JP2009016715A - シールド及び放熱性を有する高周波モジュール及びその製造方法 - Google Patents
シールド及び放熱性を有する高周波モジュール及びその製造方法 Download PDFInfo
- Publication number
- JP2009016715A JP2009016715A JP2007179473A JP2007179473A JP2009016715A JP 2009016715 A JP2009016715 A JP 2009016715A JP 2007179473 A JP2007179473 A JP 2007179473A JP 2007179473 A JP2007179473 A JP 2007179473A JP 2009016715 A JP2009016715 A JP 2009016715A
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- Prior art keywords
- frequency module
- resin
- ground pattern
- dicing
- conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007179473A JP2009016715A (ja) | 2007-07-09 | 2007-07-09 | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
KR1020107002591A KR20100045461A (ko) | 2007-07-09 | 2008-06-13 | 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 |
CN2008800236271A CN101690442B (zh) | 2007-07-09 | 2008-06-13 | 具有屏蔽及散热性的高频模块及其制造方法 |
PCT/JP2008/060836 WO2009008243A1 (ja) | 2007-07-09 | 2008-06-13 | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
TW097125570A TWI434377B (zh) | 2007-07-09 | 2008-07-07 | A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007179473A JP2009016715A (ja) | 2007-07-09 | 2007-07-09 | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011220028A Division JP2012015548A (ja) | 2011-10-04 | 2011-10-04 | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009016715A true JP2009016715A (ja) | 2009-01-22 |
JP2009016715A5 JP2009016715A5 (zh) | 2009-11-19 |
Family
ID=40228422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007179473A Pending JP2009016715A (ja) | 2007-07-09 | 2007-07-09 | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2009016715A (zh) |
KR (1) | KR20100045461A (zh) |
CN (1) | CN101690442B (zh) |
TW (1) | TWI434377B (zh) |
WO (1) | WO2009008243A1 (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010106599A1 (ja) * | 2009-03-19 | 2010-09-23 | パナソニック株式会社 | 回路モジュール及び電子機器 |
WO2010113687A1 (ja) * | 2009-04-02 | 2010-10-07 | タツタ電線株式会社 | シールドおよび放熱性を有する高周波モジュールおよびその製造方法 |
JP2011091574A (ja) * | 2009-10-21 | 2011-05-06 | Sony Corp | 高周波モジュールおよび受信装置 |
WO2012101857A1 (ja) * | 2011-01-28 | 2012-08-02 | 株式会社村田製作所 | モジュール基板 |
JP2012160530A (ja) * | 2011-01-31 | 2012-08-23 | Kyocera Document Solutions Inc | 基板装置 |
JP2012191654A (ja) * | 2012-05-25 | 2012-10-04 | Sony Corp | 高周波モジュールおよび受信装置 |
JP2013247339A (ja) * | 2012-05-29 | 2013-12-09 | Tdk Corp | 電子部品モジュールの製造方法 |
WO2014052796A1 (en) * | 2012-09-28 | 2014-04-03 | Skyworks Solutions, Inc. | Systems and methods for providing intramodule radio frequency isolation |
JPWO2012093690A1 (ja) * | 2011-01-07 | 2014-06-09 | 株式会社村田製作所 | 電子部品モジュールの製造方法、及び電子部品モジュール |
US8937370B2 (en) | 2011-05-25 | 2015-01-20 | Samsung Electronics Co., Ltd. | Memory device and fabricating method thereof |
KR20170013202A (ko) | 2014-06-02 | 2017-02-06 | 다츠다 덴센 가부시키가이샤 | 도전성 접착 필름, 프린트 회로 기판, 및 전자 기기 |
JP7503401B2 (ja) | 2020-03-19 | 2024-06-20 | 太陽誘電株式会社 | コイル部品及び電子機器 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012019091A (ja) * | 2010-07-08 | 2012-01-26 | Sony Corp | モジュールおよび携帯端末 |
CN104159391A (zh) * | 2013-05-15 | 2014-11-19 | 中兴通讯股份有限公司 | 一种用于终端的散热装置及终端 |
JP5527785B1 (ja) * | 2013-08-08 | 2014-06-25 | 太陽誘電株式会社 | 回路モジュール及び回路モジュールの製造方法 |
CN105811891A (zh) * | 2016-04-20 | 2016-07-27 | 佛山臻智微芯科技有限公司 | 减低移动通信多级功率放大器中带内噪声的结构和方法 |
CN106340498B (zh) * | 2016-10-20 | 2018-11-09 | 江苏长电科技股份有限公司 | 一种具有电磁屏蔽接地功能的封装结构及其制造方法 |
US10373917B2 (en) * | 2017-12-05 | 2019-08-06 | Tdk Corporation | Electronic circuit package using conductive sealing material |
CN108493176B (zh) * | 2018-03-27 | 2020-07-10 | 浙江中正智能科技有限公司 | 一种指纹识别芯片装置及其制造方法 |
DE102018116682A1 (de) * | 2018-07-10 | 2020-01-16 | Elringklinger Ag | Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung |
CN112701096A (zh) * | 2020-12-22 | 2021-04-23 | 杰群电子科技(东莞)有限公司 | 一种半导体模组封装工艺及半导体模组 |
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JPH06120362A (ja) * | 1992-10-06 | 1994-04-28 | Kyocera Corp | 半導体素子収納用パッケージ |
JPH06326204A (ja) * | 1993-05-11 | 1994-11-25 | Tomoegawa Paper Co Ltd | 電子部品素子封止用蓋材 |
JP2004172176A (ja) * | 2002-11-18 | 2004-06-17 | Taiyo Yuden Co Ltd | 回路モジュール |
WO2006046713A1 (ja) * | 2004-10-28 | 2006-05-04 | Kyocera Corporation | 電子部品モジュール及び無線通信機器 |
WO2006088127A1 (ja) * | 2005-02-18 | 2006-08-24 | Toyo Ink Manufacturing Co., Ltd. | 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3842229B2 (ja) * | 2003-02-27 | 2006-11-08 | 太陽誘電株式会社 | 回路モジュール |
JP4020874B2 (ja) * | 2003-03-13 | 2007-12-12 | 三洋電機株式会社 | 半導体装置およびその製造方法 |
JP2005019900A (ja) * | 2003-06-27 | 2005-01-20 | Kyocera Corp | 電子装置 |
JP2006286915A (ja) * | 2005-03-31 | 2006-10-19 | Taiyo Yuden Co Ltd | 回路モジュール |
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2007
- 2007-07-09 JP JP2007179473A patent/JP2009016715A/ja active Pending
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2008
- 2008-06-13 WO PCT/JP2008/060836 patent/WO2009008243A1/ja active Application Filing
- 2008-06-13 CN CN2008800236271A patent/CN101690442B/zh active Active
- 2008-06-13 KR KR1020107002591A patent/KR20100045461A/ko active Search and Examination
- 2008-07-07 TW TW097125570A patent/TWI434377B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120362A (ja) * | 1992-10-06 | 1994-04-28 | Kyocera Corp | 半導体素子収納用パッケージ |
JPH06326204A (ja) * | 1993-05-11 | 1994-11-25 | Tomoegawa Paper Co Ltd | 電子部品素子封止用蓋材 |
JP2004172176A (ja) * | 2002-11-18 | 2004-06-17 | Taiyo Yuden Co Ltd | 回路モジュール |
WO2006046713A1 (ja) * | 2004-10-28 | 2006-05-04 | Kyocera Corporation | 電子部品モジュール及び無線通信機器 |
WO2006088127A1 (ja) * | 2005-02-18 | 2006-08-24 | Toyo Ink Manufacturing Co., Ltd. | 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20100045461A (ko) | 2010-05-03 |
TW200917430A (en) | 2009-04-16 |
CN101690442B (zh) | 2012-10-10 |
WO2009008243A1 (ja) | 2009-01-15 |
TWI434377B (zh) | 2014-04-11 |
CN101690442A (zh) | 2010-03-31 |
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