CN101739923B - 被检查基板的对准装置 - Google Patents

被检查基板的对准装置 Download PDF

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Publication number
CN101739923B
CN101739923B CN2009102094036A CN200910209403A CN101739923B CN 101739923 B CN101739923 B CN 101739923B CN 2009102094036 A CN2009102094036 A CN 2009102094036A CN 200910209403 A CN200910209403 A CN 200910209403A CN 101739923 B CN101739923 B CN 101739923B
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China
Prior art keywords
axis
substrate
axle
mentioned
inspected
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Chinese (zh)
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CN101739923A (zh
Inventor
工藤隆善
小森隆行
今村晓
白户顺
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Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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Publication of CN101739923A publication Critical patent/CN101739923A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Automatic Assembly (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009102094036A 2008-11-17 2009-10-27 被检查基板的对准装置 Active CN101739923B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008293669A JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置
JP2008-293669 2008-11-17

Publications (2)

Publication Number Publication Date
CN101739923A CN101739923A (zh) 2010-06-16
CN101739923B true CN101739923B (zh) 2012-10-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009102094036A Active CN101739923B (zh) 2008-11-17 2009-10-27 被检查基板的对准装置

Country Status (4)

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JP (1) JP5300431B2 (enExample)
KR (1) KR101013110B1 (enExample)
CN (1) CN101739923B (enExample)
TW (1) TWI396246B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
KR101155961B1 (ko) * 2011-11-17 2012-06-18 에스엔티코리아 주식회사 컨베이어가 1축을 대체한 2축 구동 검사장치
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
KR101616564B1 (ko) * 2014-09-24 2016-04-29 주식회사 디이엔티 프로브 이동장치
CN104459439B (zh) * 2014-12-08 2019-02-19 昆山精讯电子技术有限公司 触摸屏的自动检测设备
CN106370656B (zh) * 2015-07-23 2019-03-05 旭东机械工业股份有限公司 自动化显微取像设备及取像方法
CN108780122B (zh) * 2015-12-28 2019-09-03 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
US10324112B2 (en) * 2016-08-11 2019-06-18 Intel Corporation Package testing system and method with contact alignment
CN106249449B (zh) * 2016-08-29 2019-07-23 武汉华星光电技术有限公司 防夹碎基板对位装置
CN108242410B (zh) * 2018-01-04 2020-05-19 苏州德睿联自动化科技有限公司 电池串检测校正装置及方法
JP7050359B2 (ja) * 2018-02-26 2022-04-08 ヤマハファインテック株式会社 位置決め装置及び位置決め方法
JP6956030B2 (ja) * 2018-02-28 2021-10-27 東京エレクトロン株式会社 検査システム
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
IT201800010440A1 (it) * 2018-11-20 2020-05-20 Nuova Sima Spa Dispositivo di raddrizzamento per raddrizzare un articolo lastriforme rispetto ad una direzione di movimentazione
CN110320686B (zh) * 2019-07-15 2023-07-25 中导光电设备股份有限公司 Uled屏幕基板检测/测量设备的预对位装置及其使用方法
CN111999919B (zh) * 2020-08-31 2023-05-05 晟光科技股份有限公司 一种lcd显示屏定位检测机构
CN112720384B (zh) * 2020-12-21 2022-08-26 苏州科韵激光科技有限公司 显示面板对准装置和显示面板对准方法
KR102591202B1 (ko) * 2021-03-26 2023-10-19 (주)지엠더블유 자동 위치설정 기능을 구비한 무선기기 검사장치
CN114536480B (zh) * 2022-03-02 2023-05-23 重庆天荣日盛家居科技有限公司 多工位木质家居板材切割设备

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CN1629686A (zh) * 2003-12-16 2005-06-22 Lg.菲利浦Lcd株式会社 液晶显示面板的制造装置及其制造方法
CN101044407A (zh) * 2004-10-20 2007-09-26 日本发条株式会社 接触单元及检查系统

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JPH0817194B2 (ja) * 1987-09-29 1996-02-21 東京エレクトロン株式会社 液晶表示体プローブ装置及び液晶表示体の位置合わせ方法
KR100222614B1 (ko) * 1997-08-20 1999-10-01 윤종용 액정 표시판의 위치 결정 장치
JPH11304884A (ja) * 1998-04-24 1999-11-05 Micronics Japan Co Ltd 大型回路板用プローバ
JP2001050858A (ja) * 1999-08-04 2001-02-23 Micronics Japan Co Ltd 表示用パネル基板の検査装置
TW511146B (en) * 2000-05-31 2002-11-21 Nikon Corp Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
KR100488535B1 (ko) * 2002-07-20 2005-05-11 엘지.필립스 엘시디 주식회사 액정토출장치 및 토출방법
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JP2006245174A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd 位置決めステージ、パターン形成装置、検査装置、位置補正方法、基板支持部
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WO2007049704A1 (ja) * 2005-10-28 2007-05-03 Nikon Corporation デバイス製造処理装置間の接続装置及び接続方法、プログラム、デバイス製造処理システム、露光装置及び露光方法、並びに測定検査装置及び測定検査方法
JP4808135B2 (ja) 2006-11-09 2011-11-02 株式会社日本マイクロニクス プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置

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CN1629686A (zh) * 2003-12-16 2005-06-22 Lg.菲利浦Lcd株式会社 液晶显示面板的制造装置及其制造方法
CN101044407A (zh) * 2004-10-20 2007-09-26 日本发条株式会社 接触单元及检查系统

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Also Published As

Publication number Publication date
KR101013110B1 (ko) 2011-02-14
CN101739923A (zh) 2010-06-16
JP2010121969A (ja) 2010-06-03
TW201025477A (en) 2010-07-01
TWI396246B (zh) 2013-05-11
KR20100055321A (ko) 2010-05-26
JP5300431B2 (ja) 2013-09-25

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