JPH02143591A - Device and method for mounting electronic component - Google Patents
Device and method for mounting electronic componentInfo
- Publication number
- JPH02143591A JPH02143591A JP29621588A JP29621588A JPH02143591A JP H02143591 A JPH02143591 A JP H02143591A JP 29621588 A JP29621588 A JP 29621588A JP 29621588 A JP29621588 A JP 29621588A JP H02143591 A JPH02143591 A JP H02143591A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- electronic component
- conductive paste
- terminal piece
- component device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 239000006071 cream Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、各種の電子機器装置に用いられる電子部品取
付装置および取付方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting device and a mounting method used in various electronic devices.
（従来の技術）
近年、電子機器袋ｈ９１、特にビデオテープレコーダの
普及が著しい中で、装置の小形化、軽量化とともに製造
コスｊ〜を低減する合理化が重要な課題となっている。(Prior Art) In recent years, with the remarkable spread of electronic equipment bags h91, especially video tape recorders, it has become an important issue to reduce the size and weight of devices as well as rationalization to reduce manufacturing costs.
従来の電子部品取付装置について、ビデオテープレコー
ダに使用されているシャシ基板を例として第７図により
説明する。同図は、従来の電子部品取付装置を使用した
シャシＪ１（板の側面断面図で、２個のリール台１およ
び２が取り付けられたシャシ基板３は、先端両側にそれ
ぞれ発光素子４ａを装着したテープ終始端検出装置４お
よび消去ヘツド５が共に表面に、また、キャプスタン６
ａをその表面］−に突出させたキャプスタン駆動装置６
および検出素子７ａを装着したキャプスタンＦＧ検出装
置７が共に裏面に、それぞれ１個以上のビス８．９．１
０および１１で固定されている。また、シャシ基板：３
の下方に５プリント配線回路基板１２がスペーサ１；３
とビス１４で機械的に固定されている。A conventional electronic component mounting device will be explained with reference to FIG. 7, taking a chassis board used in a video tape recorder as an example. The figure is a side sectional view of a chassis J1 (board) using a conventional electronic component mounting device.A chassis board 3 to which two reel stands 1 and 2 are attached has light emitting elements 4a mounted on both sides of the tip. The tape end detection device 4 and erasing head 5 are both on the surface, and the capstan 6 is
A capstan drive device 6 with a protruding from its surface]
and the capstan FG detection device 7 equipped with the detection element 7a are both attached to the back side with one or more screws 8.9.1.
Fixed at 0 and 11. Also, chassis board: 3
5 printed wiring circuit board 12 under spacers 1; 3
It is mechanically fixed with screws 14.
さらに、」上記のシャシ基板３に装着されたテープ終始
端検出装置４．消去ヘッド５．キャプスタン駆動装置６
およびキャプスタンＦＧ検出装置７と上記のプリント配
線回路基板１２の端子部（図示せず）とは、リード線１
５とその一端または両端に装着したコネクタ１６によっ
て電気的に接続されている。Further, a tape end detection device 4 mounted on the chassis board 3 described above is provided. Erasing head 5. Capstan drive device 6
The capstan FG detection device 7 and the terminal portion (not shown) of the printed circuit board 12 are connected to the lead wire 1.
5 and a connector 16 attached to one or both ends thereof.
（発明が解決しようとする課題）
しかしながら、上記の構成では、形状が自由なリード線
を用いるため、組立の自動化が難しいという問題があっ
た。また、コネクタ１６を接続した後、機械的な可動部
分との接触を防ぐため、リード線１５を固定する必要が
あった。このように、電子部品ごとにコネクタを接続す
る組立作業は作業性が悪く、コネクタ１６およびリード
線１５の材料費とあいまって製品コストが高いという問
題もあった。また、シャシ基板３とプリント配線回路基
板】２とをスペーサ１３を介して固定しているため、装
置が厚くなり小形化が歿しいという問題があった。(Problems to be Solved by the Invention) However, in the above configuration, since a lead wire having a free shape is used, there is a problem in that it is difficult to automate the assembly. Further, after connecting the connector 16, it was necessary to fix the lead wire 15 to prevent contact with mechanically movable parts. As described above, the assembly work of connecting connectors to each electronic component has poor workability, and together with the material costs for the connectors 16 and lead wires 15, the product cost is high. Furthermore, since the chassis board 3 and the printed circuit board 2 are fixed together via the spacer 13, there is a problem in that the device becomes thick and it is difficult to downsize the device.
本発明は十記の問題を解決するもので、電子部品装置を
ビスで機械的に固定し、リフロー半田付けで電気的にプ
リント配線回路と電気的に接続する電子部品取付装置と
その製Δ方法を提供するものである。The present invention solves the ten problems, and includes an electronic component mounting device and manufacturing method thereof, in which an electronic component device is mechanically fixed with screws and electrically connected to a printed wiring circuit by reflow soldering. It provides:
（課題を解決するための手段）
」上記の問題を解決するため１本発明は、表面に絶縁皮
膜を形成した金属製シャシ基板の上記絶縁皮膜の上に導
電性ペーストを用いて配線回路を描き、接続端子片を一
体に成形した電子部品装置を機械的に固定した後、半田
ペーストを上記の配線回路と接続端子片の接続部に塗布
し、上記の導電性ペーストの硬化と半田付けを同時に行
わせるものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention involves drawing a wiring circuit using a conductive paste on the insulating film of a metal chassis substrate having an insulating film formed on the surface thereof. After mechanically fixing the electronic component device in which the connecting terminal piece is integrally molded, solder paste is applied to the connection between the above wiring circuit and the connecting terminal piece, and the above conductive paste is hardened and soldered at the same time. It is something to be done.
（作 用）
上記の構成により、導電性ペーストの焼成硬化処理と半
［■付けのリフロー加熱処理を同時に行えるので、製造
上ｆ’＋’；が簡略化される。且つ、シャシ基板への電
子部品装置の取付けはビス等による固定作業なので、自
動化が可能となる。また、リード線やコネクタが不要と
なるのと併せて製造コス１−が大幅に低減される。また
、従来必要であったプリン１へ配線回路」１ζ板が不要
となるため、小形化ができる。(Function) With the above configuration, the baking hardening treatment of the conductive paste and the reflow heating treatment for semi-attaching can be performed at the same time, thereby simplifying f'+'; in manufacturing. Furthermore, since the attachment of the electronic component device to the chassis board is a fixing operation using screws or the like, automation is possible. In addition, lead wires and connectors are no longer required, and manufacturing costs 1- are significantly reduced. Further, since the conventionally necessary wiring circuit board 1ζ to the printer 1 is no longer necessary, the size can be reduced.
（実施例）
本発明の第１の実施例の電子部品取付装置と取付方法に
ついて、ビデオテープレコーダのシャシ基板を例として
第１図ないし第５図により説明する。第１図は、本発明
による電子部品取付装置を用いたシャシ基板の斜視図で
、プレス成形加工されたシャシ基板１７は、その表面の
一部に塗装された絶縁皮膜１８の上に回路パターン１９
を描かれ、その端子部１．９ａを除いて絶縁層２０で覆
われている。(Embodiment) An electronic component mounting apparatus and a mounting method according to a first embodiment of the present invention will be explained with reference to FIGS. 1 to 5 using a chassis board of a video tape recorder as an example. FIG. 1 is a perspective view of a chassis board using an electronic component mounting device according to the present invention.
, and is covered with an insulating layer 20 except for the terminal portion 1.9a.
テープ終始端検出装置４および消去ヘッド５は、それぞ
れビス８および９で−１−記のシャシ基板］７の］−に
固定され、さらに、それぞれの接続端子片４ｂおよび５
ａ（５ａは消去ヘッド５の陰に入り、図示されない）と
」−記の回路パターン１９と端子部１１）ａとが、゛１
′：田２１によってそれぞれ電気的に接続されている。The tape end detection device 4 and the erasing head 5 are fixed to the chassis board 7 of -1- with screws 8 and 9, respectively, and are further fixed to the chassis board 7 of -1 with respective connection terminal pieces 4b and 5.
a (5a is in the shadow of the erasing head 5 and is not shown) and the circuit pattern 19 and the terminal portion 11) a are
': They are electrically connected to each other by the field 21.
第２図は、上記の消去ヘッド５の装着状態を示す側面断
面図で、消去ヘッド５と一体成形された接続端子片５ａ
が、脚部側面からシャシ基板１７の表面に平行に突出し
ており、これが回路パターン１９と端子部１９ａと半田
２１で接続されている。FIG. 2 is a side cross-sectional view showing the state in which the erasing head 5 is mounted, and shows a connecting terminal piece 5a integrally formed with the erasing head 5.
protrudes from the side surface of the leg in parallel to the surface of the chassis board 17, and is connected to the circuit pattern 19 and the terminal portion 19a with solder 21.
このように構成され電子部品取付装置の取付方法につい
て、第１図ないし第５図により説明する。A method of attaching the electronic component attaching device constructed in this way will be explained with reference to FIGS. 1 to 5.
まず、金属板に打抜き、縁曲げ等のプレス成形加工を施
し、リール台、キャプスタン駆動装置（共に図示せず）
を取り付ける装着孔１７ａ、補強州立−１−縁１７ｂが
形成されたシャシ基板１７を得る。First, a metal plate is subjected to press forming such as punching and edge bending, and a reel stand and a capstan drive device (both not shown) are formed.
A chassis board 17 is obtained in which a mounting hole 17a for attaching a reinforcing state-1 edge 17b is formed.
一方、テープ終始端検出装置４および消去ヘッド５等の
電子部品装置は、第２図に示した消去ヘッド５の例のよ
うに、磁気ヘッド５ｂと電気的に接続された接続端子片
５ａをその取付は本体に一体に成形して置く。次に、第
１図に戻って、シャシ基板１７の表面に、回路パターン
１９を描く部分にのみ絶縁皮膜１８を塗布形成する。On the other hand, electronic component devices such as the tape end detecting device 4 and the erasing head 5, as in the example of the erasing head 5 shown in FIG. The installation is done by molding it integrally with the main body. Next, returning to FIG. 1, an insulating film 18 is applied and formed on the surface of the chassis substrate 17 only in the area where the circuit pattern 19 is to be drawn.
第３図に移り、」１記の絶縁皮膜１８が乾燥した後、導
電性ペースト２２を線描装置（図示せず）のノズル２３
の先端から押し出しながら回路パターン１９を描く。そ
の際、ノズル２３の先端は１寸法線りで示すように絶縁
皮膜１８と表面と一定の間隔を保ちながら矢印への方向
に移動させる。次に、第４図に示すように、未硬化の回
路パターン】９の端子部１９ａ」−に消去ヘッド５の接
続端子片５ａの先端を載せ。Turning to FIG. 3, after the insulating film 18 described in section 1 has dried, the conductive paste 22 is applied to the nozzle 23 of a line drawing device (not shown).
Draw the circuit pattern 19 while extruding from the tip. At this time, the tip of the nozzle 23 is moved in the direction of the arrow while maintaining a constant distance between the insulating film 18 and the surface, as shown by the one-dimensional line. Next, as shown in FIG. 4, the tip of the connecting terminal piece 5a of the erasing head 5 is placed on the terminal portion 19a of the uncured circuit pattern 9.
ビス９（図示せず）で固定する。次に、第５図のように
、上記の接続端子片５ａの先端にクリーム半日１２４を
載せ、続いてそのまま加熱炉に入れ、回路パターン１９
を描いた導電性ペースト２２を焼成硬化すると同時に、
クリーム半１’Ｔ１２４を溶融し、接続端子片５ａと焼
成硬化した回路パターン１９とを電気的に接続する。次
に、第２図に示すように、絶縁層２０を塗布する。Fix with screw 9 (not shown). As shown in FIG.
At the same time as baking and hardening the conductive paste 22 depicting
The cream half 1'T124 is melted, and the connecting terminal piece 5a and the baked and hardened circuit pattern 19 are electrically connected. Next, as shown in FIG. 2, an insulating layer 20 is applied.
本発明に使用する導電性ペーストは、導電性充填材とし
て銀、銅、カーボン等を用い、バインダによって上記の
導電性充填材を鎖状に連結し、導電性を持たせたもので
、上記のバインダは塗付面に密着させ、物理的、化学的
に安定した塗膜を形成するものである。その他、溶剤２
分散剤等が添加されている。The conductive paste used in the present invention uses silver, copper, carbon, etc. as a conductive filler and connects the conductive fillers in a chain shape with a binder to give conductivity. The binder is brought into close contact with the surface to be coated to form a physically and chemically stable coating film. Others, solvent 2
Dispersants, etc. are added.
導電性ペースト２２には、高温焼成用と低温焼成用の２
種類があり、本実施例に用いる導電性ペースト２２は樹
脂の熱変形温度以下であって、クリーム半田２４の溶融
温度とほぼ同じ、例えば温度１５０℃、保持時間３０分
で焼成されて硬化する低温焼成用を使用する。このよう
な低温焼成用導電性ペーストの使用により、消去ヘッド
５等の電子部品装置の樹脂成形部に悪影響を与えること
なく、−度の加熱処理で回路パターン１９の焼成硬化と
クリーム半田２４による半田付けが可能となる。The conductive paste 22 has two types: one for high-temperature firing and one for low-temperature firing.
There are various types of conductive pastes, and the conductive paste 22 used in this embodiment has a temperature below the heat distortion temperature of the resin and approximately the same as the melting temperature of the cream solder 24. Use one for baking. By using such a conductive paste for low-temperature firing, the circuit pattern 19 can be fired to harden and the cream solder 24 can be soldered by -degree heat treatment without adversely affecting the resin molded parts of the electronic component devices such as the erasing head 5. It becomes possible to attach.
次に、本発明の第２の実施例として、ダイカスト成形さ
れたシャシ基板２５を例として第６図により説明する。Next, a second embodiment of the present invention will be described with reference to FIG. 6, taking a die-cast chassis substrate 25 as an example.
同図において、第２の実施例が第３図に示した第１の実
施例と異なる点は、ダイカスト成形されたアルミニウム
合金製のシャシ基板２５で、その表面に傾斜面２５ｂで
つないだ四部２５ａが形成されていることである。その
他は変わらないので、同じ構成部品には同一符号を付し
て、その説明を省略する。シャシ基板２５に形成された
凸部または四部２５ａの高さが、線描される回路パター
ン１９のＪｌｊさ（例えば２０〜２００μｍ）より十分
大きい時は、四部２５ａを傾斜面２５ｂでつなぐことに
よって均一な厚さに塗布することが可能となる。構成に
よっては、数十ｍの２５部または四部にも配線パターン
を形成することが可能となる。In the same figure, the second embodiment differs from the first embodiment shown in FIG. 3 in that it has a chassis substrate 25 made of die-cast aluminum alloy, and has four parts 25a connected to the surface thereof by inclined surfaces 25b. is formed. Since the rest remains the same, the same components are given the same reference numerals and their explanations will be omitted. When the height of the convex portions or four portions 25a formed on the chassis substrate 25 is sufficiently larger than the Jlj height (for example, 20 to 200 μm) of the circuit pattern 19 to be drawn, the four portions 25a are connected with the inclined surfaces 25b to form a uniform pattern. It is possible to apply thick coating. Depending on the configuration, it is possible to form a wiring pattern on 25 or even 4 parts of several tens of meters.
また、第３の実施例として、樹脂成形されたシャシ基板
は、絶縁皮膜１８を形成する工程が不要となるほかは変
わらないので、その説明を省略する。Further, as the third embodiment, the resin-molded chassis board is the same except that the step of forming the insulating film 18 is not required, so the explanation thereof will be omitted.
なお１本実施例で説明した以外の１例えば抵抗。Note that one other than that explained in this embodiment, for example, a resistor.
コンデンサ等のチップ部品も２つの未硬化の回路パター
ン１９の２配線間にまたがるように載せ１両端にクリー
ム半田２４を載せて同様に加熱処理して。A chip component such as a capacitor is also placed so as to straddle the two wires of the two uncured circuit patterns 19, cream solder 24 is placed on both ends of the circuit pattern 19, and heat treatment is performed in the same manner.
回路パターン１９に電子回路を形成することができる。An electronic circuit can be formed in the circuit pattern 19.
（発明の効果）
以」二説明したように、本発明によれば、プリン１−配
線回路基板が不要となるので、電子機器装置の小形化が
できる。シャシ」ル板−ヒの電子部品装置とプリン１へ
配線回路ノ１（板とを′電気的に接続していたリード線
やコネクタが不要となるので、組立の１’ｌ ｊＦｉｌ
化が可能となり、従って、製造コストが大幅に低下する
。また、導電性ペーストで描いた回路パターンの焼成硬
化と半田のリフロー処理が一回の熱処理で行うことがで
き、製造工程が短縮される。また、表面形状の複雑な樹
脂成形やダイカスト成形のシャシ基板にも適用できる。(Effects of the Invention) As described above, according to the present invention, the printed circuit board is not required, so that the electronic device can be downsized. Since the lead wires and connectors that electrically connect the electronic components on the chassis board and the wiring circuit board 1 to the board 1 are no longer required, assembly time is reduced.
This makes it possible to reduce manufacturing costs significantly. Moreover, baking hardening of the circuit pattern drawn with the conductive paste and reflow treatment of the solder can be performed in a single heat treatment, thereby shortening the manufacturing process. It can also be applied to resin-molded or die-cast chassis substrates with complex surface shapes.
さらに、心電性ペーストを用いた線描装置４で回路パタ
ーンを形成するので、径路の変更により容易に回路パタ
ーンの設計を変更することができる。従って、電子機器
装置の製造コス１へを大幅に低）賊することができる。Furthermore, since the circuit pattern is formed by the line drawing device 4 using electrocardiographic paste, the design of the circuit pattern can be easily changed by changing the route. Therefore, the manufacturing cost of the electronic device can be significantly reduced.
４、 図面の簡？１１．な説明
第１図は本発明の第１の実施例の電子部品取付装置を用
いたシャシ基板の斜視図、第２図は第１図の要部拡大断
面図、第３図ないし第５図は第１の実施例の取付方法を
説明するための要部拡大断面図、第６図は第２の実施例
の取付方法を説明するための要部拡大断面図、第７図は
従来の電子部品取付装置の側面断面図である。4. Simple drawing? 11. 1 is a perspective view of a chassis board using the electronic component mounting device of the first embodiment of the present invention, FIG. 2 is an enlarged sectional view of the main part of FIG. 1, and FIGS. 3 to 5 are FIG. 6 is an enlarged sectional view of the main part to explain the mounting method of the first embodiment, FIG. 6 is an enlarged sectional view of the main part to explain the mounting method of the second embodiment, and FIG. 7 is a conventional electronic component. FIG. 3 is a side cross-sectional view of the attachment device.
１．２・・・リール台、 ３，１７．２５・・・シ
ャシ基板、 ４・・・テープ終始端検出装置、４ａ・・
・発光素子、 ４ｂ、 ５ａ・・・接続端子片、５・・
・消去ヘッド、５ｂ・・・磁気ヘッド、６・・・キャプ
スタン駆動装置、 ６ａ・・・キャプスタン、 ７・
・・キャプスタンＦＧ検出装置、 ７ａ・・・検出素子
、 ８．９．１０．１１゜１４・・・ビス、 】２・・
・プリント配線回路基板、１；３・・・スペーサ、１５
・・・リード線、 １６・・・コネクタ、 １７ａ・
・・装着孔、 １７ｂ・・・補強用立上縁、 １８・・
・絶縁皮膜、 １９・・・回路パターン、 １９１１・
・・端子部、 ２０・・・絶縁Ｓり。1.2... Reel stand, 3,17.25... Chassis board, 4... Tape end/start end detection device, 4a...
