KR20100045461A - 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 - Google Patents

쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 Download PDF

Info

Publication number
KR20100045461A
KR20100045461A KR1020107002591A KR20107002591A KR20100045461A KR 20100045461 A KR20100045461 A KR 20100045461A KR 1020107002591 A KR1020107002591 A KR 1020107002591A KR 20107002591 A KR20107002591 A KR 20107002591A KR 20100045461 A KR20100045461 A KR 20100045461A
Authority
KR
South Korea
Prior art keywords
frequency module
high frequency
resin
conductive
shield
Prior art date
Application number
KR1020107002591A
Other languages
English (en)
Korean (ko)
Inventor
켄이치로 수지모토
히사토시 무라카미
Original Assignee
다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤 filed Critical 다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤
Publication of KR20100045461A publication Critical patent/KR20100045461A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020107002591A 2007-07-09 2008-06-13 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 KR20100045461A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法
JPJP-P-2007-179473 2007-07-09

Publications (1)

Publication Number Publication Date
KR20100045461A true KR20100045461A (ko) 2010-05-03

Family

ID=40228422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107002591A KR20100045461A (ko) 2007-07-09 2008-06-13 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법

Country Status (5)

Country Link
JP (1) JP2009016715A (zh)
KR (1) KR20100045461A (zh)
CN (1) CN101690442B (zh)
TW (1) TWI434377B (zh)
WO (1) WO2009008243A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225620A (ja) * 2009-03-19 2010-10-07 Panasonic Corp 回路モジュール
JP5416458B2 (ja) * 2009-04-02 2014-02-12 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールの製造方法
JP5045727B2 (ja) * 2009-10-21 2012-10-10 ソニー株式会社 高周波モジュールおよび受信装置
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
WO2012093690A1 (ja) * 2011-01-07 2012-07-12 株式会社村田製作所 電子部品モジュールの製造方法、及び電子部品モジュール
JP5633582B2 (ja) * 2011-01-28 2014-12-03 株式会社村田製作所 モジュール基板
JP5624903B2 (ja) * 2011-01-31 2014-11-12 京セラドキュメントソリューションズ株式会社 基板装置
KR20120131530A (ko) 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP5278579B2 (ja) * 2012-05-25 2013-09-04 ソニー株式会社 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
WO2014052796A1 (en) * 2012-09-28 2014-04-03 Skyworks Solutions, Inc. Systems and methods for providing intramodule radio frequency isolation
CN104159391A (zh) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 一种用于终端的散热装置及终端
JP5527785B1 (ja) * 2013-08-08 2014-06-25 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
JP6190528B2 (ja) 2014-06-02 2017-08-30 タツタ電線株式会社 導電性接着フィルム、プリント回路基板、及び、電子機器
CN105811891A (zh) * 2016-04-20 2016-07-27 佛山臻智微芯科技有限公司 减低移动通信多级功率放大器中带内噪声的结构和方法
CN106340498B (zh) * 2016-10-20 2018-11-09 江苏长电科技股份有限公司 一种具有电磁屏蔽接地功能的封装结构及其制造方法
US10373917B2 (en) * 2017-12-05 2019-08-06 Tdk Corporation Electronic circuit package using conductive sealing material
CN108493176B (zh) * 2018-03-27 2020-07-10 浙江中正智能科技有限公司 一种指纹识别芯片装置及其制造方法
DE102018116682A1 (de) * 2018-07-10 2020-01-16 Elringklinger Ag Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung
JP7503401B2 (ja) 2020-03-19 2024-06-20 太陽誘電株式会社 コイル部品及び電子機器
CN112701096A (zh) * 2020-12-22 2021-04-23 杰群电子科技（东莞）有限公司 一种半导体模组封装工艺及半导体模组

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724079B2 (ja) * 1992-10-06 1998-03-09 京セラ株式会社 半導体素子収納用パッケージ
JP2673928B2 (ja) * 1993-05-11 1997-11-05 株式会社巴川製紙所 電子部品素子封止用蓋材
JP4662324B2 (ja) * 2002-11-18 2011-03-30 太陽誘電株式会社 回路モジュール
JP3842229B2 (ja) * 2003-02-27 2006-11-08 太陽誘電株式会社 回路モジュール
JP4020874B2 (ja) * 2003-03-13 2007-12-12 三洋電機株式会社 半導体装置およびその製造方法
JP2005019900A (ja) * 2003-06-27 2005-01-20 Kyocera Corp 電子装置
JP4903576B2 (ja) * 2004-10-28 2012-03-28 京セラ株式会社 電子部品モジュール及び無線通信機器
CN100584180C (zh) * 2005-02-18 2010-01-20 东洋油墨制造株式会社 电磁波屏蔽性粘合薄膜、其制备方法以及被粘合物的电磁波屏蔽方法
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール

Also Published As

Publication number Publication date
JP2009016715A (ja) 2009-01-22
WO2009008243A1 (ja) 2009-01-15
TW200917430A (en) 2009-04-16
CN101690442A (zh) 2010-03-31
CN101690442B (zh) 2012-10-10
TWI434377B (zh) 2014-04-11

Similar Documents

Publication Publication Date Title
KR20100045461A (ko) 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법
KR101616625B1 (ko) 반도체 패키지 및 그 제조방법
CN108389855A (zh) 半导体封装件及其制造方法
CN104471707B (zh) 半导体模块
US8043892B2 (en) Semiconductor die package and integrated circuit package and fabricating method thereof
US20180130761A1 (en) Semiconductor package, manufacturing method thereof, and electronic element module using the same
JP5416458B2 (ja) シールドおよび放熱性を有する高周波モジュールの製造方法
WO2016080333A1 (ja) モジュール
US8785789B2 (en) Printed circuit board and method for manufacturing the same
CN1685509A (zh) 具有背侧面空穴安装电容器的电子封装及其加工方法
KR101153570B1 (ko) 반도체 패키지 모듈
JP6107941B2 (ja) 複合基板
KR20120095357A (ko) 전자 디바이스, 전자 장치, 전자 디바이스 제조 방법
US9839132B2 (en) Component-embedded substrate
KR20130014122A (ko) 전자 소자 내장 인쇄회로기판 및 그 제조방법
KR20150035251A (ko) 외부접속단자부와 외부접속단자부를 갖는 반도체 패키지 및 그들의 제조방법
CN112271165A (zh) 半导体封装结构及其制造方法和半导体器件
CN108109991B (zh) 用于翘曲改进的隔室屏蔽
CN106711123B (zh) 半导体封装件及其制造方法
JP2019040902A (ja) 回路基板
CN104813753A (zh) 高频模块
US9345125B2 (en) Wiring substrate
CN112259528A (zh) 具有双面选择性电磁屏蔽封装的sip结构及其制备方法
EP2209356A1 (en) Conformal reference planes in substrates
US10334728B2 (en) Reduced-dimension via-land structure and method of making the same

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision