CN101802975B - 在用于通过一种或多种处理流体来处理微电子工件的工具中的阻挡板和文氏管容纳系统的漂洗方法以及相关装置 - Google Patents

在用于通过一种或多种处理流体来处理微电子工件的工具中的阻挡板和文氏管容纳系统的漂洗方法以及相关装置 Download PDF

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Publication number
CN101802975B
CN101802975B CN2008801020518A CN200880102051A CN101802975B CN 101802975 B CN101802975 B CN 101802975B CN 2008801020518 A CN2008801020518 A CN 2008801020518A CN 200880102051 A CN200880102051 A CN 200880102051A CN 101802975 B CN101802975 B CN 101802975B
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liquid
workpiece
processing
baffle structure
rinsing
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CN101802975A (zh
Inventor
D·德科雷克
J·D·科林斯
T·A·盖斯特
A·D·罗斯
R·E·威廉森
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Tel Manufacturing and Engineering of America Inc
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FSI International Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN2008801020518A 2007-08-07 2008-07-25 在用于通过一种或多种处理流体来处理微电子工件的工具中的阻挡板和文氏管容纳系统的漂洗方法以及相关装置 Expired - Fee Related CN101802975B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96384007P 2007-08-07 2007-08-07
US60/963,840 2007-08-07
PCT/US2008/009015 WO2009020524A1 (en) 2007-08-07 2008-07-25 Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses

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CN101802975A CN101802975A (zh) 2010-08-11
CN101802975B true CN101802975B (zh) 2012-10-03

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CN2008801020518A Expired - Fee Related CN101802975B (zh) 2007-08-07 2008-07-25 在用于通过一种或多种处理流体来处理微电子工件的工具中的阻挡板和文氏管容纳系统的漂洗方法以及相关装置

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US (1) US7913706B2 (enExample)
JP (1) JP4938892B2 (enExample)
KR (1) KR101060664B1 (enExample)
CN (1) CN101802975B (enExample)
TW (1) TWI462146B (enExample)
WO (1) WO2009020524A1 (enExample)

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JP4938892B2 (ja) 2007-08-07 2012-05-23 エフエスアイ インターナショナル インコーポレーテッド 一種類以上の処理流体により超小型電子半製品をプロセス処理すべく使用されるツールにおける隔壁板およびベンチュリ状封じ込めシステムのための洗浄方法および関連装置
KR20110005699A (ko) 2008-05-09 2011-01-18 에프에스아이 인터내쇼날 인크. 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
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TWI462146B (zh) 2014-11-21
JP2010535618A (ja) 2010-11-25
US7913706B2 (en) 2011-03-29
KR101060664B1 (ko) 2011-08-31
US20090038647A1 (en) 2009-02-12
KR20100045465A (ko) 2010-05-03
TW200922863A (en) 2009-06-01
WO2009020524A1 (en) 2009-02-12
JP4938892B2 (ja) 2012-05-23
CN101802975A (zh) 2010-08-11

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