CN1313966C - Ic卡的制造方法 - Google Patents

Ic卡的制造方法 Download PDF

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Publication number
CN1313966C
CN1313966C CNB991020618A CN99102061A CN1313966C CN 1313966 C CN1313966 C CN 1313966C CN B991020618 A CNB991020618 A CN B991020618A CN 99102061 A CN99102061 A CN 99102061A CN 1313966 C CN1313966 C CN 1313966C
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China
Prior art keywords
coil
chip
card
base material
conductive paste
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Expired - Fee Related
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CNB991020618A
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English (en)
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CN1234567A (zh
Inventor
奥光正
秋口尚士
村上慎司
原田豐
原法人
横枕光则
佐藤健一
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Panasonic Holdings Corp
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松下电器产业株式会社
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
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Abstract

本发明提供元器件的安装方法和IC卡及其制造方法，其特征在于，将处理从线圈(3)接收到信号的IC芯片(4)的第一电极(7a)连接于形成在第一基材(1a)的线圈图形(2)的内圈端(3b)。然后用跳线布线手段(8)连接线圈图形(2)外圈端(3a)和IC芯片(4)第二电极(7b)。本发明具有减少工序步骤、提高生产率、降低成本及芯片小型化等优点。

Description

IC卡的制造方法
技术领域
本发明涉及用导电膏安装元器件的方法和IC卡及其制造方法。
背景技术
一种内设有线圈和IC芯片的非接触IC卡，经该线圈与外部进行数据的收发。制造该卡时，其中线圈一般采用用铜线绕制的线圈，或采用印刷银膏等导电膏或蚀刻铜箔等金属箔制作的线圈等，其中特别盛行印刷导电膏形成电路图形的方法。
图10至图13表示已往的IC卡及其制造方法。
如图10所示，已往IC卡的结构是，用导电膏在第1基材1a上形成线圈图形2，设在该线圈图形2外圈端3a的连接区6及设在内圈端3b的连接区6与IC芯片4的电极部分电连接。
图11表示该卡的制造工序。
在步骤1，用导电膏在第一基材1a表面印刷含有线圈图形2的电路图。
在步骤2，以120℃温度对印刷后的电路图加热10分钟，使导电膏硬化。
在步骤3，如图12(a)所示，将各向异性导电层9贴附在电路图中的连接区6。
在步骤4，以100℃对各向异性导电层9加热5秒种进行临时压接。
在步骤5，将IC芯片4或电容器等元器件安装在临时压接的各向异性导电层9。
如图12(b)所示，在元器件16安装面经电极区7形成凸起10，再如图12(c)所示，凸起10与连接区6经各向异性导电层9电连接。
特别是IC芯片4要这样配置，如上所述，使得设在线圈形2外圈端3a和内圈端3b的连接区6与IC芯片4的电极区7电连接。
凸起10采用线焊法或电镀法，具体而言采用焊锡、金、银、铜的电镀法形成。
在步骤6，以200℃温度加热30秒，如图12(d)所示，使各向异性导电层9硬化，正式压接元器件16。
然后在步骤7，如图13所示，将第二基材贴合在第一基材1a上进行叠层处理，从而获得经各向异性导电层9将连接区6和设于元器件16的凸起10电连接的IC卡。5为与线圈图形2并联的电容器，1b表示第二基材。
但是，上述第一基材1a和第二基材1b一般采用对苯二甲酸乙二醇酯(polyethylene terephthalate)或聚氯乙烯等价廉的热可塑性树脂，在上述已往制造工序中，由于在步骤7正式压接各向异性导电层9时达200℃以上的高温，故出现的问题是易于损害耐热性差的这类基材。
若用耐热性好的基材代替上述热可塑性树脂，则会出现费用高的问题。
另外，由于用各向异性导电层固定元器件，故存在的问题是，连接电阻阻值大，工序多，生产率低，成本高。用各向异性导电粒子代替各向异性导电层的情况也存在与上述相同的问题。
再有，在步骤5安装元器件16时，如图10所示，由于结构上不能一笔连接线圈图形2的外圈端3a和内圈端3b，故存在的问题是在IC芯片4端子间必然会出现多条线圈图形2。
发明内容
本发明为了解决上述问题，其目的在于提供能减少工序步骤、提高生产率、降低生产成本、谋求芯片小型化的元器件安装方法和IC卡及其制造方法。
为了解决上述问题，本发明的元器件安装方法，其特征在于，将应该安装的元器件放在导电膏硬化前的电路图形上，再使导电膏硬化，完成安装。
若采用本发明，能减少工序步骤，提高生产率，因元器件可低温安装而能降低费用，而且有利于IC芯片的小型化。
本发明的第一方面所述的元器件的安装方法，其特征在于，用导电膏将电路图形印刷在基材的平坦表面上，将元器件配置在所述电路图形上使电极部分与电路图形相连，使所述导电膏硬化，将电极部分和电路图形电连接，形成电路。
按照该结构，可低温安装元器件，谋求减少工序步骤，从而能实现降低成本。
本发明的第二方面所述的元器件的安装方法，其特征在于，用导电膏将电路图形印刷在基材上，将元器件配置在所述电路图形上使电极区形成有凸起的元器件的电极部分与电路图形相连，使所述导电膏硬化，将电极部分与电路图形电连接，形成电路。
本发明的第三方面所述的元器件的安装方法，其特征在于，在本发明的第二方面中所述凸起由金属或电镀形成。
本发明第四方面所述的IC卡制造方法，其特征在于，制造内设有线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，用导电膏将含有线圈图形的电路图形印刷在基材上，将IC芯片配置在所述电路图形上使电极部分与电路图形连接，跨越线圈配置跳线布线手段，在使所述导电膏硬化前连接所述线圈外圈端电极区和IC芯片的引出电极区或给所述IC芯片的信号线，再使所述导电膏硬化。
按这种结构，可使IC卡小型化。
本发明第五方面所述的IC卡的制造方法，其特征在于，制造内设有线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，用导电膏将含有线圈图形的电路图形印刷在基材上，将IC芯片配置在所述电路图形上使电极部分与电路图形连接，使导电膏硬化后，跨越线圈配置跳线布线手段，使所述线圈外圈端的电极区和IC芯片的引出电极区连接。
本发明第六方面所述的IC卡的制造方法，在本发明的第五方面中，在跨越跳线布线手段的线圈部分用绝缘涂料(ink)印刷连接线圈外圈端电极区和从IC芯片引出的电极区的图形，再重叠在所述图形上印刷导电涂料。
按照该结构，可使IC卡薄型化，缩短干燥时间，提高生产率。
本发明第七方面所述的IC卡的制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，用导电膏在第一基材上印刷含有线圈图形的电路图形，在所述电路图形上配置IC芯片使电极部分与电路图形连接，再硬化所述导电膏，在所述第一基材上层叠第二基材，在跨越所述第一基材上形成的线圈的连接所述线圈外圈端电极区和IC芯片引出电极区的第二基材的对应部分上印刷导电膏，形成跳线布线手段，夹入在与所述线圈外圈端的电极区和从IC芯片引出的电极区对应的位置处有连通孔的绝缘膜，将该第二基材贴合于所述第一基材，加以硬化，连接所述第一基材的电极部分和所述第二基材的导电膏。
本发明第八方面所述的IC卡制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，用导电膏在基材上印刷电路图形，在未硬化的所述电路图形上配置IC芯片使电极部分与电路图形连接，使所述导电膏硬化，将线绕构成的线圈的两端部分别电连接于所述电路图形。
本发明第九方面所述的IC卡制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，用导电膏在基材上印刷电路图形，在未硬化的所述电路图形上配置IC芯片使电极部分与电路图形连接，将线绕构成的线圈的两端部配置在未硬化的所述电路图形上，使所述导电膏硬化。
附图说明
图1为本发明实施例中IC卡的平面图；
图2为本发明实施例中IC卡的制造工序图；
图3为本发明实施例中线圈图形的平面图；
图4为本发明实施例中IC芯片安装状态的典型示意图；
图5为本发明实施例中跳线安装状态的典型示意图；
图6为本发明实施例中形状构成IC卡的典型示意图；
图7为本发明实施例中其它IC芯片安装状态的典型示意图；
图8为本发明实施例中其它跳线安装状态的典型示意图；
图9为本发明实施例中IC芯片输入电路与线圈的电连接形态的说明图；
图10为已往IC卡构成形状的典型示意图；
图11为已往元器件安装工序图。
图12为已往IC芯片安装工序的典型示意图；
图13为已往IC卡构成形状的典型示意图。
具体实施方式
下面，参照图1至图8说明本发明实施例。
与上述已有例相同的部分赋以相同标号进行说明。
图1至图8表示本发明实施例。
如图1所示，该实施例中IC卡由线圈和利用该线圈进行收发信号加以必要处理的IC芯片4构成，与上述已有例的图10相比，有下面的不同点。该IC卡是这样构成，即IC芯片4的第一电极区7a设置在第一基材1a上形成的线圈图形2的内圈端3b的连接区6b，线圈图形2外圈端3a的电极区6a与IC芯片4的第二电极区7b经跳线布线手段8相连。
线圈图形2按下面的过程硬化，用作天线用线圈。在以下的说明中，硬化后的线圈图形2的部分作为线圈3加以说明。5a为与线圈3并联连接的谐振电容器，5b为存储经线圈3接收到的功率的电源用电容器，该IC卡借助电源用电容器5b的功率进行工作。
图2表示该IC卡的制造工序。
在步骤1，用导电膏将含有线圈图形2的电路图形印刷在第一基材1a的表面。
图3表示印刷后的电路图形，如箭头A所示，在线圈图形2形成线圈。在线圈图形2的内侧，如箭头B所示形成IC安装部，另外形成线圈图形2的外圈端3a和在与IC安装部相连的部分形成如箭头C所示的电容器安装部。
第一基材1a及下述的第二基材1b由聚对苯二甲酸乙二醇酯、聚氯乙烯、丙烯腈丁二烯苯乙烯(acrylonitrile butadi enestyrene)、聚碳酸酯等构成，厚度约0.1~0.5mm左右。
银膏适合用作导电膏。
导电膏的印刷可用网板印刷、胶版印刷或照像凹版印刷(gravure)来进行，如可通过165筛孔/英寸的网板作成乳剂厚度为10μm的方式来形成。
在步骤12，对IC芯片4、表面安装用电容器5a、5b、跳线布线手段8等的元器件16进行安装。
具体而言，将IC芯片4安装于箭头B所示的IC安装部，将电源用电容器5a和谐振用电容器5b安装于箭头C所示的电容器安装部。设置跳线布线手段8，用于连接线圈图形2外圈端3a的连接区6a和IC芯片4的第二电极区7b。
将这些元器件安装于规定位置时，在上述已有技术例中是将元器件16经过各向异性导电层9安装于硬化后的连接区6的，但在本实施例中是将元器件16安装于硬化前的连接区6的。
如图4所示，IC芯片4与上述已有技术例相同，其第一电极区7a及第二电极区7b形成有凸起10，第一、第二电极7a、7b通过各自的凸起10a、10b安装于连接区6。
如图5所示，跳线布线手段8具有被覆部11，由绝缘体被覆导体构成的导电部的中间部，导电部12从两端露出，其厚度约为0.1mm的薄型。该跳线布线手段8两端的导电部12安装在连接区6a、6c。
在步骤3，使导电膏硬化，固定住步骤2安装的元器件16。
这样仅通过使电膏硬化，能够构成稳定的电路图形，并能实现元器件可靠的电连接。
在步骤4，将第二基材1b对着如上构成的第一基材1a经薄膜层叠，用热压作成卡。
作为层叠材料可用聚对苯二甲酸乙醇酯或聚氯乙烯、ABS或聚碳酸酯等。
图6典型示意图示出完成的IC卡的构成形状。
如图6所示，与上述已有技术例所示图13的不同点在于，该实施例中元器件16的安装是，在连接区6与元器件16间不设各向异性导电层9，而是将元器件16直接安装于由硬化前的导电膏构成的连接区6，故能减少制作工序，提高生产率。
与上述已有技术例所示图10不同点在于，设有跳线布线手段8，用于连接线圈图形2的外圈端3a与内圈端3b，因此IC芯片4端子间不必存在多条线圈图形2，故能使IC卡小型化。
在上述实施例中，虽安装的IC芯片4设有凸起10a、10b，但本发明并不限于此，如图7所示，也可将第一、第二电极区7a、7b直接与连接区6接触而构成。
按照上述构成，无需凸起10，故可低温安装元器件，减少工序步骤，从而实现生产成本下降。也能降低连接电阻。
在上述实施例中，虽在导电膏硬化前安装跳线布线手段8，但也可在导电膏硬化后设置跳线布线手段8。
在上述实施例中，跳线布线手段8虽使用图5所示结构，但也可代用按如下方式作成的由绝缘层和导电箔构成的厚度为20～30μm的薄叠层片作为跳线布线手段8，即，在由聚对苯二甲酸乙二醇酯等绝缘层构成的厚为20μm的绝缘层上蒸镀铜、金、或铝等金属构成薄叠层片，也能得到同样效果。
由叠层片构成的跳线布线手段8这样配置，即使绝缘层置于第一基材1a侧而导电箔放在上面，将连接区6a与连接区6b之间连接起来，再进行热熔接。然后配置另一绝缘层进一步覆盖上面露出的导电箔部分。
按照上述结构，利用热熔接，使导电箔电连接在连接区6a、6c间。并利用导电箔下面设置的绝缘层的熔化部分加以固定。
另外，在安装IC芯片4使导电膏硬化后，用绝缘涂料印刷如图1所示的跨越线圈图形2的连接连接区6a、6c的图形，再重叠在所述图形上印刷导电涂料，这样也能作成跳线布线手段8。若使用这样的跳线布线手段8，同样能实现卡的薄型化，另外，由于涂料的干燥时间较短，故能提高生产率。
再有，如图8所示，也可取这样的结构，即在第1基材1a上与上述相同形成线圈图形2，而在第二基材1b上涂敷导电膏设置跳线布线手段8。
具体而言，第一基材1a与上述实施例相同，形成含有线圈图形2的电路图形。
而在第二基材1b，在与图1所示跨越线圈图形2将连接区6a和6c加以连接的位置相对应的位置上涂敷导电膏，设置跳线布线手段8。
然后，在所述第一基材1a和第二基材1b之间夹有绝缘膜13，该绝缘膜13在与连接区6a、6c对应的位置处形成连通孔14，将第二基材1b与第一基材1a贴合并进行硬化。
所获得的IC卡，其第一基材1a的连接区6a、6c与第二基材1b的跳线布线手段8相互电连接，能获得与上述实施例IC卡的同样效果。
介于第一、第二基材1a、1b间的绝缘膜13也可设置多层，利用多层可增加线圈图形2的圈数，这样一来，由于增加了线圈图形2的圈数，故能加大线圈的电感量。
如图9(a)所示，上述实施例中线圈3的连接点P可以说是直接连接从IC芯片4引出的电极区的电路结构。然而如图9(b)所示，该线圈3的连接点P即使不直接连接从IC芯片4引出的电极区，本发明也具有同样的效果。
在图9(b)所示另一实施例中，在IC芯片4与线圈3间插接有陷波器(trap)15，该线圈3的连接点P可以说是输给IC芯片4的信号线。这里，所谓陷波器15是一种滤波器电路，对从外部作用于线圈3的不需要的频率分量呈现高阻抗，而对从外部作用于线圈3的所需频率分量呈现低阻抗。
另外，在上述各实施例中，是用线圈图形在基板上形成线圈3布线为例进行了说明，但也可用导电膏将电路图形印刷在基板上，在未硬化前的所述电路图形上配置IC芯片使电极部分与电路图形连接，之后使所述导电膏硬化，安装元器件，因而在仅着眼于减少制造工序中热处理工序进行实施的情况下，没有必要在基板上作为图形形成线圈3，而使用用导线绕制构成的线圈，在使所述导电膏硬化、完成元器件安装之后，将这种导线绕制的线圈两端用焊接等方式电连接于基板中电路，这样也可构成IC卡。
另外，如上所述，虽可将导线绕制的线圈两端部电连接于硬化后的电路图形，但也可在硬化前的电路图形中配置IC芯片、其它片状元件及线圈的两端部，之后使电路图形硬化形成电连接，这样也可构成IC卡。

Claims (6)

1、一种IC卡的制造方法，其特征在于，制造内设有线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，
用导电膏将含有线圈图形的电路图形印刷在基材上，将IC芯片配置在所述电路图形上使电极部分与电路图形连接，跨越线圈配置跳线布线手段，在使所述导电膏硬化前连接所述线圈外圈端电极区和IC芯片的引出电极区或给所述IC芯片的信号线，再使所述导电膏硬化。
2、一种IC卡的制造方法，其特征在于，制造内设有线圈和IC芯片，经所述线圈与外部进行数据收发的非接触式IC卡时，
用导电膏将含有线圈图形的电路图形印刷在基材上，将IC芯片配置在所述电路图形上使电极部分与电路图形连接，使导电膏硬化后，跨越线圈配置跳线布线手段，使所述线圈外圈端的电极区和IC芯片的引出电极区连接。
3、如权利要求2所述的IC卡的制造方法，其特征在于，在跨越跳线布线手段的线圈部分用绝缘涂料印刷连接线圈外圈端电极区和从IC芯片引出的电极区的图形，再重叠在所述图形上印刷导电涂料。
4、一种IC卡的制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，
用导电膏在第一基材上印刷含有线圈图形的电路图形，在所述电路图形上配置IC芯片使电极部分与电路图形连接，再硬化所述导电膏，
在所述第一基材上层叠第二基材，在跨越所述第一基材上形成的线圈的连接所述线圈外圈端电极区和IC芯片引出电极区的第二基材的对应部分上印刷导电膏，形成跳线布线手段，
夹入在与所述线圈外圈端的电极区和从IC芯片引出的电极区对应的位置处有连通孔的绝缘膜，将该第二基材贴合于所述第一基材，加以硬化，连接所述第一基材的电极部分和所述第二基材的导电膏。
5、一种IC卡的制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，
用导电膏在基材上印刷电路图形，
在未硬化的所述电路图形上配置IC芯片使电极部分与电路图形连接，使所述导电膏硬化，
将线绕构成的线圈的两端部分别电连接于所述电路图形。
6、一种IC卡的制造方法，其特征在于，制造内设线圈和IC芯片、经所述线圈与外部进行数据收发的非接触式IC卡时，
用导电膏在基材上印刷电路图形，在未硬化的所述电路图形上配置IC芯片使电极部分与电路图形连接，
将线绕构成的线圈的两端部配置在未硬化的所述电路图形上，
使所述导电膏硬化。
CNB991020618A 1998-03-03 1999-03-03 Ic卡的制造方法 Expired - Fee Related CN1313966C (zh)

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