JPS6258395B2 - - Google Patents
Info
- Publication number
- JPS6258395B2 JPS6258395B2 JP55161212A JP16121280A JPS6258395B2 JP S6258395 B2 JPS6258395 B2 JP S6258395B2 JP 55161212 A JP55161212 A JP 55161212A JP 16121280 A JP16121280 A JP 16121280A JP S6258395 B2 JPS6258395 B2 JP S6258395B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic powder
- magnetic field
- acicular
- anisotropic conductive
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000006247 magnetic powder Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 4
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 150000002978 peroxides Chemical class 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は異方性導電接着剤の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing an anisotropic conductive adhesive.
近年増々小型化されたI.Cおよびチツプコンデ
ンサー、抵抗などの電子部品をプリント基板に装
置するのに、従来のハンダ付け方法ではこれら電
子部品のプリント基板への装着密度の増大と共
に、これら電子部品相互間の間隙があまりにも狭
すぎてハンダ付けの際これら部品のハンダ付け必
要箇所以外にハンダの橋架け現象が起るなどし
て、ハンダデイツプで問題が発生する。同様の問
題が一つの部品、例えばリード間隔がきわめて狭
い小型I.Cに於ても起る。 In recent years, electronic components such as ICs, chip capacitors, and resistors, which have become smaller and smaller, are mounted on printed circuit boards, but with conventional soldering methods, the mounting density of these electronic components on printed circuit boards has increased, making it difficult to connect these electronic components to each other. If the gap is too narrow, problems occur with solder dips, such as bridging of solder in areas other than those where soldering is required during soldering. A similar problem occurs in a single component, such as a small IC with extremely narrow lead spacing.
本発明は上記の問題点を解決すべくなされたも
のであり、ハンダ付け作業よりはるかに低温で電
子部品の取り付け作業が可能な異方性導電接着剤
を得る方法を提供するものである。 The present invention has been made to solve the above-mentioned problems, and provides a method for obtaining an anisotropic conductive adhesive that can be used to attach electronic components at a much lower temperature than soldering.
本発明は針状の導電性磁性粉を、低粘度の液状
光硬化性樹脂中に分散し、磁場をかけながら針状
の磁性粉を磁場方向に配向させた後、紫外線を照
射して樹脂を硬化して磁場方向に良好な導電性を
示すがこれと直角に交る面の方向には全く導電性
を示さない異方性導電接着剤を得るものである。 The present invention involves dispersing acicular conductive magnetic powder in a low-viscosity liquid photocurable resin, orienting the acicular magnetic powder in the direction of the magnetic field while applying a magnetic field, and then irradiating the resin with ultraviolet rays. The purpose is to obtain an anisotropic conductive adhesive that exhibits good conductivity in the direction of a magnetic field when cured, but exhibits no conductivity at all in the direction perpendicular to the magnetic field.
本発明による接着剤の実際の使用法をプリント
配線基板上にチツプコンデンサーを取り付ける場
合を例にとつて示す。 The actual use of the adhesive according to the present invention will be explained by taking as an example the case where a chip capacitor is mounted on a printed wiring board.
本発明の接着剤は基板上の電子部品をハンダ付
けしようとする箇所が密集し存在している場合に
特に有効である。まずスクリーン印刷法など適当
な方法で針状を導電性磁性粉を含む光硬化性樹脂
よりなる接着剤を薄く基板上の目的箇所にごく大
ざつぱに塗布し、その後基板の上下方向から強力
な磁場を加えながら紫外線を照射して接着剤層を
硬化させる。この場合紫外線硬化触媒を適当に選
び、空気と接する接着剤層の硬化を進み難くして
おくとこの接着層の表面は粘着性を有したまゝプ
リント基板と垂直方向には良好な導電性を保持
し、それと直角の面方向には全く導電性のない異
方性導電性粘着層を得ることができる。その後所
望のチツプコンデンサーを上記の粘着剤層上の正
確な位置に軽く乗せると粘着力によりこれら電子
部品は基板の所定の位置に保持される。最後に完
全な電子部品の接着を計るため、高温炉に基板を
投入しこの粘着層を熱硬化させて、電子部品の取
り付けを完了する。以下本発明の一実施例を詳細
に説明する。 The adhesive of the present invention is particularly effective when there are densely packed locations on a board where electronic components are to be soldered. First, use a suitable method such as screen printing to apply a thin layer of adhesive made of photocurable resin containing conductive magnetic powder to the target area on the board, and then apply a strong magnetic field from above and below the board. The adhesive layer is cured by irradiating it with ultraviolet light while adding. In this case, by selecting an appropriate ultraviolet curing catalyst to make it difficult for the adhesive layer that comes into contact with air to harden, the surface of this adhesive layer will remain sticky and have good conductivity in the direction perpendicular to the printed circuit board. It is possible to obtain an anisotropic conductive adhesive layer which has no conductivity at all in the plane direction perpendicular thereto. Thereafter, when a desired chip capacitor is lightly placed on the adhesive layer at a precise position, the adhesive force holds these electronic components in a predetermined position on the board. Finally, to ensure complete adhesion of the electronic components, the board is placed in a high-temperature furnace to heat cure the adhesive layer, completing the attachment of the electronic components. An embodiment of the present invention will be described in detail below.
