CN101690442A - 具有屏蔽及散热性的高频模块及其制造方法 - Google Patents
具有屏蔽及散热性的高频模块及其制造方法 Download PDFInfo
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Abstract
本发明提供屏蔽性和散热性良好并且容易小型化及薄型化且能够低价制造的高频模块及其制造方法。一种高频模块(1),在基板(2)的主表面上配置包含接地图案(3a)的电路图案及电子部件(4),并在其上设置了树脂成型体(7)及屏蔽层(8),其中,屏蔽层(8)为导电性树脂,并且构成为屏蔽层(8)的下端与接地图案(3a)连接。在制造方法中,使用具有多个单位分区的大面积基板,预先在各单位分区形成电路,并在经过树脂的成型和导电性膏的印刷工序后切开。
Description
技术领域
本发明涉及用于通信设备、信息设备等的高频模块,尤其涉及要求如便携设备的发送用功率放大器等的小型且低价的高频模块及其制造方法。
背景技术
一直以来,对这种高频模块不仅要求对安装基板的散热效率和电磁屏蔽性良好而且要求是小型的。在专利文献1中公开了这样的高频模块,即,安装半导体元件或被动部件,并具备以覆盖所述半导体元件的方式经由导电性热导电性材料连接的导电性热导电材料构成的屏蔽罩,且通过导电性导热材料来连接到接地层。
此外,在专利文献2中公开了这样的模块部件,即,由安装电子部件的形成有电路单元的电路基板、通过树脂按该电路基板的各电路单元覆盖成一体的封装体、以及形成在该封装体的外表面的用于屏蔽的金属层构成,通过由金属粉和热固化性树脂构成的导电性树脂,将该金属层连接至作为电路基板而形成的接地电极上。
专利文献1:日本特开平10-125830号公报
专利文献2:日本特开2005-251827号公报
但是,在专利文献1所公开的高频模块中,来自半导体元件的热经由导电性导热材料从屏蔽罩传递到电路安装基板。此外,半导体元件或被动部件被罩覆盖,因此被遮蔽。但是由于罩是用金属制成的,所以其小型化和薄型化有界限。
此外,在专利文献2所公开的模块部件中,屏蔽用金属层成为5μm~15μm,可使厚度比金属罩薄。但是,该金属层是通过无电解镀和电镀来由厚度5μm~15μm的Cu导体构成的,虽然能够较薄地形成厚度,但要通过镀敷工序来形成,所以要费工夫且为高价。
发明内容
本发明为解决上述问题构思而成,其目的在于提供屏蔽性和散热性良好而且容易小型化和薄型化且能够低价制造的高频模块及其制造方法。
为了解决上述课题,本发明的具有屏蔽及散热性的高频模块,在基板的主表面上配置包含布线及接地图案的电路图案及电子部件,其上设置树脂成型体(resin mold)及屏蔽层,在背面具有从主表面上的电子部件穿过基板地设置的外部输入/输出用端子,在高频模块中,所述屏蔽层由导电性树脂层构成,所述导电性树脂层覆盖所述树脂成型体,其下端与所述接地图案连接。
依据该结构,能够使屏蔽层的厚度薄于传统的金属罩,因此能够减少使用它的整个装置的空间(space),并且使从半导体元件等发生的热有效地发散,因此延长电子部件等的寿命。
本发明的具有屏蔽及散热性的高频模块中,形成所述导电性树脂层的导电性膏(paste)含有金属粉和热固化性树脂,所述金属粉是从由银、铜、镀银铜粉组成的组中选择的1种或2种以上的粉末,所述导电性树脂层具有体积电阻率为1×10-4Ω·cm以下、导热率为5W/m·K以上的高导电性和高导热性。由此得到屏蔽性和散热性的更加优越的高频模块。
本发明的具有屏蔽及散热性的高频模块的制造方法,包括:电路形成工序,在具有规定数目的单位分区的大面积基板的主表面上的各单位分区内配置包含规定的布线及接地图案的电路图案及电子部件;成型工序,除了设置在所述主表面上的各单位分区间端的、配置了接地图案的切割部外,实施树脂成型(resin molding);印刷工序,在所述树脂成型上印刷导电性膏;以及切割工序,在所述切割部切开为各单位分区,所述印刷工序中,使所述导电性膏填充至各单位分区的树脂成型间,且连接至在各单位分区端的切割部露出的接地图案,并以覆盖树脂成型的方式进行印刷,所述切割工序中,在由填充至所述树脂成型间的导电性树脂层和与导电性树脂层连接的接地图案构成的切割部切开为规定数目的单位分区。由此能够在大面积基板上成批地形成多个单位高频模块,因此生产效率良好且单价便宜。
附图说明
图1是表示本发明的具有屏蔽及散热性的高频模块的结构概要的说明图。
图2是本发明的具有屏蔽及散热性的高频模块的制造方法中的电路形成工序的说明图。
图3是本发明的具有屏蔽及散热性的高频模块的制造方法中的成型工序的说明图。
图4是本发明的具有屏蔽及散热性的高频模块的制造方法中的印刷工序和切割工序的说明图。
(符号说明)
1具有屏蔽及散热性的高频模块
2基板
3电路图案
3a接地图案
4电子部件
7树脂成型体
8屏蔽层(导电性树脂层)
9钎焊球
11单位分区
12大面积基板
13切割部
具体实施方式
以下,基于附图,对本发明的实施方式进行说明。图1是本发明的具有屏蔽及散热性的高频模块1的示意图,图2至4是具有屏蔽及散热性的高频模块的制造方法的说明图。
首先,说明具有屏蔽及散热性的高频模块1的结构概要。在图1中,在基板2的主表面2a上,高频模块1利用包含接地图案3a或未图示的信号线等的布线的电路图案3及包含集成电路芯片5或电容器、电感器等的被动部件6(6a、6b、6c)等的电子部件4形成高频电路。此外,在其上实施封入这些电子部件4的树脂成型体7。而且,8是覆盖其上的屏蔽层,下端与接地图案3a连接。
屏蔽层8由导电性树脂构成,具有体积电阻率为1×10-4Ω·cm以下的高导电性,因此从电子部件4放射的不必要的辐射以低阻抗连接至接地图案3a,所以电磁屏蔽效果大。
此外,由于具有导热率为5W/m·K以上的高导热性,将来自集成电路芯片5等的发热经由树脂成型体和屏蔽层有效率地传递到接地图案3a,并加以散热。
用于形成这种屏蔽层的导电性膏的混合例如下。作为热固化性树脂,适当地混合(blend)从环氧树脂、酚醛树脂、醇酸树脂、三聚氰胺树脂、丙烯酸酯树脂、硅树脂中选择的1种或2种以上的树脂而加以使用。从耐热性、密合性的方面来看,优选其中的环氧树脂。
作为金属填料(filler),使用银粉、铜粉、镀银铜粉、镍粉等的金属粉。优选其中的银粉、铜粉、镀银铜粉。
金属填料的形状没有特别的限制,但是例示了树脂状球状、鳞片状等。此外,粒径优选为1μm~50μm,更优选为2μm~16μm。
金属填料只使用1种,混合2种以上也可。
相对于热固化性树脂的100份,混合上述金属填料为400份~1300份,更优选混合500份~1000份。当小于400份时,导热率变低,若超过1300份则有时会因增粘而作业性降低。
本发明中所使用的环氧树脂的固化剂,优选咪唑(imidazole)类固化剂。
作为咪唑类固化剂的例子,可列举出咪唑、2-十一基咪唑、2-十七基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑、1-氰乙基-2-十一基咪唑、2-苯基咪唑、2,4-二氨基-6-[2’-甲基咪唑基-(1’)-乙基-S-三嗪。
相对于100重量比的环氧树脂,混合咪唑类固化剂的优选重量比为1.5~40,更优选的重量比为3~20。当添加份数少于1.5重量比时固化不充分,而超过40重量比时随着时间变化的增粘程度变大,会出现印刷性的降低。此外,在保管过程中因膏增粘而会使作业性恶化。
在基板2的背面2a设有从主表面上的电子部件4穿过基板2地设置的未图示的外部输入/输出用端子,在该端子的前端形成有钎焊球9。
依据该高频模块,能够使导电性膏形成的屏蔽层的厚度最小为20μm,因此能够使屏蔽层的厚度更薄于日本特开平10-125830的金属罩的厚度。此外,如果用粘接性树脂形成导电性树脂层本身,就无需如金属罩或金属镀层那样另外设置与接地图案的粘接剂。
另一方面,虽然如日本特开2005-251827那样能够通过金属镀敷来减薄厚度,但镀敷费工夫且高价,而与之相比,本发明的产品如后述那样能够简单地制造且低价形成。此外,从半导体元件等发生的热的发散良好,因此延长电子部件等的寿命。
接着,基于图2至图4,对该具有屏蔽及散热性的高频模块的制造方法进行说明。
图2是电路形成工序的说明图,图2(a)为正面图,图2(b)为平面图。
在具有规定数目(在此,为了方便说明而设定为4个分区)的单位分区的大面积基板12的主表面上的各单位分区11(11a、11b、11c、11d)内,形成包含规定的接地图案3a或未图示的信号线等的电路图案3,在其上的规定位置上表面安装各电子部件4。
