JPS645023A - Manufacture of resin mold having electronic parts - Google Patents

Manufacture of resin mold having electronic parts

Info

Publication number
JPS645023A
JPS645023A JP16046587A JP16046587A JPS645023A JP S645023 A JPS645023 A JP S645023A JP 16046587 A JP16046587 A JP 16046587A JP 16046587 A JP16046587 A JP 16046587A JP S645023 A JPS645023 A JP S645023A
Authority
JP
Japan
Prior art keywords
electronic parts
metal mold
resin moldings
manufacture
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16046587A
Other languages
Japanese (ja)
Other versions
JPH0687469B2 (en
Inventor
Tokumasa Higuchi
Yuzo Nakamura
Toshiyuki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP62160465A priority Critical patent/JPH0687469B2/en
Publication of JPS645023A publication Critical patent/JPS645023A/en
Publication of JPH0687469B2 publication Critical patent/JPH0687469B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

Abstract

PURPOSE:To avoid position deviation of electronic parts, and obtain resin moldings excellent in airtight property, by fixing a base film having exfoliating property on which electronic parts are fixed with adhesive agent, at a specified position in a metal mold, and unifying the electronic parts in a body. CONSTITUTION:A base film 1 on which electronic parts are fixed is arranged at a specified position in a metal mold 4. If necessary, the film 1 is fixed outside the cavity of the metal mold 4. After the metal mold 4 is closed, thermoplastic or the like is injection-molded to form resin moldings. From the metal mold 4, the resin moldings are taken out, and the film is exfoliated from the resin moldings. Thereby, position deviation of parts 3 is avoided, and resin moldings excellent in airtight property can be obtained.
JP62160465A 1987-06-26 1987-06-26 Method for manufacturing resin molded body having electronic component Expired - Fee Related JPH0687469B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62160465A JPH0687469B2 (en) 1987-06-26 1987-06-26 Method for manufacturing resin molded body having electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62160465A JPH0687469B2 (en) 1987-06-26 1987-06-26 Method for manufacturing resin molded body having electronic component

Publications (2)

Publication Number Publication Date
JPS645023A true JPS645023A (en) 1989-01-10
JPH0687469B2 JPH0687469B2 (en) 1994-11-02

Family

ID=15715532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62160465A Expired - Fee Related JPH0687469B2 (en) 1987-06-26 1987-06-26 Method for manufacturing resin molded body having electronic component

Country Status (1)

Country Link
JP (1) JPH0687469B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998042488A1 (en) * 1997-03-21 1998-10-01 Tlog Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method
FR2796880A1 (en) * 1999-07-26 2001-02-02 Europlastiques Sa Injection moulded plastic article includes electronic label whose surface is visible with rim of plastic covering periphery of surface of label
JP5911144B2 (en) * 2010-07-02 2016-04-27 国立研究開発法人産業技術総合研究所 Micro mechanical system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159262A (en) * 1974-06-12 1975-12-23
JPS622592A (en) * 1985-06-28 1987-01-08 株式会社東芝 Manufacture of smoothing type circuit module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159262A (en) * 1974-06-12 1975-12-23
JPS622592A (en) * 1985-06-28 1987-01-08 株式会社東芝 Manufacture of smoothing type circuit module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998042488A1 (en) * 1997-03-21 1998-10-01 Tlog Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method
US6482287B1 (en) 1997-03-21 2002-11-19 Tlog Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method
FR2796880A1 (en) * 1999-07-26 2001-02-02 Europlastiques Sa Injection moulded plastic article includes electronic label whose surface is visible with rim of plastic covering periphery of surface of label
JP5911144B2 (en) * 2010-07-02 2016-04-27 国立研究開発法人産業技術総合研究所 Micro mechanical system

Also Published As

Publication number Publication date
JPH0687469B2 (en) 1994-11-02

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees