US20020026703A1 - Method for mounting parts, and IC card and manufacturing method thereof - Google Patents

Method for mounting parts, and IC card and manufacturing method thereof Download PDF

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Publication number
US20020026703A1
US20020026703A1 US09/983,811 US98381101A US2002026703A1 US 20020026703 A1 US20020026703 A1 US 20020026703A1 US 98381101 A US98381101 A US 98381101A US 2002026703 A1 US2002026703 A1 US 2002026703A1
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US
United States
Prior art keywords
coil
chip
circuit pattern
conductive paste
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/983,811
Inventor
Mitsumasa Oku
Takashi Akiguchi
Shinji Murakami
Yutaka Harada
Norihito Tsukahara
Mitsunori Yokomakura
Kenichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to US09/983,811 priority Critical patent/US20020026703A1/en
Publication of US20020026703A1 publication Critical patent/US20020026703A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
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    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07773—Antenna details
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    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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    • H01F27/40—Structural association with built-in electric component, e.g. fuse
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    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Definitions

  • the present invention relates to a method for mounting parts by means of conductive paste, and an IC card and its manufacturing method.
  • coils such as a copper wire-wound coil, coils of printed conductive pastes, e.g. silver paste, and coils of etched metal foils, e.g. copper foil, are used as a coil, and in particular, a method for forming a circuit pattern by printing conductive pastes has become popular.
  • FIGS. 10 to 13 show a conventional IC card and its manufacturing method.
  • the conventional IC card is constructed such that a coil pattern 2 is formed on the first substrate 1 a by means of a conductive paste, and a connecting pad 6 provided at the external end 3 a of this coil pattern 2 and a connecting pad 6 provided at the internal end 3 b are electrically connected with electrodes of an IC chip 4 .
  • step 1 a circuit pattern including the coil pattern 2 is printed on the surface of the first substrate 1 a by means of the conductive paste.
  • step 2 the printed circuit pattern is heated for 10 minutes at the temperature of 120° C. to cure the conductive paste.
  • step 3 as shown in FIG. 12( a ), an anisotropic conductive sheet 9 is stuck on the connecting pad 6 of the circuit pattern.
  • step 4 the anisotropic conductive sheet 9 is heated for 5 seconds at the temperature of 100° C. and temporally pressed.
  • step 5 parts such as the IC chip 4 and capacitors are mounted on the temporally pressed anisotropic conductive sheet 9 .
  • a bump 10 is formed on an mounting surface of the parts 16 via an electrode pad 7 , as shown in FIG. 12( b ), and the bump 10 is electrically connected with the connecting pad 6 via the anisotropic conductive sheet 9 , as shown in FIG. 12( c ).
  • the IC chip 4 is placed such that, as described above, the connecting pads 6 provided at the external end 3 a and the internal end 3 b of the coil pattern 2 are electrically connected with the electrode pad 7 of the IC chip 4 .
  • the bump 10 formed by using wire bonding and plating, in particular, plating using solder, gold, silver, and copper is used.
  • step 6 the anisotropic conductive sheet 9 is heated for 30 seconds at the temperature of 200° C. to be cured for pressing the parts 16 as shown in FIG. 12( d ).
  • step 7 by applying a second substrate to the first substrate 1 a for laminating processing, as shown in FIG. 13, the IC card can be obtained in which the connecting pads 6 and the bump 10 provided on the parts 16 are electrically connected via the anisotropic conductive sheet 9 .
  • 5 denotes a capacitor connected in parallel to the coil pattern 2
  • 1 b denotes the second substrate.
  • the present invention provides a method for mounting parts, and an IC card and its manufacturing method, that is capable of solving the problems, reducing the number of steps, increasing the productivity to lower costs, and miniaturizing the chip.
  • the method for mounting parts according to the invention is characterized in that parts to be ed are placed on the circuit pattern before the conductive paste is cured, and then ed by curing the conductive paste.
  • the method for mounting parts according to claim 1 of the invention is characterized in that a circuit is formed by printing a circuit pattern on a substrate by means of a conductive paste, placing parts on the circuit pattern such that its electrode is connected to the circuit pattern, and curing the conductive paste to electrically connect the electrode with the circuit pattern.
  • the method for mounting parts according to claim 2 of the invention is characterized in that a circuit is formed by printing a circuit pattern on a substrate by means of a conductive paste, placing parts having a bump formed on its electrode pad on the circuit pattern such that its electrode is connected to the circuit pattern, and curing the conductive paste to electrically connect the electrode to the circuit pattern.
  • the method for mounting parts according to claim 3 of the invention is characterized in that, in claim 2 , the bump is formed of metals or plating.
  • the IC card according to claim 4 of the invention is a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, and is characterized in that a first electrode of the IC chip for processing signals received from the coil is connected to an internal end of a coil pattern formed on the substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wiring means.
  • an anisotropic conductive sheet is not required to provide, and it becomes possible to various parts at low temperature, and also lower resistance can be realized.
  • the IC card according to claim 5 of the invention is characterized in that, in claim 4 , the jumper wiring means is a wire having an insulatingly covered middle portion and ends with exposed conductive portions, or a foil constituted of an insulating sheet with a metal film.
  • the method for manufacturing the IC card according to claim 6 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern, placing the jumper wiring means for connecting over the coil the electrode pad at the external end of the coil to the electrode pad drawn out of the IC chip or a signal line to the IC chip before the conductive paste is cured, and curing the conductive paste.
  • the method for manufacturing the IC card according to claim 7 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern, and after the conductive paste is cured, placing the jumper wiring means for connecting over the coil the electrode pad at the external end of the coil to the electrode pad drawn out of the IC chip.
  • the method for manufacturing the IC card according to claim 8 of the invention is characterized in that, in claim 7 , the jumper wiring means is configured by printing a pattern, which links the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip, by means of insulating ink at the portion of the coil across the jumper wiring means, and printing conductive ink over the pattern.
  • the method for manufacturing the IC card according to claim 9 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the first substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern and curing the conductive paste, printing the conductive paste at the position corresponding to the portion in the second substrate laminated on the first substrate which connects the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip over the coil formed on the first substrate to form the jumper wiring means, applying this second substrate to the first substrate, with an insulating film which has communicating openings formed at the positions corresponding to the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip being interposed, curing the conductive paste, and connecting the electrode of the first substrate and the conductive paste of the second substrate.
  • the method for manufacturing the IC card according to claim 10 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern before the conductive paste is cured such that its electrode is connected to the circuit pattern, curing the conductive paste, and electrically connecting each end of the coil constituted of a wound line to the circuit pattern.
  • the method for manufacturing the IC card according to claim 11 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern before the conductive paste is cured such that its electrode is connected to the circuit pattern, placing each end of the coil constituted of a wound line on the circuit pattern before the conductive paste is cured, and curing the conductive paste.
  • FIG. 1 is a plan view showing an IC card according to an embodiment of the invention.
  • FIG. 2 is a diagram showing a process for manufacturing the IC card according to the embodiment of the invention.
  • FIG. 3 is a plan view showing a coil pattern according to the embodiment of the invention.
  • FIG. 4 is a schematic view showing the mounting of the IC chip according to the embodiment of the invention.
  • FIG. 5 is a schematic view showing the mounting of a jumper wire according to the embodiment of the invention.
  • FIG. 6 is a schematic view showing the finished configuration of the IC card according to the embodiment of the invention.
  • FIG. 7 is a schematic view showing the mounting of another IC chip according to the embodiment of the invention.
  • FIG. 8 is a schematic view showing the mounting of another jumper wire according to the embodiment of the invention.
  • FIG. 9 is an explanation view showing the electrical connection of an input circuit of the IC chip and the coil according to the embodiment of the invention.
  • FIG. 10 is a schematic view showing the finished configuration of a conventional IC card
  • FIG. 11 is a diagram showing a conventional process for mounting a part
  • FIG. 12 is a schematic view showing the process for mounting the conventional IC chip.
  • FIG. 13 is a schematic view showing the finished configuration of the conventional IC card.
  • FIGS. 1 to 8 The embodiments of the present invention will be explained below by means of FIGS. 1 to 8 .
  • FIGS. 1 to 8 show the embodiments of the present invention.
  • an IC card of this embodiment is composed of a coil and an IC chip 4 for performing a process required to transfer signals via this coil, etc., and is different from that in FIG. 10 showing a conventional example in the point that it is configured such that a first electrode pad 7 a of the IC chip 4 is set for a connecting pad 6 b at an internal end 3 b of a coil pattern 2 formed on a first substrate 1 a , and an electrode pad 6 a at an external end 3 a of the coil pattern 2 and a second electrode pad 7 b of the IC chip 4 are connected via a jumper wiring means 8 .
  • the coil pattern 2 is cured in the following procedure so as to act as a coil for antenna.
  • an already cured portion of the coil pattern 2 is described as a coil 3 .
  • 5 a denotes a resonant capacitor connected parallel to the coil 3
  • 5 b denotes a capacitor for power supply for charging power received via the coil 3
  • this IC card is operated by the power of the capacitor for power supply 5 b.
  • step 1 a circuit pattern including the coil pattern 2 is printed on the surface of the first substrate 1 a by means of a conductive paste.
  • FIG. 3 shows the printed circuit pattern, and a coil is formed in the coil pattern 2 as denoted by an arrow A. And an IC mounting portion denoted by an arrow B is formed inside the coil pattern 2 , and a capacitor mounting portion denoted by an arrow C is formed at the portion leading to the external end 3 a of the coil pattern 2 and the IC mounting portion.
  • Substrates having a thickness on the order of 0.1 to 0.5 nm made of polyethylene terephthalate, vinyl chloride, acrylonitrile butadiene styrene, and polycarbonate, etc. are used for the first substrate 1 a and a second substrate 1 b described later.
  • the conductive paste is printed using screen printing, offset printing, and gravure printing, etc., and for example, is formed in a way that a mask having 165 meshes per inch is used to obtain an emulsion having a thickness of 10 ⁇ m.
  • step 2 parts 16 such as the IC chip 4 , the capacitors to be mounted on the surface 5 a , 5 b , and the jumper wiring means 8 are mounted.
  • the IC chip 4 is mounted on the IC mounting portion denoted by an arrow B, and the capacitor for power supply 5 a and the resonant capacitor 5 b are mounted on the capacitor mounting portion denoted by an arrow C.
  • the jumper wiring means 8 is provided to link the connecting pad 6 a at the external end 3 a of the coil pattern 2 and the second electrode pad 7 b of the IC chip 4 .
  • the parts 16 are mounted on the connecting pad 6 before it is cured, while in the above conventional example, the parts 16 are mounted on the connecting pad 6 after it is cured via the anisotropic conductive sheet 9 .
  • the first electrode pad 7 a and the second electrode pad 7 b are formed on the IC chip 4 in the same way as the above conventional example, and bumps 10 are formed on the first electrode pad 7 a and the second electrode pad 7 b , and as shown in FIG. 4, the first electrode pad 7 a and the second electrode pad 7 b are mounted on the connecting pads 6 via bumps 10 a and 10 b respectively.
  • the jumper wiring means 8 is configured to have a covered portion 11 , which is an insulator covering the middle portion of a conductive portion made of a conductor, and exposed conductive portions 12 at the opposite ends, and a thin type having a thickness about 0.1 mm is used,
  • the conductive portions 12 on the opposite ends of this jumper wiring means 8 are mounted on the connecting pads 6 a , 6 c.
  • step 3 the conductive paste is cured to secure the parts 16 mounted in step 2 .
  • step 4 the second substrate 1 b is opposed to the first substrate 1 a configured as described above, laminated with a film, and made into a card by thermal pressing.
  • a finished configuration of the obtained IC card is shown in the schematic view of FIG. 6.
  • FIG. 6 differing from FIG. 13 showing the above conventional example, in this embodiment, the manufacturing process is shortened and the productivity is improved, because the parts 16 are directly mounted on the connecting pads 6 made of the conductive paste before it is cured, rather than mounted by providing the anisotropic conductive sheet 9 between the connecting pads 6 and the parts 16 .
  • the jumper wiring means 8 is provided to connect the external end 3 a and the internal end 3 b of the coil pattern 2 , it is not required to draw a plurality of coil patterns 2 between the terminals of the IC chip 4 , and therefore it is possible to miniaturize the IC card.
  • the present invention is not limited to this embodiment, and it may be configured such that the first electrode pad 7 a and the second electrode pad 7 b directly contact with the connecting pads 6 , as shown in FIG. 7.
  • the jumper wiring means 8 may be provided after the conductive paste is cured.
  • a thin laminate sheet which has a thickness between 20 and 30 ⁇ m constituted of an insulating sheet and a conductive foil made by the vapor deposition of the metals such as copper, gold, and aluminium on an insulating sheet having a thickness on the order of 20 ⁇ m such as polyethylene terephthalate, can be used for the jumper wiring means 8 to obtain the same effect.
  • the jumper wiring means 8 constituted of the laminate sheet is placed such that the connecting pad 6 a and the connecting pad 6 c are linked to each other, with its insulating sheet facing the first substrate 1 a and its conductive foil being to be the upper surface, and heat-welded. Then, another insulating sheet is placed over the portion of the conductive foil which is exposed upward.
  • the jumper wiring means 8 may be formed by mounting the IC chip 4 , and by curing the conductive paste, and by printing the pattern which links the connecting pads 6 a and 6 c over the coil pattern 2 by means of insulating ink as shown in FIG. 1, and by printing conductive ink over the pattern. Using such a jumper wiring means 8 makes it possible to make the IC card thinner, and the productivity can be improved due to its short drying time.
  • FIG. 8 it may be configured by forming the coil pattern 2 on the first substrate la as described above, and by painting the conductive paste on the second substrate 1 b to provide the jumper wiring means 8 .
  • the circuit pattern including the coil pattern 2 is formed on the first substrate 1 a in the same way as the above described embodiment.
  • the jumper wiring means 8 is provided on the second substrate 1 b by applying the conductive paste at the position corresponding to the position which links the connecting pads 6 a and 6 c over the coil pattern 2 as shown in FIG. 1. Then, the second substrate 1 b is applied to the first substrate 1 a , with an insulating film 13 , which has communicating openings 14 formed at the positions corresponding to the connecting pads 6 a , 6 c , being interposed between the first substrate 1 a and the second substrate 1 b , and the conductive paste is cured.
  • IC card is configured such that the connecting pads 6 a , 6 c of the first substrate 1 b are electrically connected with the jumper wiring means 8 of the second substrate 1 b , and provides the same effect as the IC card in the above described embodiment.
  • a plurality of insulating films 13 which are interposed between the first substrate 1 a and the second substrate 1 b may be provided, and the multilayer configuration can increase the number of turns of the coil pattern 2 , and thus increased number of turns of the coil pattern 2 can increase the inductance of the coil.
  • connection point P in the coil 3 in the above embodiment can be considered to have a circuit configuration so as to be directly connected to the electrode pad drawn out of the IC chip 4 as shown in FIG. 9( a ), if the connecting point P in the coil 3 is not directly connected to the electrode pad drawn out of the IC chip 4 as shown in FIG. 9( b ), the present invention provides the same effect.
  • a trap 15 is interposed between the IC chip 4 and the coil 3 , and the connecting point P in the coil 3 can be considered to be a signal line for the IC chip 4 .
  • the trap 15 mentioned here is a filter circuit which exhibits high impedance for useless frequency component which acts on the coil 3 from external, and low impedance for target frequency component which acts on the coil 3 from external.
  • the need to form the coil 3 as a pattern on the substrate is eliminated by printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrodes are connected to the circuit pattern before the conductive paste is cured, and then curing the conductive paste to mount parts, and then the IC card may be configured by using the coil constituted of a wound line, and electrically connecting both ends of this coil constituted of the wound line with the electric circuit on the substrate using a technique such as soldering after the conductive paste is cured and the mounting of the parts is completed,
  • both ends of the coil constituted of the wound line are electrically connected to the cured circuit pattern
  • the IC card may be configured by placing the IC chip, and any other chip parts, and both ends of the coil on the circuit pattern before cured, and then by curing the circuit pattern to establish the electrical connections.

Abstract

The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, in the present invention, a first electrode (7 a) of the IC chip (4) for processing signals received from a coil (3) is connected to an internal end (3 b) of a coil pattern (2) formed on a first substrate (1 a), and an external end (3 a) of the coil pattern (2) and a second electrode (7 b) of the IC chip (4) are connected via a jumper wiring means (8).

Description

    FIELD OF THE INVENTION
  • The present invention relates to a method for mounting parts by means of conductive paste, and an IC card and its manufacturing method. [0001]
    • BACKGROUND OF THE INVENTION
  • In manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, coils such as a copper wire-wound coil, coils of printed conductive pastes, e.g. silver paste, and coils of etched metal foils, e.g. copper foil, are used as a coil, and in particular, a method for forming a circuit pattern by printing conductive pastes has become popular. [0002]
  • FIGS. [0003] 10 to 13 show a conventional IC card and its manufacturing method.
  • As shown in FIG. 10, the conventional IC card is constructed such that a [0004] coil pattern 2 is formed on the first substrate 1 a by means of a conductive paste, and a connecting pad 6 provided at the external end 3 a of this coil pattern 2 and a connecting pad 6 provided at the internal end 3 b are electrically connected with electrodes of an IC chip 4.
  • The manufacturing process is shown in FIG. 11. [0005]
  • Firstly, in [0006] step 1, a circuit pattern including the coil pattern 2 is printed on the surface of the first substrate 1 a by means of the conductive paste.
  • In [0007] step 2, the printed circuit pattern is heated for 10 minutes at the temperature of 120° C. to cure the conductive paste.
  • In [0008] step 3, as shown in FIG. 12(a), an anisotropic conductive sheet 9 is stuck on the connecting pad 6 of the circuit pattern.
  • In [0009] step 4, the anisotropic conductive sheet 9 is heated for 5 seconds at the temperature of 100° C. and temporally pressed.
  • In [0010] step 5, parts such as the IC chip 4 and capacitors are mounted on the temporally pressed anisotropic conductive sheet 9.
  • A [0011] bump 10 is formed on an mounting surface of the parts 16 via an electrode pad 7, as shown in FIG. 12(b), and the bump 10 is electrically connected with the connecting pad 6 via the anisotropic conductive sheet 9, as shown in FIG. 12(c).
  • Particularly, the [0012] IC chip 4 is placed such that, as described above, the connecting pads 6 provided at the external end 3 a and the internal end 3 b of the coil pattern 2 are electrically connected with the electrode pad 7 of the IC chip 4.
  • And, the [0013] bump 10, formed by using wire bonding and plating, in particular, plating using solder, gold, silver, and copper is used.
  • In [0014] step 6, the anisotropic conductive sheet 9 is heated for 30 seconds at the temperature of 200° C. to be cured for pressing the parts 16 as shown in FIG. 12(d).
  • Then in [0015] step 7, by applying a second substrate to the first substrate 1 a for laminating processing, as shown in FIG. 13, the IC card can be obtained in which the connecting pads 6 and the bump 10 provided on the parts 16 are electrically connected via the anisotropic conductive sheet 9. 5 denotes a capacitor connected in parallel to the coil pattern 2, and 1 b denotes the second substrate.
  • However, since it is typical to use inexpensive thermoplastic resin such as polyethylene terephthalate and vinyl chloride for the [0016] first substrate 1 a and the second substrate 1 b, there is a problem that, in the conventional manufacturing process described above, these substrates having less heat resistance are susceptible to degradation due to the high temperature of 200° C. or more when pressing the anisotropic conductive sheet 9 in step 7.
  • Also, there is a problem that using a substrate having superior heat resistance instead of the thermoplastic resin increases the costs. [0017]
  • And there is a further problem that the connecting resistance and the number of steps are increased, and the productivity is lowered, and costs are increased because the anisotropic conductive sheet is used for securing the parts. And it is the same with the case of using an anisotropic conductive particle instead of the anisotropic conductive sheet. [0018]
  • And, when the [0019] parts 16 are ed in step 5, there is a problem that it is needed to draw a plurality of coil patterns 2 between the terminals of the IC chip 4, as shown in FIG. 10, since the external end 3 a and internal end 3 b of the coil pattern 2 are constructed not so as to be linked to each other in a single brush stroke.
    • DISCLOSURE OF THE INVENTION
  • The present invention provides a method for mounting parts, and an IC card and its manufacturing method, that is capable of solving the problems, reducing the number of steps, increasing the productivity to lower costs, and miniaturizing the chip. [0020]
  • To solve the problems, the method for mounting parts according to the invention is characterized in that parts to be ed are placed on the circuit pattern before the conductive paste is cured, and then ed by curing the conductive paste. [0021]
  • According to the invention, it is possible to lower costs due to the reduction of steps, the good productivity, and the possibility of the low temperature mounting of the parts, and further to contribute to the miniaturization of the IC chip. [0022]
  • The method for mounting parts according to [0023] claim 1 of the invention is characterized in that a circuit is formed by printing a circuit pattern on a substrate by means of a conductive paste, placing parts on the circuit pattern such that its electrode is connected to the circuit pattern, and curing the conductive paste to electrically connect the electrode with the circuit pattern.
  • According to this configuration, it is possible to parts at low temperature and reduce steps to lower costs. [0024]
  • The method for mounting parts according to [0025] claim 2 of the invention is characterized in that a circuit is formed by printing a circuit pattern on a substrate by means of a conductive paste, placing parts having a bump formed on its electrode pad on the circuit pattern such that its electrode is connected to the circuit pattern, and curing the conductive paste to electrically connect the electrode to the circuit pattern.
  • The method for mounting parts according to [0026] claim 3 of the invention is characterized in that, in claim 2, the bump is formed of metals or plating.
  • The IC card according to [0027] claim 4 of the invention is a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, and is characterized in that a first electrode of the IC chip for processing signals received from the coil is connected to an internal end of a coil pattern formed on the substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wiring means.
  • According to this configuration, it is possible to reduce manufacturing steps and lower costs, by directly mounting parts on the conductive paste before it is cured, and then by curing the conductive paste, and it is possible to stabilize the circuit pattern, as well as ensure an electrical connection between the circuit pattern and the parts. [0028]
  • And, an anisotropic conductive sheet is not required to provide, and it becomes possible to various parts at low temperature, and also lower resistance can be realized. [0029]
  • And further, it is not required to draw a plurality of coil patterns between the terminals of the IC chip, so that it is possible to use an IC chip having narrow space between the terminals to miniaturize the IC card. [0030]
  • The IC card according to [0031] claim 5 of the invention is characterized in that, in claim 4, the jumper wiring means is a wire having an insulatingly covered middle portion and ends with exposed conductive portions, or a foil constituted of an insulating sheet with a metal film.
  • The method for manufacturing the IC card according to [0032] claim 6 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern, placing the jumper wiring means for connecting over the coil the electrode pad at the external end of the coil to the electrode pad drawn out of the IC chip or a signal line to the IC chip before the conductive paste is cured, and curing the conductive paste.
  • According to this configuration, it becomes possible to miniaturize the IC card. [0033]
  • The method for manufacturing the IC card according to [0034] claim 7 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern, and after the conductive paste is cured, placing the jumper wiring means for connecting over the coil the electrode pad at the external end of the coil to the electrode pad drawn out of the IC chip.
  • The method for manufacturing the IC card according to [0035] claim 8 of the invention is characterized in that, in claim 7, the jumper wiring means is configured by printing a pattern, which links the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip, by means of insulating ink at the portion of the coil across the jumper wiring means, and printing conductive ink over the pattern.
  • According to this configuration, it is possible to make the IC card thinner, and improve the productivity due to its short drying time. [0036]
  • The method for manufacturing the IC card according to [0037] claim 9 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern including the coil pattern on the first substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrode is connected to the circuit pattern and curing the conductive paste, printing the conductive paste at the position corresponding to the portion in the second substrate laminated on the first substrate which connects the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip over the coil formed on the first substrate to form the jumper wiring means, applying this second substrate to the first substrate, with an insulating film which has communicating openings formed at the positions corresponding to the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip being interposed, curing the conductive paste, and connecting the electrode of the first substrate and the conductive paste of the second substrate.
  • The method for manufacturing the IC card according to [0038] claim 10 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern before the conductive paste is cured such that its electrode is connected to the circuit pattern, curing the conductive paste, and electrically connecting each end of the coil constituted of a wound line to the circuit pattern.
  • The method for manufacturing the IC card according to [0039] claim 11 of the invention is characterized in that, in manufacturing a non-contact IC card comprising a coil and an IC chip, and transferring data with external via the coil, it comprises the steps of printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern before the conductive paste is cured such that its electrode is connected to the circuit pattern, placing each end of the coil constituted of a wound line on the circuit pattern before the conductive paste is cured, and curing the conductive paste.
    •  BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a plan view showing an IC card according to an embodiment of the invention; [0040]
  • FIG. 2 is a diagram showing a process for manufacturing the IC card according to the embodiment of the invention; [0041]
  • FIG. 3 is a plan view showing a coil pattern according to the embodiment of the invention; [0042]
  • FIG. 4 is a schematic view showing the mounting of the IC chip according to the embodiment of the invention; [0043]
  • FIG. 5 is a schematic view showing the mounting of a jumper wire according to the embodiment of the invention; [0044]
  • FIG. 6 is a schematic view showing the finished configuration of the IC card according to the embodiment of the invention; [0045]
  • FIG. 7 is a schematic view showing the mounting of another IC chip according to the embodiment of the invention; [0046]
  • FIG. 8 is a schematic view showing the mounting of another jumper wire according to the embodiment of the invention; [0047]
  • FIG. 9 is an explanation view showing the electrical connection of an input circuit of the IC chip and the coil according to the embodiment of the invention; [0048]
  • FIG. 10 is a schematic view showing the finished configuration of a conventional IC card; [0049]
  • FIG. 11 is a diagram showing a conventional process for mounting a part; [0050]
  • FIG. 12 is a schematic view showing the process for mounting the conventional IC chip; and [0051]
  • FIG. 13 is a schematic view showing the finished configuration of the conventional IC card.[0052]
    • DESCRIPTION OF THE EMBODIMENTS
  • The embodiments of the present invention will be explained below by means of FIGS. [0053] 1 to 8.
  • Here, the elements, which are similar to those in the above conventional example, is are denoted by the same reference. [0054]
  • FIGS. [0055] 1 to 8 show the embodiments of the present invention.
  • As shown in FIG. 1, an IC card of this embodiment is composed of a coil and an [0056] IC chip 4 for performing a process required to transfer signals via this coil, etc., and is different from that in FIG. 10 showing a conventional example in the point that it is configured such that a first electrode pad 7 a of the IC chip 4 is set for a connecting pad 6 b at an internal end 3 b of a coil pattern 2 formed on a first substrate 1 a, and an electrode pad 6 a at an external end 3 a of the coil pattern 2 and a second electrode pad 7 b of the IC chip 4 are connected via a jumper wiring means 8.
  • Here, the [0057] coil pattern 2 is cured in the following procedure so as to act as a coil for antenna. In the following description, an already cured portion of the coil pattern 2 is described as a coil 3. 5 a denotes a resonant capacitor connected parallel to the coil 3, 5 b denotes a capacitor for power supply for charging power received via the coil 3, and this IC card is operated by the power of the capacitor for power supply 5 b.
  • The process for manufacturing this IC card is shown in FIG. 2. [0058]
  • In [0059] step 1, a circuit pattern including the coil pattern 2 is printed on the surface of the first substrate 1 a by means of a conductive paste.
  • FIG. 3 shows the printed circuit pattern, and a coil is formed in the [0060] coil pattern 2 as denoted by an arrow A. And an IC mounting portion denoted by an arrow B is formed inside the coil pattern 2, and a capacitor mounting portion denoted by an arrow C is formed at the portion leading to the external end 3 a of the coil pattern 2 and the IC mounting portion.
  • Substrates having a thickness on the order of 0.1 to 0.5 nm made of polyethylene terephthalate, vinyl chloride, acrylonitrile butadiene styrene, and polycarbonate, etc. are used for the [0061] first substrate 1 a and a second substrate 1 b described later.
  • It is preferable to use a silver paste as the conductive paste. [0062]
  • The conductive paste is printed using screen printing, offset printing, and gravure printing, etc., and for example, is formed in a way that a mask having 165 meshes per inch is used to obtain an emulsion having a thickness of 10 μm. [0063]
  • In [0064] step 2, parts 16 such as the IC chip 4, the capacitors to be mounted on the surface 5 a, 5 b, and the jumper wiring means 8 are mounted.
  • Concretely, the [0065] IC chip 4 is mounted on the IC mounting portion denoted by an arrow B, and the capacitor for power supply 5 a and the resonant capacitor 5 b are mounted on the capacitor mounting portion denoted by an arrow C. And the jumper wiring means 8 is provided to link the connecting pad 6 a at the external end 3 a of the coil pattern 2 and the second electrode pad 7 b of the IC chip 4.
  • In mounting these parts at the predetermined position, in this embodiment, the [0066] parts 16 are mounted on the connecting pad 6 before it is cured, while in the above conventional example, the parts 16 are mounted on the connecting pad 6 after it is cured via the anisotropic conductive sheet 9.
  • Here, the [0067] first electrode pad 7 a and the second electrode pad 7 b are formed on the IC chip 4 in the same way as the above conventional example, and bumps 10 are formed on the first electrode pad 7 a and the second electrode pad 7 b, and as shown in FIG. 4, the first electrode pad 7 a and the second electrode pad 7 b are mounted on the connecting pads 6 via bumps 10 a and 10 b respectively.
  • And as shown in FIG. 5, the jumper wiring means [0068] 8 is configured to have a covered portion 11, which is an insulator covering the middle portion of a conductive portion made of a conductor, and exposed conductive portions 12 at the opposite ends, and a thin type having a thickness about 0.1 mm is used, The conductive portions 12 on the opposite ends of this jumper wiring means 8 are mounted on the connecting pads 6 a, 6 c.
  • In [0069] step 3, the conductive paste is cured to secure the parts 16 mounted in step 2.
  • In this way, only curing the conductive paste makes it possible to stabilize the circuit pattern, as well as to ensure an electrical connection to the parts. [0070]
  • In [0071] step 4, the second substrate 1 b is opposed to the first substrate 1 a configured as described above, laminated with a film, and made into a card by thermal pressing.
  • Polyethylene terephthalate, vinyl chloride, ABS, and polycarbonate, etc. are used for the laminate. [0072]
  • A finished configuration of the obtained IC card is shown in the schematic view of FIG. 6. [0073]
  • As shown in FIG. 6, differing from FIG. 13 showing the above conventional example, in this embodiment, the manufacturing process is shortened and the productivity is improved, because the [0074] parts 16 are directly mounted on the connecting pads 6 made of the conductive paste before it is cured, rather than mounted by providing the anisotropic conductive sheet 9 between the connecting pads 6 and the parts 16.
  • Also, differing from FIG. 10 showing the above conventional example, since the jumper wiring means [0075] 8 is provided to connect the external end 3 a and the internal end 3 b of the coil pattern 2, it is not required to draw a plurality of coil patterns 2 between the terminals of the IC chip 4, and therefore it is possible to miniaturize the IC card.
  • Here, while the [0076] IC chip 4 provided with the bumps 10 a, 10 b is mounted in the above described embodiment, the present invention is not limited to this embodiment, and it may be configured such that the first electrode pad 7 a and the second electrode pad 7 b directly contact with the connecting pads 6, as shown in FIG. 7.
  • In such a configuration, because of the absence of the [0077] bumps 10, it is possible to mount the parts at a low temperature and to reduce the number of steps to lower costs. Also, it is possible to lower the connecting resistance.
  • And, while in the above embodiment the jumper wiring means [0078] 8 is mounted before the conductive paste is cured, the jumper wiring means 8 may be provided after the conductive paste is cured.
  • Also, while in the above embodiment that is configured as shown in FIG. 5 is used for the jumper wiring means [0079] 8, however instead of this, a thin laminate sheet, which has a thickness between 20 and 30 μm constituted of an insulating sheet and a conductive foil made by the vapor deposition of the metals such as copper, gold, and aluminium on an insulating sheet having a thickness on the order of 20 μm such as polyethylene terephthalate, can be used for the jumper wiring means 8 to obtain the same effect.
  • The jumper wiring means [0080] 8 constituted of the laminate sheet is placed such that the connecting pad 6 a and the connecting pad 6 c are linked to each other, with its insulating sheet facing the first substrate 1 a and its conductive foil being to be the upper surface, and heat-welded. Then, another insulating sheet is placed over the portion of the conductive foil which is exposed upward.
  • In such a configuration, heat welding causes the connecting [0081] pads 6 a and 6 c to be electrically connected with each other via the conductive foil. Also, the welded portion of the insulating sheet provided below the conductive foil secures them.
  • And the jumper wiring means [0082] 8 may be formed by mounting the IC chip 4, and by curing the conductive paste, and by printing the pattern which links the connecting pads 6 a and 6 c over the coil pattern 2 by means of insulating ink as shown in FIG. 1, and by printing conductive ink over the pattern. Using such a jumper wiring means 8 makes it possible to make the IC card thinner, and the productivity can be improved due to its short drying time.
  • As further shown in FIG. 8, it may be configured by forming the [0083] coil pattern 2 on the first substrate la as described above, and by painting the conductive paste on the second substrate 1 b to provide the jumper wiring means 8.
  • Concretely, the circuit pattern including the [0084] coil pattern 2 is formed on the first substrate 1 a in the same way as the above described embodiment.
  • The jumper wiring means [0085] 8 is provided on the second substrate 1 b by applying the conductive paste at the position corresponding to the position which links the connecting pads 6 a and 6 c over the coil pattern 2 as shown in FIG. 1. Then, the second substrate 1 b is applied to the first substrate 1 a, with an insulating film 13, which has communicating openings 14 formed at the positions corresponding to the connecting pads 6 a, 6 c, being interposed between the first substrate 1 a and the second substrate 1 b, and the conductive paste is cured.
  • Thus obtained IC card is configured such that the connecting [0086] pads 6 a, 6 c of the first substrate 1 b are electrically connected with the jumper wiring means 8 of the second substrate 1 b, and provides the same effect as the IC card in the above described embodiment.
  • Here, a plurality of insulating [0087] films 13 which are interposed between the first substrate 1 a and the second substrate 1 b may be provided, and the multilayer configuration can increase the number of turns of the coil pattern 2, and thus increased number of turns of the coil pattern 2 can increase the inductance of the coil.
  • While the connecting point P in the [0088] coil 3 in the above embodiment can be considered to have a circuit configuration so as to be directly connected to the electrode pad drawn out of the IC chip 4 as shown in FIG. 9(a), if the connecting point P in the coil 3 is not directly connected to the electrode pad drawn out of the IC chip 4 as shown in FIG. 9(b), the present invention provides the same effect.
  • In another embodiment shown in FIG. 9([0089] b), a trap 15 is interposed between the IC chip 4 and the coil 3, and the connecting point P in the coil 3 can be considered to be a signal line for the IC chip 4. The trap 15 mentioned here is a filter circuit which exhibits high impedance for useless frequency component which acts on the coil 3 from external, and low impedance for target frequency component which acts on the coil 3 from external.
  • Further, while above each embodiment has been described as for the [0090] coil 3 formed on the substrate by means of the coil pattern 2 by way of examples, in the case of mounting with only the heat treatment steps in the manufacturing process being reduced, the need to form the coil 3 as a pattern on the substrate is eliminated by printing the circuit pattern on the substrate by means of the conductive paste, placing the IC chip on the circuit pattern such that its electrodes are connected to the circuit pattern before the conductive paste is cured, and then curing the conductive paste to mount parts, and then the IC card may be configured by using the coil constituted of a wound line, and electrically connecting both ends of this coil constituted of the wound line with the electric circuit on the substrate using a technique such as soldering after the conductive paste is cured and the mounting of the parts is completed,
  • Further, while, in the above description, both ends of the coil constituted of the wound line are electrically connected to the cured circuit pattern, however the IC card may be configured by placing the IC chip, and any other chip parts, and both ends of the coil on the circuit pattern before cured, and then by curing the circuit pattern to establish the electrical connections. [0091]

Claims (11)

What is claimed is:
1. A method for mounting parts, wherein a circuit is formed by the steps of:
printing a circuit pattern on a substrate with a conductive paste;
placing a part on said circuit pattern such that an electrode is connected to the circuit pattern; and
curing said conductive paste to electrically connect the electrode with the circuit pattern.
2. A method for mounting parts, wherein a circuit is formed by the steps of:
printing a circuit pattern on a substrate with a conductive paste;
placing a part having a bump formed on an electrode pad thereof on said circuit pattern such that an electrode is connected to the circuit pattern; and
curing said conductive paste to electrically connect the electrode with the circuit pattern.
3. The method for mounting parts according to claim 2, wherein the bump is formed of metals or by plating.
4. An IC card which is a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, wherein
a first electrode of the IC chip for processing signals received from the coil is connected to an internal end of a coil pattern formed on a substrate, and
an external end of the coil pattern and a second electrode of said IC chip are connected via a jumper wiring means.
5. The IC card according to claim 4, wherein the jumper wiring means is a wire having an insulated covered portion in the middle thereof and exposed conductive portions at both ends thereof, or a foil formed of an insulating sheet attached with a metal film.
6. A method for manufacturing an IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of:
printing a circuit pattern including a coil pattern on a substrate with a conductive paste;
placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern; and
placing a jumper wiring means for connecting over the coil an electrode pad at an external end of said coil to an electrode pad drawn out of the IC chip or a signal line to said IC chip, before said conductive paste is cured; and
curing said conductive paste.
7. A method for manufacturing an IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therein and transferring data to and from an outside media via said coil, the method comprises the steps of:
printing a circuit pattern including the coil pattern on the substrate by means of the conductive paste;
placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern; and
placing a jumper wiring means for connecting over the coil an electrode pad at an external end of said coil to an electrode pad drawn out of the IC chip, after the conductive paste is cured.
8. The method for manufacturing the IC card according to claim 7, wherein the IC card is configured by: printing a pattern with insulating ink at a portion of the coil crossing over the jumper wiring means, said pattern linking the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip; and printing conductive ink over said pattern.
9. A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of:
printing a circuit pattern including the coil pattern on a first substrate with the conductive paste;
placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern, and curing said conductive paste;
printing the conductive paste to form a jumper wiring means on a second substrate at a position corresponding to a portion of the first substrate for connecting the electrode pad at the external end of said coil and the electrode pad drawn out of the IC chip over the coil formed on said first substrate, said second substrate being laminated over said first substrate; and
applying said second substrate to said first substrate by way of interposing an insulating film having communicating openings formed at positions corresponding to the electrode pad at the external end of said coil and the electrode pad drawn out of the IC chip between the first and second substrates, and curing the conductive paste in order to connect the electrode of said first substrate and the conductive paste of said second substrate.
10. A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of:
printing a circuit pattern on a substrate with the conductive paste;
placing the IC chip on said circuit pattern before the conductive paste is cured such that an electrode is connected to the circuit pattern;
curing said conductive paste; and
electrically connecting each end of the coil constituted of a wound line to said circuit pattern.
11. A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of:
printing a circuit pattern on a substrate with the conductive paste;
placing the IC chip on said circuit pattern before the conductive paste is cured such that an electrode is connected to the circuit pattern;
placing each end of the coil constituted of a wound line on said circuit pattern before the conductive paste is cured; and
curing said conductive paste.
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Also Published As

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CN1234567A (en) 1999-11-10
US6357106B1 (en) 2002-03-19
CN1313966C (en) 2007-05-02
JPH11250214A (en) 1999-09-17

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