接着,利用众所周知的方法,在穿过大面积基板12的未图示的贯通孔而在背面露出的电子部件4的外部输入/输出端子的前端,形成钎焊球9。
在大面积基板12为多层的情况下,可在最上层的基板上形成规定的接地图案3a,也可以用切割装置切削至形成并压入至多层部分的内层的接地图案处,并在切削部上印刷导电性膏,连接该接地图案端面与屏蔽层。
图3是实施树脂成型的成型工序的说明图,图3(a)为正面图,图3(b)为平面图。
在所述主表面上的各单位分区11a、11b、11c、11d间及周边的接地图案3a上,设置模仿各单位分区的型箱,以覆盖电子部件4上面的方式,例如注入环氧类树脂,放置并固化,形成树脂成型体7。
图4是印刷工序和最后的切割工序的说明图,在该印刷工序中,在所述树脂成型体7上印刷导电性膏,形成屏蔽层8,在该切割工序中,按每个单位分区进行切断,作成高频模块1,图4(a)是正面图,图4(b)是平面图。
导电性膏需要涂敷树脂成型体表层和沟部,但是能够通过一般的网版印刷来形成。实际的印刷可通过1次的印刷来树脂成型,但是也可以通过预先只填埋沟部,接着将整个表层部涂敷印刷的2阶段印刷来形成。
而且,为了避免容易在沟部发生的空穴(void),有效的方法是使用真空印刷机。如此,通过通用技术即网版印刷法,容易形成屏蔽层8。接着,将印刷的导电性膏加热并固化,则如图4(a)所示形成与接地图案3a电连接的用导电性膏形成的屏蔽层8。
从基座取出形成了屏蔽层8的大面积基板,利用切割装置,在图4(b)所示的、上述各单位分区11a、11b、11c、11d间的切割部13切开,从而如图1所示,完成用屏蔽层即导电性树脂层不仅覆盖模块的表面而且也覆盖侧面的高频模块1。
如上所述,在形成屏蔽层8时,能够通过一般的网版印刷来容易形成,因此能够改善金属罩导致的部件庞大和金属镀敷的成本高这两方面的问题,并且能够容易且低价地制造具有屏蔽及散热性的高频模块。
Claims (3)
1.一种具有屏蔽及散热性的高频模块,在基板的主表面上配置包含布线及接地图案的电路图案及电子部件,其上设置树脂成型体及屏蔽层,在背面具有从主表面上的电子部件穿过基板地设置的外部输入/输出用端子,其特征在于,
所述屏蔽层由导电性树脂层构成,
所述导电性树脂层覆盖所述树脂成型体,其下端与所述接地图案连接。
2.如权利要求1所述的具有屏蔽及散热性的高频模块,其特征在于,形成所述导电性树脂层的导电性膏含有金属粉和热固化性树脂,所述金属粉是从由银、铜、镀银铜粉组成的组中选择的1种或2种以上的粉末,所述导电性树脂层具有体积电阻率为1×10-4Ω·cm以下、导热率为5W/m·K以上的高导电性和高导热性。
3.一种具有屏蔽及散热性的高频模块的制造方法,包括:
电路形成工序,在具有规定数目的单位分区的大面积基板的主表面上的各单位分区内配置包含规定的布线及接地图案的电路图案及电子部件;
成型工序,除了设置在所述主表面上的各单位分区间端的、配置了接地图案的切割部外,实施树脂成型;
印刷工序,在所述树脂成型印刷导电性膏;以及
切割工序,在所述切割部上切开为各单位分区,
在所述印刷工序中,使所述导电性膏填充至各单位分区的树脂成型间,加热并固化,且连接至在各单位分区端的切割部露出的接地图案,并以覆盖树脂成型的方式进行印刷,
在所述切割工序中,在由填充至所述树脂成型间的导电性树脂层和与导电性树脂层连接的接地图案构成的切割部切开为规定数目的单位分区。
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TWI434377B (zh) | 2014-04-11 |
TW200917430A (en) | 2009-04-16 |
KR20100045461A (ko) | 2010-05-03 |
CN101690442B (zh) | 2012-10-10 |
JP2009016715A (ja) | 2009-01-22 |
WO2009008243A1 (ja) | 2009-01-15 |
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