JPS622592A - Manufacture of smoothing type circuit module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a manufacturing method in which a part of the connector of a smooth circuit module is improved.

[Technical Background of the Invention and Problems Therewith] In general, a smooth circuit module is produced by curing a chip type component with a liquid resin, forming a conductive pattern with a conductive resin, and then forming a connector with a conductive paste. Then, the metal plate connector is directly connected to the terminal portion using conductive paste.

However, it has the disadvantage of being easily damaged due to its weak conductivity. Therefore, in order to strengthen the bond with metal plate connectors, there has been a need for a material that has better conductivity than conductive paste and that does not damage the conductive material in the terminal portion during bonding. Currently, flexible printed boards are coated with Au plating, etc., but connectors are not manufactured for smooth circuit modules, and the need for connectors is even greater, as they can be connected to other devices. It is expected that However, as shown above, if a connector is constructed by printing a conductive paste, the printed portion will break, so it cannot be said that the reliability is very good. Therefore, as shown above, the terminal part is coated with Au plating, etc. in the same way as the structure of the flexible printed board connector, so that the terminal part is not damaged and has good conductivity to eliminate the defects. It is something that

[Object of the Invention] An object of the present invention is to provide a method for manufacturing a smooth circuit module that does not cause damage to terminal portions during connector connection and can be constructed from a conductor with good conductivity.

[Summary of the invention] The outline of the present invention will be explained in detail with reference to FIG.

First, a chip-type electronic component (1) and a spacer (4) are placed on an adhesive film (2) (3), and a liquid resin is injected to fill the actual space. A thermosetting resin, an ultraviolet curable resin, etc.) is cured, and the support and a spacer are removed, a thermosetting resin is cured by heat treatment, and an ultraviolet curable resin is cured by ultraviolet light.

In this state, the electrode portions of each component are exposed.

In this state, a conductor path is formed on the surface where the electrode surface is exposed.

The conductors used here include resin, Ag, and Cu.

Ag-Pd, Aj! , a conductive paste made by kneading metal powders such as Au, alloys thereof, semiconductor powders such as SiC, carbon powders, etc., or Aj! , Cu,
A thin film conductor on which a metal such as Mo is vapor-deposited is used. Furthermore, the method for forming the conductor path is not particularly limited, and can be formed by using a conductive base, screen printing, drawing by Tessbenser, or photolithography.

The adhesive film here consists of an adhesive layer and a film layer that serves as a support, and because the electrode surface of the chip component is exposed on the same surface as the resin surface, the liquid resin does not flow into the electrode part of the chip component. Any material that can ensure adhesion to the parts and will not be immersed in liquid resin is sufficient, such as silicone resin in gel state, vinyl acetate-ethylene copolymer, and polyethylene film in heated state. etc. are suitable. Further, the support for this adhesive material may be not only a film but also a sheet-like or hard plate-like material made of metal or plastic.

The liquid resin is not only one that is liquid at room temperature, but also one that becomes liquid when heated. Suitably, liquid epoxy resins, ultraviolet curable resin compositions, and unsaturated polyester resins are easy to handle, but are not particularly limited.

Furthermore, the plating method used here refers to metal plating.

[Effects of the Invention] The effects obtained by the present invention are that damage to the terminal portion during connector joining is eliminated, and a conductor with good electrical conductivity can be obtained.

[Embodiments of the invention]

As shown in Figure 1 (a), a film made of a single layer of 20 μm thick vinyl acetate-ethylene copolymer formed on a 100 μm Mylar film is prepared, each electronic component is mounted in a predetermined position, and pressure is applied while heating it slightly. did.

Next, take a formwork on all sides, inject an ultraviolet curing resin (product name UVX-E211 manufacturer: Three Bond) into it, coat it with a film and cure it (
Figure 1 (C)). Thereafter, when the film was peeled off, the electrode surface was flush as shown in FIG. 1(d).

Next, silver paste (product name: Conductor paste)
After surface printing was performed on the surface of the material (#6838 manufactured by DuPont) in a predetermined pattern, it was cured by heating at 150° C. IH.

Furthermore, UV curing resist (product name Solder Resist 150)
The resulting circuit module (manufacturer B: Taiyo Ink ■) was coated with only the terminal portions remaining, and then heated and cured with ultraviolet light.

Next, the terminal portion printed with silver paste is immersed in Au plating solution (trade name: Atomex, manufactured by Engelhardt) at 60°C for 5 minutes, Au plating is applied, and the terminal is dried for 30 minutes to complete.

As described above, according to the present invention, metal plating is applied to the terminal portions of the circuit module, so that there is no damage to the terminal portions when connected to a connector, and the manufacturing process is relatively simple.

It should be noted that the present invention is not limited to the embodiments shown above, and various changes may be made in the material process order, shape, etc. of each part without departing from the gist of the present invention.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the process for explaining the present invention in detail;
FIG. 2 is a diagram showing the connection between the connector and the board. (1): Chip type electronic component. (2): Support film. (3) Two sticky substances. (4): Suspender. (5): Liquid resin. (6): Film for coating. (7): Conductor line pattern. (8): UV curing resist. (9): Metal plating. (to): CR connector. Representative Patent Attorney Kensuke Norichika (and 1 other person) (C) (t') (I) No. 1II

Claims (1)

[Claims] A chip-type electronic component is placed at a predetermined position on an adhesive support, a liquid resin is injected to fill the space, the liquid resin is cured, the support is removed, and a conductive pattern is formed with a conductive resin. A method for manufacturing a smooth circuit module, characterized in that the terminal portions are plated with metal.