WO1998042488A1 - Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method - Google Patents

Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method Download PDF

Info

Publication number
WO1998042488A1
WO1998042488A1 PCT/FR1998/000560 FR9800560W WO9842488A1 WO 1998042488 A1 WO1998042488 A1 WO 1998042488A1 FR 9800560 W FR9800560 W FR 9800560W WO 9842488 A1 WO9842488 A1 WO 9842488A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
label
plastic
wall
mold
Prior art date
Application number
PCT/FR1998/000560
Other languages
French (fr)
Inventor
Antoine De Gaulle
Original Assignee
Tlog
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tlog filed Critical Tlog
Priority to AU70494/98A priority Critical patent/AU7049498A/en
Priority to DE69806912T priority patent/DE69806912T2/en
Priority to EP98917190A priority patent/EP0968078B1/en
Priority to US09/381,416 priority patent/US6482287B1/en
Priority to AT98917190T priority patent/ATE221443T1/en
Priority to JP54324998A priority patent/JP2001517167A/en
Publication of WO1998042488A1 publication Critical patent/WO1998042488A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B65D25/205—Means for the attachment of labels, cards, coupons or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14114—Positioning or centering articles in the mould using an adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00—Decoration means, markings, information elements, contents indicators
    • B65D2203/10—Transponders

Definitions

  • thermotransformed object Method for including an electronic label in the wall of a thermotransformed object, preparatory device for this method, and molded object obtained by this method
  • the present invention relates to a method for inserting a thin electronic label with a flat face into the wall of an object produced by plastic transformation (injection or compression molding, rotational molding or blowing) with heat and pressure of thermotransformable plastics, in particular ABS (acrylonitrile-butadiene-styrene), polyurethanes, polyolefins such as polypropylene or polyethylene (and in particular high density polyethylene [HDPE]).
  • molding will be called any thermotransformation performed in a mold, whether it is a true molding, or a blowing.
  • the inserted label allows the remote and contactless identification of the object that contains it, which is particularly advantageous when the identified objects must be authenticated or sorted. It is introduced without the need to modify either the process or the injection device.
  • the objects targeted are very diverse and can in particular be containers (bins, trash cans, flasks and bottles), pallets, component parts of vehicles (shield, dashboard), works of art.
  • the object of the invention is to improve the method of including an electronic label during molding, and in particular to allow simple placement, practically at will and achievable even in thin walls.
  • the flat face of the label is first fixed on a plastic support of thickness substantially equal to the desired depth of inclusion, the support is fixed to the wall of the mold, the plastic molding is brought into the mold under predetermined pressure and temperature, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that a connection is made between the two plastics intimate in the contact region.
  • This bond is of the autogenous weld type, obtained by fusion and interpenetration of the two plastics in the contact region.
  • the support during molding serves as a cushion for transient pressures due to injection.
  • the melting point of the plastic material of the support is lower (and preferably sufficiently lower) than that of the plastic molding material, so as to ensure its melting well by contact with the molding material.
  • the plastic molding material and that of the support are advantageously chosen from high density polyethylenes, that of the support having a lower density than that of molding to establish the difference between the melting points mentioned above.
  • the melting temperatures of the first and second HDPE can be in the ranges of 150 ° C-200 ° C and 200 ° C-250 ° C respectively.
  • ABS or polyurethanes are also particularly suitable.
  • the label can be placed anywhere in the mold, but preferably an area close to reinforcements and therefore unlikely to cause undue bending in the label itself.
  • the thin planar electronic label used in the invention is of a type known in itself, although it is the invention to have established that thin labels could be incorporated during the molding without protection by housing, contrary to what teaches for example the document WO 93 24381 A cited above.
  • the label is an inductive label, without energy, constituted by an electrical circuit forming an antenna, printed on an insulating substrate of suitable quality, connected to an integrated circuit comprising a memory and the devices for communication with this memory from the outside and without contact.
  • substrate of suitable quality is understood to mean in particular that it is resistant to the temperatures of around 200 ° C. encountered during molding, and that it has a certain rigidity, while being flexible, this rigidity contributing to its correct maintenance without wrinkling during molding.
  • the substrates commonly used in thin epoxy for example from one to a few tenths of a mm, have this quality.
  • Other materials such as kapton or PET are also suitable.
  • the contents of the memory can be read, even modified, without contact by the passage of electromagnetic waves through a certain thickness of the plastic material of the substrate and the wall of the object in which it is molded.
  • the identification electromagnetic waves can theoretically be BF, HF or UHF waves, the invention first of all focuses on labels using rather high frequencies (around 10 MHz, and in particular the approved frequency 13.56 MHz), with which it is possible to use an antenna of small dimensions, printed on the substrate (as opposed in particular to certain transponders of one prior art using antennas with multiple coils which risk being damaged during molding).
  • the method is however applicable to lower frequencies, and in particular below 150 kHz, provided with a printed antenna.
  • the printing of an antenna, in particular by screen-printed conductive ink, is well known to those skilled in the art (cf. for example the document FR 2 753 305 A).
  • the label comprises at least one substantially flat face, generally that opposite to the integrated circuit, the other face often comprising a bead of resin protecting the chip of the integrated circuit.
  • the total thickness of the thin label is of the order of 0.6 mm to 1 mm in line with the chip.
  • flat is mainly meant a substantially planar geometric surface, but also more generally a developable surface (for example cylindrical), making it possible to stick a support sheet thereon, such a surface being able to better match the shape of certain molded objects.
  • the support is advantageously fixed by gluing on the one hand to the flat face of the label and / or on the other hand to the wall of the mold, gluing in particular produced using a double-sided adhesive tape.
  • the adhesive used to stick the label to the support is a double-sided adhesive having strong adhesion qualities on both sides (because it must stick materials with low adhesion power, such as polyethylene), and resistant to molding temperatures.
  • the adhesive used to stick the support to the mold is strongly adherent on its face intended to receive the support, but only weakly adhered on the other face intended to stick on the steel of the mold. Repositionable adhesive type adhesion is sufficient because steel allows good natural bonding. Moreover, it is advantageous to present the labels provided with their support and the two adhesives on a temporary non-stick support, such as a silicone film, from which they are detached to stick them on the mold.
  • the double-sided adhesive which is during molding in contact with the mold and is not directly exposed to the molding material, must withstand a temperature generally less than 100 ° C. (taking into account the cooling of the molds generally strong). Its thickness is as small as possible, so as not to create on the molded object, once removed, too large a recess.
  • the label support is cut from a thin sheet of plastic material, of a chemical nature and of physical characteristics chosen to obtain the fusion welding mentioned above.
  • Its thickness is preferably less than 1 mm, and advantageously of the order of 500 ⁇ m: an excessively large thickness opposes more thermal inertia to the localized heating and melting of the support in contact with the molding material; on the other hand, too much thickness can lead to phenomena of reflux and irregularities in molding, when the molten molding material passes over the label glued to the mold.
  • the support is prepared in a sheet directly coated on each of its two faces with the adhesive necessary to stick on the one hand the label and on the other hand the mold (or the provisional support), making unnecessary use of the double-sided adhesives mentioned above.
  • the support protrudes from the label so as to create a sufficiently large contact surface between it and the molding material to produce solid integration of the molded object label.
  • This contact surface is provided outside the label, and / or, by cutting a central part of the label not occupied by the printed circuit, inside the label itself.
  • the support when the dimensions of the label make it advisable to make a central cut, also has a central hole, so that the molding material can flow to the wall of the mold, in the center of the label. and support, and facilitate the degassing of the plastic.
  • the surface part of the support which protrudes from the label, externally and / or internally, can be provided with channels facilitating the evacuation of gases and contributing to the absence of bubbles.
  • the label can receive on its face other than the flat face other covering elements such as a sheet of plastic material; it can also be previously embedded in a block of plastic before being placed on the support, or else said block can directly constitute, on the side of the flat face of the label, said support if the material constituting the block is chosen properly.
  • the invention also relates, as an intermediate means for the above method, to a preparatory device for the inclusion of a thin electronic label with a flat face, at a predetermined depth in a wall of a molded object.
  • a preparatory device for the inclusion of a thin electronic label with a flat face at a predetermined depth in a wall of a molded object.
  • made of plastic under a predetermined pressure and temperature characterized in that it comprises on the one hand said label and on the other hand a plastic support of thickness substantially equal to the desired depth of inclusion, support on which said flat face of the label is fixed, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that an intimate bond is produced by fusion in the contact region between the two plastics during molding.
  • the support is advantageously fixed by gluing to the flat face of the label.
  • the support is bonded by means of a relatively weak adhesive to a temporary non-stick support, for example in strip which can group together several labels, each label comprising a substrate on which there is an integrated circuit and an antenna. printed.
  • a temporary non-stick support for example in strip which can group together several labels, each label comprising a substrate on which there is an integrated circuit and an antenna. printed.
  • the invention naturally relates to the molded plastic object itself, comprising an electronic label which has been included in a wall of the object by the process according to the invention.
  • FIG. 1 is a schematic top view of a label presented on a temporary support
  • FIG. 2 is a section II-II of the Figure 1
  • Figure 3 is a sectional view of the label in place in the mold.
  • the thin label 1 shown in FIGS. 1 to 3 is in the form of a substrate or thin film, for example made of 0.13 mm thick epoxy, of generally square shape (for example 28 mm ⁇ 28 mm ), on which are on the one hand the integrated circuit (chip), protected by a resin bead 3 (thickness at the right of the chip 0.70 mm), and on the other hand a screen-printed antenna 4 (thickness at the right 0.18 mm), arranged in a square so as to have a large interception surface.
  • a substrate or thin film for example made of 0.13 mm thick epoxy, of generally square shape (for example 28 mm ⁇ 28 mm ), on which are on the one hand the integrated circuit (chip), protected by a resin bead 3 (thickness at the right of the chip 0.70 mm), and on the other hand a screen-printed antenna 4 (thickness at the right 0.18 mm), arranged in a square so as to have a large interception surface.
  • the label 1 is glued to its support 5 according to the invention by means of a double-sided adhesive 6, 0.127 mm thick and of very high adhesion, for example the adhesive sold by the company 3M. under the reference Y9492 (180 ° peel resistance on steel of 16.3 N / cm after 72 hours).
  • the label 1 and its adhesive 6 are cut internally to release an interior opening 7 (no active element of the label being in the central area of the label 1).
  • the support 5 is for example made of a polyethylene film of relatively high molecular weight, and of thickness between 0.55 mm and 0.65 mm.
  • the support 5 is placed with a double-sided adhesive 11 on a silicone film 12 (temporary support) 0.10 mm thick.
  • a silicone film 12 temporary support
  • Several labels can be placed in succession on a strip of silicone film, possibly wound.
  • the double-sided adhesive is for example that, of thickness 0.062 mm, supplied by the company 3M under the reference 9871.
  • a hole 10 (diameter for example of 12 mm) is provided in the center of the support 5 and of the adhesive 11.
  • the periphery of the adhesive 11 may be very slightly set back relative to the periphery of the support 5, or even of plumb, but preferably not overflowing so as not to create during molding bonds with the molded material which may hinder the subsequent removal of the adhesive 11 after demolding.
  • the label 1 is removed, with its support 5 and the adhesive 11, from the silicone film 12 and, when the mold is opened, is glued by the adhesive 11 at the desired location on the steel wall 13 of the mold 13.14.
  • the plastic molding material 15 can then fill the gap between the two walls 13, 14 and comes into contact with the label 1 and parts of the support 5 not covered by the label 1.
  • the plastic material of the support 5 melts at least superficially in contact with the material molding 15 so that a weld zone is formed between the two materials, shown in thick lines in FIG. 3.
  • the hole 10 allows the molded material to reach the wall of the mold in the central part of the label and therefore facilitates the degassing of polyethylene by the walls.
  • FIG. 1 shows only a few of these channels 17.
  • the relatively weak adhesion of the adhesive 11 to the steel wall 13 does not prevent it from being removed from the mold, and the adhesive 11 can subsequently be removed from the surface of the molded object. The following tests have been successfully completed.

Abstract

The invention concerns a method for including a thin electronic label (1) with a plane surface, at a predetermined depth in a wall of a moulded plastic object (15) under predetermined pressure and temperature. The method is characterised in that: first, the plane surface of the label (1) is glued on a plastic substrate (5) with thickness substantially equal to the depth required for the inclusion; the substrate (5) is glued to the mould wall (13); then the plastic moulding material (15) is placed in the mould (13, 14) under said pressure and temperature, the plastic material for the label substrate (5) being selected according to the moulding plastic material (15) and to said pressure and temperature so as to produce a close bonding by melting in the contact region (8, 9, 10, 16) between the two plastic materials during the moulding operation.

Description

Procédé d'inclusion d'étiquette électronique dans la paroi d'un objet thermotransformé, dispositif préparatoire pour ce procédé, et objet moulé obtenu par ce procédé Method for including an electronic label in the wall of a thermotransformed object, preparatory device for this method, and molded object obtained by this method
La présente invention concerne un procédé permettant d'insérer une étiquette électronique mince à face plane dans la paroi d'un objet réalisé par transformation plastique (moulage par injection ou par compression, rotomoulage ou soufflage) à chaud et sous pression de matières plastiques thermotransformables, notamment ABS (acrylonitrile-butadiène-styrène) , polyuréthannes, polyoléfines telles que le polypropylène ou le polyethylène (et en particulier polyethylène haute densité [PEHD] ) . Dans la suite, on appellera moulage toute thermotransformation réalisée en moule, qu'il s'agisse d'un moulage vrai, ou d'un soufflage. L'étiquette insérée permet l'identification à distance et sans contact de l'objet qui la contient, ce qui est particulièrement intéressant lorsque les objets identifiés doivent être authentifiés ou triés. Elle est introduite sans qu'il soit nécessaire de modifier ni le procédé ni le dispositif d'injection. Les objets visés sont très divers et peuvent notamment être des conteneurs (bacs, poubelles, flacons et bouteilles), des palettes, des parties constitutives de véhicules (bouclier, tableau de bord) , des oeuvres d'art.The present invention relates to a method for inserting a thin electronic label with a flat face into the wall of an object produced by plastic transformation (injection or compression molding, rotational molding or blowing) with heat and pressure of thermotransformable plastics, in particular ABS (acrylonitrile-butadiene-styrene), polyurethanes, polyolefins such as polypropylene or polyethylene (and in particular high density polyethylene [HDPE]). In the following, molding will be called any thermotransformation performed in a mold, whether it is a true molding, or a blowing. The inserted label allows the remote and contactless identification of the object that contains it, which is particularly advantageous when the identified objects must be authenticated or sorted. It is introduced without the need to modify either the process or the injection device. The objects targeted are very diverse and can in particular be containers (bins, trash cans, flasks and bottles), pallets, component parts of vehicles (shield, dashboard), works of art.
Il est connu, par exemple par les documents WO 93 24381 A, NL 9 400 402 A ou FR 2 697 801 A, d'identifier un objet par une étiquette électronique disposée sur l'objet ou incorporée dans l'objet. Les deux premiers documents enseignent d'incorporer le transpondeur ou l'étiquette électronique dans une paroi relativement épaisse de l'objet lors du moulage. Plus précisément, selon le document WO 93 24381 A, l'étiquette est préalablement enfermée dans un boîtier de protection destiné à la protéger des températures et des pressions de moulage. Ce boîtier est disposé directement sur une paroi du moule par l'intermédiaire d'un passage d'introduction prévu dans le moule, ou est maintenu entre deux parois du moule par des broches permanentes ou provisoires.It is known, for example from documents WO 93 24381 A, NL 9 400 402 A or FR 2 697 801 A, to identify an object by an electronic label placed on the object or incorporated into the object. The first two documents teach to incorporate the transponder or the electronic label in a relatively thick wall of the object during molding. More precisely, according to document WO 93 24381 A, the label is previously enclosed in a protective casing intended to protect it from molding temperatures and pressures. This housing is disposed directly on a wall of the mold via an introduction passage provided in the mold, or is held between two walls of the mold by permanent or temporary pins.
Le but de l'invention est d'améliorer le procédé d'inclusion d'étiquette électronique lors du moulage, et notamment de permettre un placement simple, pratiquement à volonté et réalisable même dans des parois moulées de faible épaisseur.The object of the invention is to improve the method of including an electronic label during molding, and in particular to allow simple placement, practically at will and achievable even in thin walls.
Selon l'invention, la face plane de l'étiquette est d'abord fixée sur un support de matière plastique d'épaisseur sensiblement égale à la profondeur d'inclusion recherchée, le support est fixé à la paroi du moule, la matière plastique de moulage est amenée dans le moule sous pression et sous température prédéterminées, la matière plastique du support d'étiquette étant choisie en fonction de la matière plastique de moulage et desdites pression et température pour que se réalise entre les deux matières plastiques lors du moulage une liaison intime dans la région de contact. Cette liaison est de type soudure autogène, obtenue par fusion et interpénétration des deux matières plastiques dans la région de contact. Le support pendant le moulage sert de matelas amortisseur des pressions transitoires dues à l'injection. Au cours du moulage, il fond, au moins sur sa surface en contact avec la matière de moulage et même plus profondément en fonction de la nature de la matière plastique choisie et notamment de son point de fusion ; en fin de moulage, il fait partie intégrante de la paroi moulée de l'objet. De préférence, le point de fusion de la matière plastique du support est inférieur (et de préférence suffisamment inférieur) à celui de la matière plastique de moulage, de façon à bien assurer sa fusion par le contact avec la matière de moulage.According to the invention, the flat face of the label is first fixed on a plastic support of thickness substantially equal to the desired depth of inclusion, the support is fixed to the wall of the mold, the plastic molding is brought into the mold under predetermined pressure and temperature, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that a connection is made between the two plastics intimate in the contact region. This bond is of the autogenous weld type, obtained by fusion and interpenetration of the two plastics in the contact region. The support during molding serves as a cushion for transient pressures due to injection. During molding, it melts, at least on its surface in contact with the molding material and even more deeply depending on the nature of the plastic material chosen and in particular its melting point; at the end of molding, it forms an integral part of the molded wall of the object. Preferably, the melting point of the plastic material of the support is lower (and preferably sufficiently lower) than that of the plastic molding material, so as to ensure its melting well by contact with the molding material.
La matière plastique de moulage et celle du support sont avantageusement choisies parmi les polyéthylènes haute densité, celle du support ayant une densité plus faible que celle de moulage pour établir la différence entre les points de fusion mentionnée ci- dessus. Par exemple, les températures de fusion des premier et second PEHD peuvent être dans les plages de 150°C-200°C et 200°C-250°C respectivement. Mais, comme mentionné plus haut, conviennent également notamment l'ABS ou les polyuréthannes.The plastic molding material and that of the support are advantageously chosen from high density polyethylenes, that of the support having a lower density than that of molding to establish the difference between the melting points mentioned above. For example, the melting temperatures of the first and second HDPE can be in the ranges of 150 ° C-200 ° C and 200 ° C-250 ° C respectively. However, as mentioned above, ABS or polyurethanes are also particularly suitable.
Il peut être avantageux de choisir pour le support et le moulage des matières de couleurs différentes (par exemple respectivement translucide et rouge) de façon à repérer visuellement immédiatement sur la paroi moulée la localisation de l'étiquette, en vue de son utilisation (placement correct du lecteur d'identification). Ceci présente l'avantage de permettre aussi le tri sélectif en cas de destruction de l'objet moulé, avec traitement et/ou recyclage séparé de la partie constitutive en plastique et de la partie contenant l'étiquette.It may be advantageous to choose for the support and the molding of materials of different colors (for example translucent and red respectively) so as to identify visually immediately on the molded wall the location of the label, with a view to its use (correct placement of the identification reader). This has the advantage of also allowing selective sorting in the event of destruction of the molded object, with separate treatment and / or recycling of the constituent plastic part and of the part containing the label.
L'étiquette peut être placée à n'importe quel endroit du moule, mais on choisit de préférence une zone proche de renforts et donc peu susceptible de provoquer des flexions indues dans l'étiquette elle- même .The label can be placed anywhere in the mold, but preferably an area close to reinforcements and therefore unlikely to cause undue bending in the label itself.
L'étiquette électronique plane mince utilisée dans l'invention est de type connu en elle-même, encore qu'il revienne à l'invention d'avoir établi que des étiquettes minces pouvaient être incorporées lors du moulage sans protection par boîtier, au contraire de ce qu'enseigne par exemple le document WO 93 24381 A précité. L'étiquette est une étiquette inductive, sans énergie, constituée par un circuit électrique formant antenne, imprimé sur un substrat isolant de qualité convenable, relié à un circuit intégré comprenant une mémoire et les dispositifs de communication avec cette mémoire de l'extérieur et sans contact. Par substrat de qualité convenable, on entend notamment qu'il soit résistant aux températures d'environ 200°C rencontrées lors du moulage, et qu'il présente une certaine rigidité, tout en étant flexible, cette rigidité contribuant à son maintien correct et sans plissement lors du moulage. Les substrats couramment utilisés en époxy d'épaisseur faible, par exemple de un à quelques dixièmes de mm, présentent cette qualité. D'autres matériaux tels que le kapton ou le PET conviennent également. Le contenu de la mémoire peut être lu, voire modifié, sans contact par le passage d'ondes électromagnétiques au travers d'une certaine épaisseur de la matière plastique du substrat et de la paroi de l'objet dans laquelle elle est moulée. Quoique les ondes électromagnétiques d'identification puissent être théoriquement des ondes BF, HF ou UHF, l'invention s'intéresse d'abord aux étiquettes utilisant des fréquences plutôt élevées (environ 10MHz, et notamment la fréquence homologuée 13,56 MHz), avec lesquelles il est possible d'utiliser une antenne de petites dimensions, imprimée sur le substrat (par opposition notamment à certains transpondeurs de 1 ' art antérieur utilisant des antennes à bobinages multiples qui risquent d'être endommagés lors du moulage) . Le procédé est cependant applicable à des fréquences plus basses, et notamment inférieures à 150 kHz, munies d'une antenne imprimée. L'impression d'une antenne, notamment par encre conductrice sérigraphiée, est bien connue de l'homme du métier (cf. par exemple le document FR 2 753 305 A) .The thin planar electronic label used in the invention is of a type known in itself, although it is the invention to have established that thin labels could be incorporated during the molding without protection by housing, contrary to what teaches for example the document WO 93 24381 A cited above. The label is an inductive label, without energy, constituted by an electrical circuit forming an antenna, printed on an insulating substrate of suitable quality, connected to an integrated circuit comprising a memory and the devices for communication with this memory from the outside and without contact. The term “substrate of suitable quality” is understood to mean in particular that it is resistant to the temperatures of around 200 ° C. encountered during molding, and that it has a certain rigidity, while being flexible, this rigidity contributing to its correct maintenance without wrinkling during molding. The substrates commonly used in thin epoxy, for example from one to a few tenths of a mm, have this quality. Other materials such as kapton or PET are also suitable. The contents of the memory can be read, even modified, without contact by the passage of electromagnetic waves through a certain thickness of the plastic material of the substrate and the wall of the object in which it is molded. Although the identification electromagnetic waves can theoretically be BF, HF or UHF waves, the invention first of all focuses on labels using rather high frequencies (around 10 MHz, and in particular the approved frequency 13.56 MHz), with which it is possible to use an antenna of small dimensions, printed on the substrate (as opposed in particular to certain transponders of one prior art using antennas with multiple coils which risk being damaged during molding). The method is however applicable to lower frequencies, and in particular below 150 kHz, provided with a printed antenna. The printing of an antenna, in particular by screen-printed conductive ink, is well known to those skilled in the art (cf. for example the document FR 2 753 305 A).
L'étiquette comporte au moins une face sensiblement plane, généralement celle opposée au circuit intégré, l'autre face comportant souvent une perle de résine de protection de la puce du circuit intégré. L'épaisseur totale de l'étiquette mince est de l'ordre de 0,6 mm à 1 mm au droit de la puce. Par "plane", on entend principalement une surface sensiblement plane géométrique, mais aussi plus généralement une surface développable (par exemple cylindrique), permettant d'y coller une feuille de support, une telle surface pouvant mieux épouser la forme de certains objets moulés.The label comprises at least one substantially flat face, generally that opposite to the integrated circuit, the other face often comprising a bead of resin protecting the chip of the integrated circuit. The total thickness of the thin label is of the order of 0.6 mm to 1 mm in line with the chip. By "flat" is mainly meant a substantially planar geometric surface, but also more generally a developable surface (for example cylindrical), making it possible to stick a support sheet thereon, such a surface being able to better match the shape of certain molded objects.
Le support est avantageusement fixé par collage d'une part à la face plane de l'étiquette et/ou d'autre part à la paroi du moule, collage notamment réalisé à l'aide d'un ruban adhésif double-face. Cependant il est possible de maintenir le support dans le moule avant et pendant le moulage par d'autres moyens, par exemple par aspiration au travers d'orifices de succion prévus dans la paroi du moule quoique cette solution soit plus onéreuse et limite la liberté de placement de l'étiquette dans le moule.The support is advantageously fixed by gluing on the one hand to the flat face of the label and / or on the other hand to the wall of the mold, gluing in particular produced using a double-sided adhesive tape. However, it is possible to maintain the support in the mold before and during molding by other means, for example by suction through suction holes provided in the wall of the mold, although this solution is more expensive and limits the freedom of placement of the label in the mold.
L'adhésif utilisé pour coller l'étiquette au support est un adhésif double- face présentant de part et d'autre de fortes qualités d'adhésion (car il doit coller des matériaux à faible pouvoir d'adhésion, tels que le polyethylène) , et résistant aux températures de moulage .The adhesive used to stick the label to the support is a double-sided adhesive having strong adhesion qualities on both sides (because it must stick materials with low adhesion power, such as polyethylene), and resistant to molding temperatures.
L'adhésif utilisé pour coller le support au moule est fortement adhérent sur sa face destinée à recevoir le support, mais seulement faiblement adhérent sur l'autre face destinée à coller sur l'acier du moule. Une adhérence de type adhésif repositionnable suffit car l'acier permet un bon collage naturel. Du reste, il est avantageux de présenter les étiquettes munies de leur support et des deux adhésifs sur un support provisoire anti-adhérent , tel qu'un film siliconé, d'où on les détache pour les coller sur le moule. L'adhésif double-face, qui est lors du moulage en contact avec le moule et n'est pas directement exposé à la matière de moulage, doit résister à une température généralement inférieure à 100°C (compte-tenu du refroidissement des moules généralement fort) . Son épaisseur est aussi faible que possible, pour ne pas créer sur l'objet moulé, une fois retiré, un évidement trop important.The adhesive used to stick the support to the mold is strongly adherent on its face intended to receive the support, but only weakly adhered on the other face intended to stick on the steel of the mold. Repositionable adhesive type adhesion is sufficient because steel allows good natural bonding. Moreover, it is advantageous to present the labels provided with their support and the two adhesives on a temporary non-stick support, such as a silicone film, from which they are detached to stick them on the mold. The double-sided adhesive, which is during molding in contact with the mold and is not directly exposed to the molding material, must withstand a temperature generally less than 100 ° C. (taking into account the cooling of the molds generally strong). Its thickness is as small as possible, so as not to create on the molded object, once removed, too large a recess.
Avantageusement, le support de l'étiquette est découpé dans une feuille mince de matière plastique, de nature chimique et de caractéristiques physiques choisies pour obtenir la soudure par fusion mentionnée plus haut . Son épaisseur est de préférence inférieure à 1 mm, et avantageusement de l'ordre de 500μm : une épaisseur trop importante oppose plus d'inertie thermique au réchauffement et à la fusion localisée du support au contact de la matière de moulage ; d'autre part, trop d'épaisseur peut conduire à des phénomènes de reflux et d'irrégularités de moulage, lors du passage de la matière de moulage fondue au-dessus de l'étiquette collée au moule.Advantageously, the label support is cut from a thin sheet of plastic material, of a chemical nature and of physical characteristics chosen to obtain the fusion welding mentioned above. Its thickness is preferably less than 1 mm, and advantageously of the order of 500 μm: an excessively large thickness opposes more thermal inertia to the localized heating and melting of the support in contact with the molding material; on the other hand, too much thickness can lead to phenomena of reflux and irregularities in molding, when the molten molding material passes over the label glued to the mold.
Selon une variante avantageuse, le support est préparé dans une feuille directement revêtue sur chacune de ses deux faces de la colle nécessaire pour coller d'une part l'étiquette et d'autre part le moule (ou le support provisoire), rendant inutile l'emploi des adhésifs double-face mentionnés ci-dessus.According to an advantageous variant, the support is prepared in a sheet directly coated on each of its two faces with the adhesive necessary to stick on the one hand the label and on the other hand the mold (or the provisional support), making unnecessary use of the double-sided adhesives mentioned above.
De préférence, le support dépasse de l'étiquette de manière à créer une surface de contact suffisamment grande entre lui et la matière de moulage pour réaliser une intégration solide de l'étiquette de l'objet moulé. Cette surface de contact est prévue à 1 ' extérieur de l'étiquette, et/ou, par découpage d'une partie centrale de l'étiquette non occupée par le circuit imprimé, à l'intérieur même de l'étiquette.Preferably, the support protrudes from the label so as to create a sufficiently large contact surface between it and the molding material to produce solid integration of the molded object label. This contact surface is provided outside the label, and / or, by cutting a central part of the label not occupied by the printed circuit, inside the label itself.
Avantageusement, quand les dimensions de l'étiquette rendent opportun de réaliser une découpe centrale, le support comporte aussi un trou central, de manière que la matière de moulage puisse s'écouler jusqu'à la paroi du moule, au centre de l'étiquette et du support, et faciliter le dégazage de la matière plastique .Advantageously, when the dimensions of the label make it advisable to make a central cut, the support also has a central hole, so that the molding material can flow to the wall of the mold, in the center of the label. and support, and facilitate the degassing of the plastic.
La partie de surface du support qui dépasse de l'étiquette, extérieurement et/ou intérieurement, peut être munie de canaux facilitant l'évacuation des gaz et contribuant à l'absence de bulles.The surface part of the support which protrudes from the label, externally and / or internally, can be provided with channels facilitating the evacuation of gases and contributing to the absence of bubbles.
Bien que ce ne soit pas nécessaire selon l'invention, l'étiquette peut recevoir sur sa face autre que la face plane d'autres éléments de couverture tels qu'une feuille de matière plastique ; elle peut aussi être préalablement noyée dans un bloc de matière plastique avant d'être placée sur le support, ou bien ledit bloc peut directement constituer, du côté de la face plane de l'étiquette, ledit support si la matière constituant le bloc est choisie convenablement.Although it is not necessary according to the invention, the label can receive on its face other than the flat face other covering elements such as a sheet of plastic material; it can also be previously embedded in a block of plastic before being placed on the support, or else said block can directly constitute, on the side of the flat face of the label, said support if the material constituting the block is chosen properly.
De plus, l'invention concerne aussi, en tant que moyen intermédiaire destiné au procédé ci-dessus, un dispositif préparatoire pour l'inclusion d'une étiquette électronique mince à face plane, à une profondeur prédéterminée dans une paroi d'un objet moulé en matière plastique sous une pression et une température prédéterminées, caractérisé en ce qu'il comprend d'une part ladite étiquette et d'autre part un support de matière plastique d'épaisseur sensiblement égale à la profondeur d'inclusion recherchée, support sur lequel est fixée ladite face plane de l'étiquette, la matière plastique du support d'étiquette étant choisie en fonction de la matière plastique de moulage et desdites pression et température pour qu'une liaison intime se réalise par fusion dans la région de contact entre les deux matières plastiques lors du moulage. Le support est avantageusement fixé par collage à la face plane de l'étiquette. De préférence, le support est collé par l'intermédiaire d'un adhésif relativement faible à un support provisoire anti -adhérent, par exemple en bande qui peut regrouper plusieurs étiquettes, chaque étiquette comprenant un substrat sur lequel se trouvent un circuit intégré et une antenne imprimée . Enfin l'invention concerne naturellement l'objet moulé en matière plastique lui-même, comportant une étiquette électronique qui a été incluse dans une paroi de l'objet par le procédé conforme à l'invention.In addition, the invention also relates, as an intermediate means for the above method, to a preparatory device for the inclusion of a thin electronic label with a flat face, at a predetermined depth in a wall of a molded object. made of plastic under a predetermined pressure and temperature, characterized in that it comprises on the one hand said label and on the other hand a plastic support of thickness substantially equal to the desired depth of inclusion, support on which said flat face of the label is fixed, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that an intimate bond is produced by fusion in the contact region between the two plastics during molding. The support is advantageously fixed by gluing to the flat face of the label. Preferably, the support is bonded by means of a relatively weak adhesive to a temporary non-stick support, for example in strip which can group together several labels, each label comprising a substrate on which there is an integrated circuit and an antenna. printed. Finally, the invention naturally relates to the molded plastic object itself, comprising an electronic label which has been included in a wall of the object by the process according to the invention.
L'invention sera mieux comprise grâce à la description suivante, se référant aux dessins annexés sur lesquels : la figure 1 est une vue schématique de dessus d'une étiquette présentée sur support provisoire, - la figure 2 est une section II-II de la figure 1, la figure 3 est une vue en coupe de l'étiquette en place dans le moule.The invention will be better understood from the following description, referring to the accompanying drawings in which: FIG. 1 is a schematic top view of a label presented on a temporary support, - FIG. 2 is a section II-II of the Figure 1, Figure 3 is a sectional view of the label in place in the mold.
Les figures sont destinées à comprendre l'agencement des différents éléments de l'invention entre eux, mais l'échelle relative de ces éléments n'a pas été respectée, pour permettre une meilleure lisibilité et comme le montreront à l'évidence les exemples de dimensions donnés dans la description suivante . L'étiquette mince 1 représentée sur les figures 1 à 3 se présente sous la forme d'un substrat ou film mince, par exemple en époxy d'épaisseur 0,13 mm, de forme générale carrée (par exemple de 28 mm x 28 mm) , sur lequel se trouvent d'une part le circuit intégré (puce) , protégé par une perle de résine 3 (épaisseur au droit de la puce 0,70 mm) , et d'autre part une antenne sérigraphiée 4 (épaisseur au droit de la sérigraphie 0,18 mm), disposée en carré de manière à avoir une large surface d'interception. L'étiquette 1 est collée à son support 5 conforme à l'invention par l'intermédiaire d'un adhésif double-face 6, d'épaisseur 0,127 mm et d'adhésion très élevée, par exemple l'adhésif vendu par la société 3M sous la référence Y9492 (résistance au pelage à 180° sur acier de 16,3 N/cm après 72h) .The figures are intended to understand the arrangement of the various elements of the invention between them, but the relative scale of these elements has not been respected, to allow better readability and as will be evident from the examples of dimensions given in the following description. The thin label 1 shown in FIGS. 1 to 3 is in the form of a substrate or thin film, for example made of 0.13 mm thick epoxy, of generally square shape (for example 28 mm × 28 mm ), on which are on the one hand the integrated circuit (chip), protected by a resin bead 3 (thickness at the right of the chip 0.70 mm), and on the other hand a screen-printed antenna 4 (thickness at the right 0.18 mm), arranged in a square so as to have a large interception surface. The label 1 is glued to its support 5 according to the invention by means of a double-sided adhesive 6, 0.127 mm thick and of very high adhesion, for example the adhesive sold by the company 3M. under the reference Y9492 (180 ° peel resistance on steel of 16.3 N / cm after 72 hours).
L'étiquette 1 et son adhésif 6 sont découpés intérieurement pour dégager une ouverture intérieure 7 (aucun élément actif de l'étiquette ne se trouvant dans la zone centrale de l'étiquette 1) .The label 1 and its adhesive 6 are cut internally to release an interior opening 7 (no active element of the label being in the central area of the label 1).
Le support 5, par exemple de 35 mm x 35 mm, dépasse ainsi de l'ensemble 6,7 aussi bien extérieurement (surface extérieure 8) qu'intérieurementThe support 5, for example 35 mm x 35 mm, thus protrudes from the assembly 6,7 both externally (external surface 8) and internally
(surface intérieure 9) . Le support 5 est par exemple réalisé dans un film de polyethylène de poids moléculaire relativement élevé, et d'épaisseur comprise entre 0,55 mm et 0,65 mm.(interior surface 9). The support 5 is for example made of a polyethylene film of relatively high molecular weight, and of thickness between 0.55 mm and 0.65 mm.
Le support 5 est placé grâce à un adhésif double- face 11 sur un film siliconé 12 (support provisoire) d'épaisseur 0,10 mm. Plusieurs étiquettes peuvent être placées à la suite sur une bande de film siliconé, éventuellement bobinée.The support 5 is placed with a double-sided adhesive 11 on a silicone film 12 (temporary support) 0.10 mm thick. Several labels can be placed in succession on a strip of silicone film, possibly wound.
L'adhésif double-face est par exemple celui, d'épaisseur 0,062 mm, fourni par la société 3M sous la référence 9871. Un trou 10 (diamètre par exemple de 12 mm) est prévu au centre du support 5 et de l'adhésif 11. Comme représenté sur les figures 2 et 3 , la périphérie de l'adhésif 11 peut être très légèrement en retrait par rapport à la périphérie du support 5, voire d'aplomb, mais de préférence pas en débordement afin de ne pas créer lors du moulage des liaisons avec la matière moulée qui risquent de gêner l'enlèvement ultérieur de l'adhésif 11 après le démoulage.The double-sided adhesive is for example that, of thickness 0.062 mm, supplied by the company 3M under the reference 9871. A hole 10 (diameter for example of 12 mm) is provided in the center of the support 5 and of the adhesive 11. As shown in FIGS. 2 and 3, the periphery of the adhesive 11 may be very slightly set back relative to the periphery of the support 5, or even of plumb, but preferably not overflowing so as not to create during molding bonds with the molded material which may hinder the subsequent removal of the adhesive 11 after demolding.
Pour l'opération de moulage, l'étiquette 1 est retirée, avec son support 5 et l'adhésif 11, du film siliconé 12 et, lors de l'ouverture du moule, est collée par l'adhésif 11 à l'emplacement désiré sur la paroi d'acier 13 du moule 13,14. La matière plastique de moulage 15 peut alors remplir l'intervalle entre les deux parois 13, 14 et vient au contact de l'étiquette 1 et des parties du support 5 non recouvertes par l'étiquette 1. Sur ces parties, c'est-à-dire essentiellement les surfaces dégagées 8 et 9 et aussi sur le pourtour intérieur du trou 10, lorsqu'il existe, ou le pourtour extérieur 16 du support 5, la matière plastique du support 5 fond au moins superficiellement au contact de la matière de moulage 15 de sorte qu'il se forme une zone de soudure entre les deux matières, représentée en trait épais sur la figure 3. Le trou 10 permet à la matière moulée d'atteindre la paroi du moule dans la partie centrale de l'étiquette et facilite donc le dégazage du polyethylène par les parois. Pour faciliter le cheminement des gaz, on peut aussi prévoir sur les surfaces 8 et 9 du support 5 des tranchées ou canaux 17 de profondeur inférieure ou égale à l'épaisseur du support 5, tracés en étoile divergente et débouchant soit dans le trou intérieur 10 soit sur le pourtour extérieur 16 du support 5. On a représenté sur la figure 1 seulement quelques uns de ces canaux 17. La relativement faible adhérence de l'adhésif 11 sur la paroi d'acier 13 ne s'oppose pas au démoulage, et l'adhésif 11 peut par la suite être retiré de la surface de l'objet moulé. Les essais suivants ont été réalisés avec succès .For the molding operation, the label 1 is removed, with its support 5 and the adhesive 11, from the silicone film 12 and, when the mold is opened, is glued by the adhesive 11 at the desired location on the steel wall 13 of the mold 13.14. The plastic molding material 15 can then fill the gap between the two walls 13, 14 and comes into contact with the label 1 and parts of the support 5 not covered by the label 1. On these parts, that is to say essentially the cleared surfaces 8 and 9 and also on the inner periphery of the hole 10, when it exists, or the outer periphery 16 of the support 5, the plastic material of the support 5 melts at least superficially in contact with the material molding 15 so that a weld zone is formed between the two materials, shown in thick lines in FIG. 3. The hole 10 allows the molded material to reach the wall of the mold in the central part of the label and therefore facilitates the degassing of polyethylene by the walls. To facilitate the flow of gases, it is also possible to provide on the surfaces 8 and 9 of the support 5 trenches or channels 17 of depth less than or equal to the thickness of the support 5, traced in a diverging star and opening either in the internal hole 10 or on the outer periphery 16 of the support 5. FIG. 1 shows only a few of these channels 17. The relatively weak adhesion of the adhesive 11 to the steel wall 13 does not prevent it from being removed from the mold, and the adhesive 11 can subsequently be removed from the surface of the molded object. The following tests have been successfully completed.