実施例 １
エポキシアクリレート60重量部とネオペンチル
グリコールジアクリレート40重量部に光硬化剤ベ
ンゾインイソプロピルエーテル２重量部、熱硬化
剤ベンゾフエノン２重量部を配合した樹脂組成物
104重量部に、針状のニツケル粉末60重量部を配
合し、均一に分散して接着剤を得た。この接着剤
をプリント配線基板上にスクリーン印刷法で塗布
し、基板の上下方向より4000ガウス／cmの磁場を
かけながら効率28.6W／cm2の高圧水銀灯ランプか
ら25cmの距離で接着層の温度が60℃を越えない様
注意して１分間照射して接着層を硬化させた。こ
のとき空気に接した接着層の表面は硬化が不完全
で粘着性を有するがこの状態でチツプコンデンサ
ーなどの電子部品を押しつけ粘着力で基板に仮り
どめする。その後、120℃で10分間加熱してこの
粘着層を完全硬化した。このようにして得られた
接着層は、厚さ方向に0.3Ω／mm以下の良好な導
電性を示したがその直角方向の揚には1012Ωcm以
上の絶縁抵抗を示し、その剪断力も１Kg／mm2を有
する良好な異方性導電接着剤であつた。Example 1 A resin composition containing 60 parts by weight of epoxy acrylate and 40 parts by weight of neopentyl glycol diacrylate, 2 parts by weight of photocuring agent benzoin isopropyl ether, and 2 parts by weight of thermosetting agent benzophenone.
60 parts by weight of acicular nickel powder was blended with 104 parts by weight and uniformly dispersed to obtain an adhesive. This adhesive was applied onto a printed circuit board by screen printing, and the temperature of the adhesive layer was measured at a distance of 25 cm from a high-pressure mercury lamp with an efficiency of 28.6 W/cm 2 while applying a magnetic field of 4000 Gauss/cm from above and below the board. The adhesive layer was cured by irradiation for 1 minute, being careful not to exceed 60°C. At this time, the surface of the adhesive layer in contact with the air is not fully cured and remains sticky, but in this state electronic components such as chip capacitors are pressed and temporarily fixed to the board by the adhesive force. Thereafter, this adhesive layer was completely cured by heating at 120° C. for 10 minutes. The adhesive layer thus obtained showed good electrical conductivity of 0.3 Ω/mm or less in the thickness direction, but exhibited insulation resistance of 10 12 Ωcm or more in the direction perpendicular to it, and its shear force was also 1 kg. /mm 2 and was a good anisotropic conductive adhesive.
なお本発明に使用される導電性の針状磁性粉
は、ニツケルに限るものではなく、鉄、ニツケ
ル、コバルトなどの金属およびこれらの合金から
なる針状の磁性粉を使用することもできるととも
に、例えばγ−Fe2O3の様に導電性の低い針状磁
性粉であつてもこれらの表面に導電性の良好な、
金、銀、銅、ニツケルなどのメツキを施して使用
することができる。またこれらのバインダーとし
て使用される樹脂については特に制限するもので
なく、光硬化が可能な低粘度の液状樹脂であれば
良い。しかし光硬化触媒については光硬化時樹脂
の空気接触界面で未硬化樹脂層が残り粘着性を示
すものが良く、この目的のためにベンゾインイソ
プロピルエーテル、ベンゾフエノン、ベンゾイン
イソブチルエーテルなどが使用される。又電子部
品を保持する粘着層を完全硬化するためジターシ
ヤリブチルパーオキサイド、ベンゾイルパーオキ
サイド、ジクミルパーオキサイドなどの過酸化物
を配合すれば良い。 The conductive acicular magnetic powder used in the present invention is not limited to nickel, and acicular magnetic powder made of metals such as iron, nickel, cobalt, and alloys thereof can also be used. For example, even if it is an acicular magnetic powder with low conductivity such as γ-Fe 2 O 3 , there is a layer with good conductivity on its surface.
