llc Multi-process disinfectant delivery control system
JP2005175183A (ja) * 2003-12-11 2005-06-30 Kitz Sct:Kk 液体加圧機構及びこれを用いた液体制御装置と液体制御方法
JP2005175228A (ja) * 2003-12-11 2005-06-30 Dainippon Screen Mfg Co Ltd レジスト剥離方法およびレジスト剥離装置
KR100598913B1 (ko) * 2004-09-02 2006-07-10 세메스 주식회사 약액 혼합 공급 장치 및 그 방법
JP2007123393A (ja) * 2005-10-26 2007-05-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4940123B2 (ja) * 2007-12-21 2012-05-30 東京エレクトロン株式会社 基板処理装置および基板処理方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2005-175183A 2005.06.30
JP特开2007-123393A 2007.05.17

Also Published As

Publication number Publication date
TW201133578A (en) 2011-10-01
US20110023912A1 (en) 2011-02-03
KR101470673B1 (ko) 2014-12-08
JP2011049526A (ja) 2011-03-10
CN101989537A (zh) 2011-03-23
US8425686B2 (en) 2013-04-23
JP5474666B2 (ja) 2014-04-16
TWI460775B (zh) 2014-11-11
KR20110013239A (ko) 2011-02-09

Similar Documents

Publication Publication Date Title
CN101989537B (zh) 液体处理装置和液体处理方法
TWI385026B (zh) 處理液混合裝置、基板處理裝置及處理液混合方法與記憶媒體
WO2021028654A3 (en) Apparatus and method for the preparation of aerated drinks
WO2002031858A3 (en) Gas distribution apparatus for semiconductor processing
US8950414B2 (en) Liquid processing apparatus, liquid processing method, and storage medium
JP2004006620A5 (enExample)
RU2009140748A (ru) Способ и устройство для изготовления фасонных элементов со слоем из полиуретана
WO2004040630A8 (ja) 半導体デバイスの製造方法及び基板処理装置
KR100274925B1 (ko) 액체 분배 장치 및 방법
US10981133B2 (en) Chemical synthesis device
US8408234B2 (en) Process liquid supply system, process liquid supply method, and storage medium
JP2017023958A (ja) 固体粒子を含有する液体材料の吐出装置および吐出方法並びに塗布装置
TW200745479A (en) Liquid dispense system
JP2019034290A (ja) 合成装置
TW200619890A (en) Temperature control method and system for small flow rate liquid
TW201538883A (zh) 化學液供給裝置及其供給方法
CN101018950A (zh) 药液供给系统
TWI786285B (zh) 洗淨液供給系統、基板處理裝置及基板處理系統
JP2011049526A5 (enExample)
TWI587927B (zh) 漿料供應設備
JP2011176118A (ja) 液処理装置、液処理方法、プログラムおよびプログラム記録媒体
JP6698921B1 (ja) 研磨液供給装置
EP1410841A3 (de) Verfahren und Vorrichtung zur kombinatorischen Herstellung von Mischungen sowie deren Verwendung
JP2021008001A (ja) 研磨液供給装置
JP2008172031A (ja) Ｃｍｐ装置における洗浄液調合装置及び洗浄液供給方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20170723