CN101827766A - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN101827766A
CN101827766A CN200880112243A CN200880112243A CN101827766A CN 101827766 A CN101827766 A CN 101827766A CN 200880112243 A CN200880112243 A CN 200880112243A CN 200880112243 A CN200880112243 A CN 200880112243A CN 101827766 A CN101827766 A CN 101827766A
Authority
CN
China
Prior art keywords
substrate
chamber
substrate processing
conveying
common transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880112243A
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English (en)
Chinese (zh)
Inventor
井野英二
渡边亮
芦田肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evatech Co Ltd
Original Assignee
Evatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evatech Co Ltd filed Critical Evatech Co Ltd
Publication of CN101827766A publication Critical patent/CN101827766A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3214—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicle
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CN200880112243A 2007-10-19 2008-09-29 基板处理装置 Pending CN101827766A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-272694 2007-10-19
JP2007272694A JP2009105081A (ja) 2007-10-19 2007-10-19 基板処理装置
PCT/JP2008/002708 WO2009050849A1 (ja) 2007-10-19 2008-09-29 基板処理装置

Publications (1)

Publication Number Publication Date
CN101827766A true CN101827766A (zh) 2010-09-08

Family

ID=40567138

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880112243A Pending CN101827766A (zh) 2007-10-19 2008-09-29 基板处理装置

Country Status (5)

Country Link
US (1) US20100243163A1 (https=)
EP (1) EP2213595A1 (https=)
JP (1) JP2009105081A (https=)
CN (1) CN101827766A (https=)
WO (1) WO2009050849A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105177514A (zh) * 2014-05-28 2015-12-23 佳能安内华股份有限公司 基板处理装置
CN105900215A (zh) * 2013-11-15 2016-08-24 科恩艾斯恩株式会社 原子层沉积装置及方法
CN107265839A (zh) * 2016-04-07 2017-10-20 塔工程有限公司 划片设备
CN110504331A (zh) * 2019-07-29 2019-11-26 中建材轻工业自动化研究所有限公司 一种全自动光伏背板玻璃生产线
CN118629925A (zh) * 2023-03-10 2024-09-10 株式会社斯库林集团 基板姿势变更装置以及基板处理装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102859655A (zh) * 2010-04-30 2013-01-02 应用材料公司 垂直直列cvd系统
WO2011142351A1 (ja) * 2010-05-12 2011-11-17 シャープ株式会社 基板載置台車
KR101036123B1 (ko) * 2010-06-10 2011-05-23 에스엔유 프리시젼 주식회사 박막 증착 장치
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
WO2012050081A1 (ja) * 2010-10-12 2012-04-19 株式会社カネカ 有機ｅｌ素子の製造装置
JP5533708B2 (ja) * 2011-01-31 2014-06-25 株式会社Ｉｈｉ アンテナ搬送体、アレイアンテナ式プラズマｃｖｄ装置、並びに、アレイアンテナ式プラズマｃｖｄ装置のアンテナおよび基板搬送方法
DE102011085789B4 (de) * 2011-11-04 2015-02-12 Von Ardenne Gmbh Vertikale Durchlaufbeschichtungsanlage zur kontinuierlichen Vakuumbeschichtung von Substraten
JP5939817B2 (ja) * 2012-01-30 2016-06-22 株式会社アルバック 成膜装置
JP6211086B2 (ja) * 2012-09-10 2017-10-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板処理システム及び基板を処理する方法
KR101488944B1 (ko) 2012-09-24 2015-02-06 주식회사 선익시스템 증발물질 공급장치 및 이를 구비한 증착장치
KR101394367B1 (ko) 2012-09-27 2014-05-27 주식회사 선익시스템 기판처리장치 및 기판처리방법
KR101405102B1 (ko) 2012-10-04 2014-06-10 주식회사 선익시스템 기판처리장치 및 기판처리방법
JP5942937B2 (ja) * 2013-07-26 2016-06-29 トヨタ自動車株式会社 プラズマ成膜装置及びプラズマ成膜方法
JP6463220B2 (ja) * 2015-05-21 2019-01-30 東京エレクトロン株式会社 処理システム
JP6846943B2 (ja) * 2017-02-10 2021-03-24 東京エレクトロン株式会社 塗布装置、および塗布方法
DE102019102492A1 (de) * 2019-01-31 2020-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Bearbeitung von Wafern
DE102020100171B3 (de) * 2020-01-07 2021-07-01 Cemecon Ag Vorrichtung zum Halten von Werkstücken, Beschichtungsanlage sowie Verfahren zum Beschichten eines Werkstücks
TWI737520B (zh) * 2020-08-14 2021-08-21 友達光電股份有限公司 顯示面板
IT202000024337A1 (it) * 2020-10-15 2022-04-15 Bottero Spa Metodo e navetta per lo spostamento di una lastra di vetro
DE102021123777A1 (de) * 2021-09-14 2023-03-16 Schott Ag Anlage und Verfahren zum mehrschrittigen Verarbeiten flächiger Substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08196894A (ja) * 1995-01-25 1996-08-06 Tokki Kk 真空装置の小型、低価格化のための構成方法及び、材料の搬送形態
JP3582330B2 (ja) * 1997-11-14 2004-10-27 東京エレクトロン株式会社 処理装置及びこれを用いた処理システム
JP2002246435A (ja) * 2001-02-16 2002-08-30 Ishikawajima Harima Heavy Ind Co Ltd 基板処理装置と基板処理方法
JP2003192127A (ja) 2002-12-03 2003-07-09 Takehide Hayashi フラットパネル枚葉搬送システム

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105900215A (zh) * 2013-11-15 2016-08-24 科恩艾斯恩株式会社 原子层沉积装置及方法
CN105177514A (zh) * 2014-05-28 2015-12-23 佳能安内华股份有限公司 基板处理装置
CN105177514B (zh) * 2014-05-28 2018-04-10 佳能安内华股份有限公司 基板处理装置
CN107265839A (zh) * 2016-04-07 2017-10-20 塔工程有限公司 划片设备
CN107265839B (zh) * 2016-04-07 2021-07-06 塔工程有限公司 划片设备
CN110504331A (zh) * 2019-07-29 2019-11-26 中建材轻工业自动化研究所有限公司 一种全自动光伏背板玻璃生产线
CN118629925A (zh) * 2023-03-10 2024-09-10 株式会社斯库林集团 基板姿势变更装置以及基板处理装置

Also Published As

Publication number Publication date
US20100243163A1 (en) 2010-09-30
WO2009050849A1 (ja) 2009-04-23
EP2213595A1 (en) 2010-08-04
JP2009105081A (ja) 2009-05-14

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Application publication date: 20100908