It can be plated with gold, silver, copper, nickel, etc. Further, there are no particular restrictions on the resin used as these binders, and any low-viscosity liquid resin that can be photocured may be used. However, as for the photo-curing catalyst, it is preferable that an uncured resin layer remains on the air-contact interface of the resin during photo-curing and exhibits tackiness, and for this purpose, benzoin isopropyl ether, benzophenone, benzoin isobutyl ether, etc. are used. Further, in order to completely cure the adhesive layer that holds the electronic parts, a peroxide such as ditertiary butyl peroxide, benzoyl peroxide, dicumyl peroxide, etc. may be blended.
Claims (1)
し、磁場をかけながら針状の磁性粉を磁場方向に
並べた後紫外線を照射して、光硬化性樹脂を硬化
させ、磁場方向には良好な導電性を有し、かつそ
れと直角方向に交る面の方向には全く導電性を示
さない導電接着剤を得ることを特徴とする異方性
導電接着剤の製造方法。 ２ 特許請求の範囲第１項において、針状の導電
性磁性粉は、鉄、コバルト、ニツケルなどの単一
金属もしくは、これらの合金からなることを特徴
とする異方性導電接着剤の製造方法。 ３ 特許請求の範囲第１項において針状の導電性
磁性粉は、非導電性酸化物磁性粉の表面に金属を
メツキして導電性を付与したものであることを特
徴とする異方性導電接着剤の製造方法。 ４ 特許請求の範囲第１項において光硬化性樹脂
の光硬化触媒として、ベンゾインイソプロピルエ
ーテル、ベンゾフエノン、ベンゾインイソブチル
エーテルなどの中から選択した一種又は二種以上
を組合せたものを使用添加するとともに更に、過
酸化物系触媒を添加したことを特徴とする異方性
導電接着剤の製造方法。[Claims] 1. Adding acicular conductive magnetic powder to a photocurable resin, arranging the acicular magnetic powder in the direction of the magnetic field while applying a magnetic field, and then irradiating it with ultraviolet rays to form a photocurable resin. An anisotropic conductive adhesive characterized by curing to obtain a conductive adhesive that has good conductivity in the direction of the magnetic field and shows no conductivity at all in the direction perpendicular to the direction of the magnetic field. manufacturing method. 2. A method for producing an anisotropic conductive adhesive according to claim 1, wherein the acicular conductive magnetic powder is made of a single metal such as iron, cobalt, or nickel, or an alloy thereof. . 3. In claim 1, the acicular conductive magnetic powder is an anisotropic conductive powder made of non-conductive oxide magnetic powder whose surface is plated with metal to give conductivity. Adhesive manufacturing method. 4. In claim 1, as a photocuring catalyst for the photocurable resin, one or a combination of two or more selected from benzoin isopropyl ether, benzophenone, benzoin isobutyl ether, etc. is used and added, and further, A method for producing an anisotropic conductive adhesive characterized by adding a peroxide catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16121280A JPS5785873A (en) | 1980-11-14 | 1980-11-14 | Production of anisotropic electrically conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16121280A JPS5785873A (en) | 1980-11-14 | 1980-11-14 | Production of anisotropic electrically conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785873A JPS5785873A (en) | 1982-05-28 |
| JPS6258395B2 true JPS6258395B2 (en) | 1987-12-05 |
Family
ID=15730732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16121280A Granted JPS5785873A (en) | 1980-11-14 | 1980-11-14 | Production of anisotropic electrically conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5785873A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546037A (en) * | 1984-09-04 | 1985-10-08 | Minnesota Mining And Manufacturing Company | Flexible tape having stripes of electrically conductive particles for making multiple connections |
| JPH07771B2 (en) * | 1985-07-10 | 1995-01-11 | カシオ計算機株式会社 | Method for producing conductive adhesive |
| US4960614A (en) * | 1987-02-06 | 1990-10-02 | Key-Tech, Inc. | Printed circuit board |
| JPS6386783A (en) * | 1987-07-10 | 1988-04-18 | Shin Etsu Polymer Co Ltd | Antisotropically electrically conductive adhesive film |
| JPH04117477A (en) * | 1990-09-07 | 1992-04-17 | Nec Corp | Anisotropic conductive material and method for connecting integrated circuit element using the same |
| JP2851800B2 (en) * | 1994-10-20 | 1999-01-27 | インダストリアル テクノロジー リサーチ インスチチュート | Method for connecting circuit member and substrate using conductive adhesive |
| US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
| EP0855049B1 (en) | 1996-08-01 | 2005-11-09 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
| US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5279546U (en) * | 1975-12-11 | 1977-06-14 |
-
1980
- 1980-11-14 JP JP16121280A patent/JPS5785873A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785873A (en) | 1982-05-28 |
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