・Light emitting element, 4b, 5a... Connection terminal piece, 5...
- Erase head, 5b... Magnetic head, 6... Capstan drive device, 6a... Capstan, 7.
... Capstan FG detection device, 7a... Detection element, 8.9.10.11゜14... Screw, ]2...
・Printed wiring circuit board, 1; 3...Spacer, 15
...Lead wire, 16...Connector, 17a.
...Mounting hole, 17b...Rising edge for reinforcement, 18...
・Insulating film, 19...Circuit pattern, 1911・
...Terminal section, 20...Insulation S-ring.
２１・・半田、２２・・・導電性ペースト、 ２３・・
・ノズル、 ２４・・クリ−１１半田、
部、 ２５ｂ・・・傾斜面。21...Solder, 22...Conductive paste, 23...
- Nozzle, 24... Cree-11 solder, part, 25b... Inclined surface.
２５ａ・・・凹25a...concave
Claims (2)
上記の絶縁表面に導電性ペーストで描いて硬化した回路
パターンと、上記の回路パターンに接触するような接続
端子を一体に成形した電子部品装置と、上記の剛性基板
の表面に設けた上記の電子部品装置をビス止めするねじ
孔と、上記電子部品装置の接続端子片と上記の回路パタ
ーンの端子部とを電気接続する半田部とからなる電子部
品取付装置。(1) a rigid substrate having at least a flat insulating surface;
An electronic component device includes a circuit pattern drawn and cured with conductive paste on the above insulating surface, a connecting terminal that comes into contact with the above circuit pattern, and an electronic component device formed on the surface of the above rigid substrate. An electronic component mounting device comprising a screw hole for screwing a component device, and a solder portion for electrically connecting a connecting terminal piece of the electronic component device and a terminal portion of the circuit pattern.
縁表面に導電性ペーストで回路パターンを形成し、未硬
化の回路パターンの上に電気部品装置の接続端子片が位
置するように電子部品装置を取り付け、上記の接続端子
片の先端部にクリーム半田を載せた後、１回の加熱処理
をすることにより上記の導電性ペーストの焼成硬化とリ
フロー半田付けとを行うことを特徴とする電子部品取付
方法。(2) Form a circuit pattern using conductive paste on the insulating surface of a rigid substrate that has at least a flat insulating surface, and attach the electronic component device so that the connecting terminal piece of the electrical component device is located on the uncured circuit pattern. Attachment of electronic components, characterized in that after cream solder is placed on the tip of the connection terminal piece, the conductive paste is baked and hardened and reflow soldered by one heat treatment. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29621588A JPH02143591A (en) | 1988-11-25 | 1988-11-25 | Device and method for mounting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29621588A JPH02143591A (en) | 1988-11-25 | 1988-11-25 | Device and method for mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02143591A true JPH02143591A (en) | 1990-06-01 |
Family
ID=17830668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29621588A Pending JPH02143591A (en) | 1988-11-25 | 1988-11-25 | Device and method for mounting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02143591A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6357106B1 (en) * | 1998-03-03 | 2002-03-19 | Matsushita Electric Industrial Co., Ltd. | Method for mounting parts and making an IC card |
-
1988
- 1988-11-25 JP JP29621588A patent/JPH02143591A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6357106B1 (en) * | 1998-03-03 | 2002-03-19 | Matsushita Electric Industrial Co., Ltd. | Method for mounting parts and making an IC card |
| CN1313966C (en) * | 1998-03-03 | 2007-05-02 | 松下电器产业株式会社 | Element mounting method, IC card and producing method therefor |
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