WO2009050849A1 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
WO2009050849A1
WO2009050849A1 PCT/JP2008/002708 JP2008002708W WO2009050849A1 WO 2009050849 A1 WO2009050849 A1 WO 2009050849A1 JP 2008002708 W JP2008002708 W JP 2008002708W WO 2009050849 A1 WO2009050849 A1 WO 2009050849A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate processing
processing apparatus
transfer chamber
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002708
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Eiji Ino
Akira Watanabe
Hajime Ashida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evatech Co Ltd
Original Assignee
Evatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evatech Co Ltd filed Critical Evatech Co Ltd
Priority to CN200880112243A priority Critical patent/CN101827766A/zh
Priority to EP08839220A priority patent/EP2213595A1/en
Priority to US12/682,641 priority patent/US20100243163A1/en
Publication of WO2009050849A1 publication Critical patent/WO2009050849A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3214—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicle
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
PCT/JP2008/002708 2007-10-19 2008-09-29 基板処理装置 Ceased WO2009050849A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880112243A CN101827766A (zh) 2007-10-19 2008-09-29 基板处理装置
EP08839220A EP2213595A1 (en) 2007-10-19 2008-09-29 Substrate processing apparatus
US12/682,641 US20100243163A1 (en) 2007-10-19 2008-09-29 Substrate processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-272694 2007-10-19
JP2007272694A JP2009105081A (ja) 2007-10-19 2007-10-19 基板処理装置

Publications (1)

Publication Number Publication Date
WO2009050849A1 true WO2009050849A1 (ja) 2009-04-23

Family

ID=40567138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002708 Ceased WO2009050849A1 (ja) 2007-10-19 2008-09-29 基板処理装置

Country Status (5)

Country Link
US (1) US20100243163A1 (https=)
EP (1) EP2213595A1 (https=)
JP (1) JP2009105081A (https=)
CN (1) CN101827766A (https=)
WO (1) WO2009050849A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012050081A1 (ja) * 2010-10-12 2012-04-19 株式会社カネカ 有機ｅｌ素子の製造装置
US9922854B2 (en) * 2010-04-30 2018-03-20 Applied Materials, Inc. Vertical inline CVD system
TWI750034B (zh) * 2020-08-14 2021-12-11 友達光電股份有限公司 濺鍍設備及其操作方法
JP2023510710A (ja) * 2020-01-07 2023-03-15 セメコン アーゲー プロセスチャンバー用の基板受取り装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142351A1 (ja) * 2010-05-12 2011-11-17 シャープ株式会社 基板載置台車
KR101036123B1 (ko) * 2010-06-10 2011-05-23 에스엔유 프리시젼 주식회사 박막 증착 장치
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
JP5533708B2 (ja) * 2011-01-31 2014-06-25 株式会社Ｉｈｉ アンテナ搬送体、アレイアンテナ式プラズマｃｖｄ装置、並びに、アレイアンテナ式プラズマｃｖｄ装置のアンテナおよび基板搬送方法
DE102011085789B4 (de) * 2011-11-04 2015-02-12 Von Ardenne Gmbh Vertikale Durchlaufbeschichtungsanlage zur kontinuierlichen Vakuumbeschichtung von Substraten
JP5939817B2 (ja) * 2012-01-30 2016-06-22 株式会社アルバック 成膜装置
JP6211086B2 (ja) * 2012-09-10 2017-10-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板処理システム及び基板を処理する方法
KR101488944B1 (ko) 2012-09-24 2015-02-06 주식회사 선익시스템 증발물질 공급장치 및 이를 구비한 증착장치
KR101394367B1 (ko) 2012-09-27 2014-05-27 주식회사 선익시스템 기판처리장치 및 기판처리방법
KR101405102B1 (ko) 2012-10-04 2014-06-10 주식회사 선익시스템 기판처리장치 및 기판처리방법
JP5942937B2 (ja) * 2013-07-26 2016-06-29 トヨタ自動車株式会社 プラズマ成膜装置及びプラズマ成膜方法
KR101486937B1 (ko) * 2013-11-15 2015-01-29 코닉이앤씨 주식회사 원자층 증착 장치 및 방법
CN105177514B (zh) * 2014-05-28 2018-04-10 佳能安内华股份有限公司 基板处理装置
JP6463220B2 (ja) * 2015-05-21 2019-01-30 東京エレクトロン株式会社 処理システム
KR102605917B1 (ko) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 스크라이빙 장치
JP6846943B2 (ja) * 2017-02-10 2021-03-24 東京エレクトロン株式会社 塗布装置、および塗布方法
DE102019102492A1 (de) * 2019-01-31 2020-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Bearbeitung von Wafern
CN110504331B (zh) * 2019-07-29 2021-03-23 中建材智能自动化研究院有限公司 一种全自动光伏背板玻璃生产线
IT202000024337A1 (it) * 2020-10-15 2022-04-15 Bottero Spa Metodo e navetta per lo spostamento di una lastra di vetro
DE102021123777A1 (de) * 2021-09-14 2023-03-16 Schott Ag Anlage und Verfahren zum mehrschrittigen Verarbeiten flächiger Substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08196894A (ja) * 1995-01-25 1996-08-06 Tokki Kk 真空装置の小型、低価格化のための構成方法及び、材料の搬送形態
JP2002246435A (ja) * 2001-02-16 2002-08-30 Ishikawajima Harima Heavy Ind Co Ltd 基板処理装置と基板処理方法
JP2003192127A (ja) 2002-12-03 2003-07-09 Takehide Hayashi フラットパネル枚葉搬送システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3582330B2 (ja) * 1997-11-14 2004-10-27 東京エレクトロン株式会社 処理装置及びこれを用いた処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08196894A (ja) * 1995-01-25 1996-08-06 Tokki Kk 真空装置の小型、低価格化のための構成方法及び、材料の搬送形態
JP2002246435A (ja) * 2001-02-16 2002-08-30 Ishikawajima Harima Heavy Ind Co Ltd 基板処理装置と基板処理方法
JP2003192127A (ja) 2002-12-03 2003-07-09 Takehide Hayashi フラットパネル枚葉搬送システム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9922854B2 (en) * 2010-04-30 2018-03-20 Applied Materials, Inc. Vertical inline CVD system
WO2012050081A1 (ja) * 2010-10-12 2012-04-19 株式会社カネカ 有機ｅｌ素子の製造装置
JP5843779B2 (ja) * 2010-10-12 2016-01-13 株式会社カネカ 有機ｅｌ素子の製造装置
JP2023510710A (ja) * 2020-01-07 2023-03-15 セメコン アーゲー プロセスチャンバー用の基板受取り装置
JP7709441B2 (ja) 2020-01-07 2025-07-16 セメコン アーゲー コーティングシステム、コーティング方法及びワークピースの保持装置
TWI750034B (zh) * 2020-08-14 2021-12-11 友達光電股份有限公司 濺鍍設備及其操作方法

Also Published As

Publication number Publication date
CN101827766A (zh) 2010-09-08
US20100243163A1 (en) 2010-09-30
EP2213595A1 (en) 2010-08-04
JP2009105081A (ja) 2009-05-14

Similar Documents

Publication Publication Date Title
WO2009050849A1 (ja) 基板処理装置
WO2009072426A1 (ja) 真空処理装置及び基板処理方法
WO2008120716A1 (ja) 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体
WO2010008211A3 (ko) 배치식 열처리 장치 및 이에 적용되는 히터
TW200710253A (en) Integrated metrology tools for monitoring and controlling large area substrate processing chambers
WO2010102187A3 (en) Stacked load-lock apparatus and method for high throughput solar cell manufacturing
PL373857A1 (en) System for substrate processing with meniscus, vacuum, ipa vapor, drying manifold
WO2009060541A1 (ja) インライン型ウェハ搬送装置
TW200715448A (en) Vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device manufacturing system
WO2006076253A3 (en) Plasma processing system and baffle assembly for use in plasma processing system
WO2008052164A3 (en) Multi-chamber air distribution support surface product and method
WO2008014136A3 (en) Octagon transfer chamber
WO2007032011A3 (en) A system for enhancing performance of conveyors
WO2009004977A1 (ja) 基板処理装置、基板処理方法、並びに、記憶媒体
WO2009105425A3 (en) Water-contaminant separation system
WO2006056318A8 (de) Trockner
WO2007126767A3 (en) Chucking system comprising an array of fluid chambers
WO2008027299A3 (en) Article with multiple surface depressions and method for making the same
JP2010153808A5 (ja) 基板処理装置及び半導体装置の製造方法
WO2010128811A3 (ko) 박막 증착 장치 및 이를 구비하는 박막 증착 시스템
Balmuş et al. Biharmonic maps between warped product manifolds
WO2007103887A3 (en) Semiconductor manufacturing process modules
WO2008070209A3 (en) High flow surface mount components
TW200714538A (en) Movable transfer chamber and substrate-treating apparatus including the same
GB0723973D0 (en) Hall sensor array

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880112243.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08839220

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12682641

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008839220

Country of ref document: EP