TWI460775B - Liquid handling device, liquid handling method, computer program product and computer readable recording medium - Google Patents
Liquid handling device, liquid handling method, computer program product and computer readable recording medium Download PDFInfo
- Publication number
- TWI460775B TWI460775B TW099125421A TW99125421A TWI460775B TW I460775 B TWI460775 B TW I460775B TW 099125421 A TW099125421 A TW 099125421A TW 99125421 A TW99125421 A TW 99125421A TW I460775 B TWI460775 B TW I460775B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- pipe
- opening
- main
- main pipe
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims description 434
- 238000000034 method Methods 0.000 title claims description 45
- 238000004590 computer program Methods 0.000 title claims 3
- 238000012545 processing Methods 0.000 claims description 174
- 230000007246 mechanism Effects 0.000 claims description 60
- 230000008569 process Effects 0.000 claims description 37
- 238000003672 processing method Methods 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 83
- 239000000126 substance Substances 0.000 description 41
- 238000004140 cleaning Methods 0.000 description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 239000002699 waste material Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 10
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- MMBMIVSDYYPRHH-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO.OO MMBMIVSDYYPRHH-UHFFFAOYSA-N 0.000 description 3
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- CABDFQZZWFMZOD-UHFFFAOYSA-N hydrogen peroxide;hydrochloride Chemical compound Cl.OO CABDFQZZWFMZOD-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Devices For Dispensing Beverages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009179428 | 2009-07-31 | ||
| JP2010127914A JP5474666B2 (ja) | 2009-07-31 | 2010-06-03 | 液処理装置、液処理方法、プログラムおよびプログラム記録媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201133578A TW201133578A (en) | 2011-10-01 |
| TWI460775B true TWI460775B (zh) | 2014-11-11 |
Family
ID=43525832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099125421A TWI460775B (zh) | 2009-07-31 | 2010-07-30 | Liquid handling device, liquid handling method, computer program product and computer readable recording medium |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8425686B2 (enExample) |
| JP (1) | JP5474666B2 (enExample) |
| KR (1) | KR101470673B1 (enExample) |
| CN (1) | CN101989537B (enExample) |
| TW (1) | TWI460775B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6227895B2 (ja) * | 2013-05-24 | 2017-11-08 | 株式会社荏原製作所 | 基板処理装置 |
| JP6352143B2 (ja) * | 2013-11-13 | 2018-07-04 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
| JP6090144B2 (ja) | 2013-12-13 | 2017-03-08 | 東京エレクトロン株式会社 | 切替弁、液処理装置 |
| JP6482979B2 (ja) * | 2015-07-29 | 2019-03-13 | 東京エレクトロン株式会社 | 液処理装置 |
| CN109127599B (zh) * | 2018-07-06 | 2023-09-26 | 江苏星A包装机械集团有限公司 | 用于旋转式洗瓶机的双通道介质分配机构 |
| KR102087773B1 (ko) * | 2018-07-13 | 2020-04-23 | 씨앤지하이테크 주식회사 | 액체 혼합 공급장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135472A (ja) * | 1997-10-29 | 1999-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2005175183A (ja) * | 2003-12-11 | 2005-06-30 | Kitz Sct:Kk | 液体加圧機構及びこれを用いた液体制御装置と液体制御方法 |
| JP2007123393A (ja) * | 2005-10-26 | 2007-05-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4242841A (en) * | 1979-07-30 | 1981-01-06 | Ushakov Vladimir F | Apparatus for preparing and feeding an abrasive-containing suspension into the zone of action of work tools of polishing and finishing lathes |
| JP2739419B2 (ja) | 1992-09-25 | 1998-04-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JPH1076153A (ja) * | 1996-09-05 | 1998-03-24 | Fujitsu Ltd | 液体自動供給装置及びその異常検出装置 |
| US6168048B1 (en) * | 1998-09-22 | 2001-01-02 | American Air Liquide, Inc. | Methods and systems for distributing liquid chemicals |
| JP2002096030A (ja) * | 2000-09-26 | 2002-04-02 | Shibaura Mechatronics Corp | ノズルを用いた処理装置 |
| US6783429B2 (en) * | 2001-08-17 | 2004-08-31 | The Boc Group, Inc. | Apparatus and method for sampling a chemical-mechanical polishing slurry |
| US6579446B1 (en) * | 2002-04-04 | 2003-06-17 | Agrimond, Llc | Multi-process disinfectant delivery control system |
| JP2005175228A (ja) * | 2003-12-11 | 2005-06-30 | Dainippon Screen Mfg Co Ltd | レジスト剥離方法およびレジスト剥離装置 |
| KR100598913B1 (ko) * | 2004-09-02 | 2006-07-10 | 세메스 주식회사 | 약액 혼합 공급 장치 및 그 방법 |
| JP4940123B2 (ja) * | 2007-12-21 | 2012-05-30 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2010
- 2010-06-03 JP JP2010127914A patent/JP5474666B2/ja active Active
- 2010-07-20 KR KR1020100070029A patent/KR101470673B1/ko active Active
- 2010-07-23 CN CN201010239045.6A patent/CN101989537B/zh not_active Expired - Fee Related
- 2010-07-27 US US12/843,948 patent/US8425686B2/en not_active Expired - Fee Related
- 2010-07-30 TW TW099125421A patent/TWI460775B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135472A (ja) * | 1997-10-29 | 1999-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2005175183A (ja) * | 2003-12-11 | 2005-06-30 | Kitz Sct:Kk | 液体加圧機構及びこれを用いた液体制御装置と液体制御方法 |
| JP2007123393A (ja) * | 2005-10-26 | 2007-05-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5474666B2 (ja) | 2014-04-16 |
| CN101989537B (zh) | 2014-04-16 |
| KR20110013239A (ko) | 2011-02-09 |
| US8425686B2 (en) | 2013-04-23 |
| US20110023912A1 (en) | 2011-02-03 |
| CN101989537A (zh) | 2011-03-23 |
| TW201133578A (en) | 2011-10-01 |
| KR101470673B1 (ko) | 2014-12-08 |
| JP2011049526A (ja) | 2011-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |