JP5300431B2 - 被検査基板のアライメント装置 - Google Patents

被検査基板のアライメント装置 Download PDF

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Publication number
JP5300431B2
JP5300431B2 JP2008293669A JP2008293669A JP5300431B2 JP 5300431 B2 JP5300431 B2 JP 5300431B2 JP 2008293669 A JP2008293669 A JP 2008293669A JP 2008293669 A JP2008293669 A JP 2008293669A JP 5300431 B2 JP5300431 B2 JP 5300431B2
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JP
Japan
Prior art keywords
axis
substrate
inspected
stage
alignment
Prior art date
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Active
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JP2008293669A
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English (en)
Japanese (ja)
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JP2010121969A5 (enExample
JP2010121969A (ja
Inventor
隆善 工藤
隆行 小森
暁 今村
順 白戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2008293669A priority Critical patent/JP5300431B2/ja
Priority to KR1020090090814A priority patent/KR101013110B1/ko
Priority to TW098133718A priority patent/TWI396246B/zh
Priority to CN2009102094036A priority patent/CN101739923B/zh
Publication of JP2010121969A publication Critical patent/JP2010121969A/ja
Publication of JP2010121969A5 publication Critical patent/JP2010121969A5/ja
Application granted granted Critical
Publication of JP5300431B2 publication Critical patent/JP5300431B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Automatic Assembly (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008293669A 2008-11-17 2008-11-17 被検査基板のアライメント装置 Active JP5300431B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008293669A JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置
KR1020090090814A KR101013110B1 (ko) 2008-11-17 2009-09-25 피검사기판의 얼라인먼트 장치
TW098133718A TWI396246B (zh) 2008-11-17 2009-10-05 被檢查基板的對準裝置
CN2009102094036A CN101739923B (zh) 2008-11-17 2009-10-27 被检查基板的对准装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008293669A JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置

Publications (3)

Publication Number Publication Date
JP2010121969A JP2010121969A (ja) 2010-06-03
JP2010121969A5 JP2010121969A5 (enExample) 2011-08-11
JP5300431B2 true JP5300431B2 (ja) 2013-09-25

Family

ID=42279817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008293669A Active JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置

Country Status (4)

Country Link
JP (1) JP5300431B2 (enExample)
KR (1) KR101013110B1 (enExample)
CN (1) CN101739923B (enExample)
TW (1) TWI396246B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
KR101155961B1 (ko) * 2011-11-17 2012-06-18 에스엔티코리아 주식회사 컨베이어가 1축을 대체한 2축 구동 검사장치
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
KR101616564B1 (ko) * 2014-09-24 2016-04-29 주식회사 디이엔티 프로브 이동장치
CN104459439B (zh) * 2014-12-08 2019-02-19 昆山精讯电子技术有限公司 触摸屏的自动检测设备
CN106370656B (zh) * 2015-07-23 2019-03-05 旭东机械工业股份有限公司 自动化显微取像设备及取像方法
CN108780122B (zh) * 2015-12-28 2019-09-03 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
US10324112B2 (en) * 2016-08-11 2019-06-18 Intel Corporation Package testing system and method with contact alignment
CN106249449B (zh) * 2016-08-29 2019-07-23 武汉华星光电技术有限公司 防夹碎基板对位装置
CN108242410B (zh) * 2018-01-04 2020-05-19 苏州德睿联自动化科技有限公司 电池串检测校正装置及方法
JP7050359B2 (ja) * 2018-02-26 2022-04-08 ヤマハファインテック株式会社 位置決め装置及び位置決め方法
JP6956030B2 (ja) * 2018-02-28 2021-10-27 東京エレクトロン株式会社 検査システム
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
IT201800010440A1 (it) * 2018-11-20 2020-05-20 Nuova Sima Spa Dispositivo di raddrizzamento per raddrizzare un articolo lastriforme rispetto ad una direzione di movimentazione
CN110320686B (zh) * 2019-07-15 2023-07-25 中导光电设备股份有限公司 Uled屏幕基板检测/测量设备的预对位装置及其使用方法
CN111999919B (zh) * 2020-08-31 2023-05-05 晟光科技股份有限公司 一种lcd显示屏定位检测机构
CN112720384B (zh) * 2020-12-21 2022-08-26 苏州科韵激光科技有限公司 显示面板对准装置和显示面板对准方法
KR102591202B1 (ko) * 2021-03-26 2023-10-19 (주)지엠더블유 자동 위치설정 기능을 구비한 무선기기 검사장치
CN114536480B (zh) * 2022-03-02 2023-05-23 重庆天荣日盛家居科技有限公司 多工位木质家居板材切割设备

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JPH0817194B2 (ja) * 1987-09-29 1996-02-21 東京エレクトロン株式会社 液晶表示体プローブ装置及び液晶表示体の位置合わせ方法
KR100222614B1 (ko) * 1997-08-20 1999-10-01 윤종용 액정 표시판의 위치 결정 장치
JPH11304884A (ja) * 1998-04-24 1999-11-05 Micronics Japan Co Ltd 大型回路板用プローバ
JP2001050858A (ja) * 1999-08-04 2001-02-23 Micronics Japan Co Ltd 表示用パネル基板の検査装置
TW511146B (en) * 2000-05-31 2002-11-21 Nikon Corp Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
KR100488535B1 (ko) * 2002-07-20 2005-05-11 엘지.필립스 엘시디 주식회사 액정토출장치 및 토출방법
KR100960472B1 (ko) * 2003-12-16 2010-05-28 엘지디스플레이 주식회사 액정 표시패널의 제조장치 및 그 제조방법
KR101191057B1 (ko) * 2004-08-19 2012-10-15 가부시키가이샤 니콘 얼라인먼트 정보 표시 방법과 그 프로그램, 얼라인먼트방법, 노광 방법, 디바이스 제조 방법, 표시 시스템, 표시장치, 프로그램 및 측정/검사 장치
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム
JP2006245174A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd 位置決めステージ、パターン形成装置、検査装置、位置補正方法、基板支持部
JP2006240015A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd パターン形成装置、アライメント装置、基板処理装置、パターン形成方法、基板処理方法
WO2007049704A1 (ja) * 2005-10-28 2007-05-03 Nikon Corporation デバイス製造処理装置間の接続装置及び接続方法、プログラム、デバイス製造処理システム、露光装置及び露光方法、並びに測定検査装置及び測定検査方法
JP4808135B2 (ja) 2006-11-09 2011-11-02 株式会社日本マイクロニクス プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置

Also Published As

Publication number Publication date
KR101013110B1 (ko) 2011-02-14
CN101739923A (zh) 2010-06-16
JP2010121969A (ja) 2010-06-03
TW201025477A (en) 2010-07-01
CN101739923B (zh) 2012-10-03
TWI396246B (zh) 2013-05-11
KR20100055321A (ko) 2010-05-26

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