JP5474666B2 - 液処理装置、液処理方法、プログラムおよびプログラム記録媒体 - Google Patents

液処理装置、液処理方法、プログラムおよびプログラム記録媒体 Download PDF

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Publication number
JP5474666B2
JP5474666B2 JP2010127914A JP2010127914A JP5474666B2 JP 5474666 B2 JP5474666 B2 JP 5474666B2 JP 2010127914 A JP2010127914 A JP 2010127914A JP 2010127914 A JP2010127914 A JP 2010127914A JP 5474666 B2 JP5474666 B2 JP 5474666B2
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Prior art keywords
liquid
main
pipe
main pipe
processing
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JP2010127914A
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English (en)
Japanese (ja)
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JP2011049526A (ja
JP2011049526A5 (enExample
Inventor
本 和 久 松
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2010127914A priority Critical patent/JP5474666B2/ja
Priority to KR1020100070029A priority patent/KR101470673B1/ko
Priority to CN201010239045.6A priority patent/CN101989537B/zh
Priority to US12/843,948 priority patent/US8425686B2/en
Priority to TW099125421A priority patent/TWI460775B/zh
Publication of JP2011049526A publication Critical patent/JP2011049526A/ja
Publication of JP2011049526A5 publication Critical patent/JP2011049526A5/ja
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Publication of JP5474666B2 publication Critical patent/JP5474666B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Devices For Dispensing Beverages (AREA)
JP2010127914A 2009-07-31 2010-06-03 液処理装置、液処理方法、プログラムおよびプログラム記録媒体 Active JP5474666B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010127914A JP5474666B2 (ja) 2009-07-31 2010-06-03 液処理装置、液処理方法、プログラムおよびプログラム記録媒体
KR1020100070029A KR101470673B1 (ko) 2009-07-31 2010-07-20 액처리 장치, 액처리 방법, 및 프로그램 기록 매체
CN201010239045.6A CN101989537B (zh) 2009-07-31 2010-07-23 液体处理装置和液体处理方法
US12/843,948 US8425686B2 (en) 2009-07-31 2010-07-27 Liquid processing apparatus, liquid processing method, and recording medium having program stored therein
TW099125421A TWI460775B (zh) 2009-07-31 2010-07-30 Liquid handling device, liquid handling method, computer program product and computer readable recording medium

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009179428 2009-07-31
JP2009179428 2009-07-31
JP2010127914A JP5474666B2 (ja) 2009-07-31 2010-06-03 液処理装置、液処理方法、プログラムおよびプログラム記録媒体

Publications (3)

Publication Number Publication Date
JP2011049526A JP2011049526A (ja) 2011-03-10
JP2011049526A5 JP2011049526A5 (enExample) 2012-06-28
JP5474666B2 true JP5474666B2 (ja) 2014-04-16

Family

ID=43525832

Family Applications (1)

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JP2010127914A Active JP5474666B2 (ja) 2009-07-31 2010-06-03 液処理装置、液処理方法、プログラムおよびプログラム記録媒体

Country Status (5)

Country Link
US (1) US8425686B2 (enExample)
JP (1) JP5474666B2 (enExample)
KR (1) KR101470673B1 (enExample)
CN (1) CN101989537B (enExample)
TW (1) TWI460775B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6227895B2 (ja) * 2013-05-24 2017-11-08 株式会社荏原製作所 基板処理装置
JP6352143B2 (ja) * 2013-11-13 2018-07-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6090144B2 (ja) 2013-12-13 2017-03-08 東京エレクトロン株式会社 切替弁、液処理装置
JP6482979B2 (ja) * 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
CN109127599B (zh) * 2018-07-06 2023-09-26 江苏星A包装机械集团有限公司 用于旋转式洗瓶机的双通道介质分配机构
KR102087773B1 (ko) * 2018-07-13 2020-04-23 씨앤지하이테크 주식회사 액체 혼합 공급장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242841A (en) * 1979-07-30 1981-01-06 Ushakov Vladimir F Apparatus for preparing and feeding an abrasive-containing suspension into the zone of action of work tools of polishing and finishing lathes
JP2739419B2 (ja) 1992-09-25 1998-04-15 大日本スクリーン製造株式会社 基板処理装置
JPH1076153A (ja) * 1996-09-05 1998-03-24 Fujitsu Ltd 液体自動供給装置及びその異常検出装置
JP3841945B2 (ja) * 1997-10-29 2006-11-08 大日本スクリーン製造株式会社 基板処理装置
US6168048B1 (en) * 1998-09-22 2001-01-02 American Air Liquide, Inc. Methods and systems for distributing liquid chemicals
JP2002096030A (ja) * 2000-09-26 2002-04-02 Shibaura Mechatronics Corp ノズルを用いた処理装置
US6783429B2 (en) * 2001-08-17 2004-08-31 The Boc Group, Inc. Apparatus and method for sampling a chemical-mechanical polishing slurry
US6579446B1 (en) * 2002-04-04 2003-06-17 Agrimond, Llc Multi-process disinfectant delivery control system
JP2005175183A (ja) * 2003-12-11 2005-06-30 Kitz Sct:Kk 液体加圧機構及びこれを用いた液体制御装置と液体制御方法
JP2005175228A (ja) * 2003-12-11 2005-06-30 Dainippon Screen Mfg Co Ltd レジスト剥離方法およびレジスト剥離装置
KR100598913B1 (ko) * 2004-09-02 2006-07-10 세메스 주식회사 약액 혼합 공급 장치 및 그 방법
JP2007123393A (ja) * 2005-10-26 2007-05-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4940123B2 (ja) * 2007-12-21 2012-05-30 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TW201133578A (en) 2011-10-01
US20110023912A1 (en) 2011-02-03
KR101470673B1 (ko) 2014-12-08
JP2011049526A (ja) 2011-03-10
CN101989537A (zh) 2011-03-23
US8425686B2 (en) 2013-04-23
CN101989537B (zh) 2014-04-16
TWI460775B (zh) 2014-11-11
KR20110013239A (ko) 2011-02-09

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