Des étiquettes électroniques fabriquées par GEMPLUS sous la référence SMA210 et LMA210 ont été collées sur un support en polyethylène translucide de la manière décrite ci-dessus, et le support de l'étiquette, portant l'étiquette, a été fixé sur la paroi du moule à l'endroit choisi et a été maintenu dans cette position pendant l'injection malgré les efforts exercés par le polyethylène haute densité injecté (température de la matière injectée au moment où elle pénètre dans le moule : environ 270°C ; pression d'injection comprise entre 1000 et 1500 bars). Toutes ces étiquettes mises ainsi en place ont fonctionné ensuite normalement. Electronic labels manufactured by GEMPLUS under the reference SMA210 and LMA210 were stuck on a translucent polyethylene support in the manner described above, and the support of the label, carrying the label, was fixed on the mold wall at the chosen location and was kept in this position during the injection despite the efforts exerted by the injected high density polyethylene (temperature of the injected material when it enters the mold: approximately 270 ° C; injection pressure between 1000 and 1500 bars). All these labels thus put in place then functioned normally.

Claims

REVENDICATIONS
1. Procédé d'inclusion d'une étiquette électronique mince (1) à face plane, à une profondeur prédéterminée dans une paroi d'un objet moulé en matière plastique (15) sous une pression et une température prédéterminées, caractérisé en ce que ladite face plane de l'étiquette (1) est d'abord fixée sur un support (5) de matière plastique d'épaisseur sensiblement égale à la profondeur d'inclusion recherchée, le support (5) est fixé à la paroi (13) du moule, puis la matière plastique de moulage (15) est amenée dans le moule (13, 14) sous lesdites pression et température, la matière plastique du support (5) d'étiquette étant choisie en fonction de la matière plastique de moulage (15) et desdites pression et température pour qu'une liaison intime se réalise par fusion dans la région de contact (8, 9, 10, 16) entre les deux matières plastiques lors du moulage.1. Method for including a thin electronic label (1) with a flat face, at a predetermined depth in a wall of a molded plastic object (15) under a predetermined pressure and temperature, characterized in that said flat face of the label (1) is first fixed on a support (5) of plastic material of thickness substantially equal to the desired depth of inclusion, the support (5) is fixed to the wall (13) of the mold, then the plastic molding material (15) is brought into the mold (13, 14) under said pressure and temperature, the plastic material of the label support (5) being chosen as a function of the plastic molding material (15 ) and said pressure and temperature so that an intimate bond is produced by fusion in the contact region (8, 9, 10, 16) between the two plastics during molding.
2. Procédé selon la revendication 1, caractérisé en ce que le support (5) est fixé par collage à la face plane de l'étiquette (1) et/ou à la paroi (13) du moule .2. Method according to claim 1, characterized in that the support (5) is fixed by gluing to the flat face of the label (1) and / or to the wall (13) of the mold.
3. Procédé selon la revendication 2, caractérisé en ce que ledit collage est réalisé à l'aide d'un adhésif double-face (6, 11).3. Method according to claim 2, characterized in that said bonding is carried out using a double-sided adhesive (6, 11).
4. Procédé selon la revendication 3, caractérisé en ce que préalablement au moulage, on a préparé et disposé une étiquette (1) munie de son support (5) et de ses adhésifs double-face (6, 11) sur un support provisoire anti-adhérent (12) . 4. Method according to claim 3, characterized in that prior to molding, a label (1) has been prepared and arranged provided with its support (5) and its double-sided adhesives (6, 11) on a temporary anti-support - member (12).
5. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que le point de fusion de la matière plastique du support (5) est inférieur à celui de la matière plastique de moulage (15) .5. Method according to any one of the preceding claims, characterized in that the melting point of the plastic material of the support (5) is lower than that of the plastic molding material (15).
6. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que la matière plastique de moulage (15) et celle du support (5) sont choisies parmi les polyethylène haute densité.6. Method according to any one of the preceding claims, characterized in that the plastic molding material (15) and that of the support (5) are chosen from high density polyethylene.
7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que le support (5) de l'étiquette est découpé dans une feuille mince de matière plastique.7. Method according to any one of the preceding claims, characterized in that the support (5) of the label is cut from a thin sheet of plastic.
8. Procédé selon la revendication 7, caractérisé en ce que le support (5) est préparé dans une feuille directement revêtue sur chacune de ses deux faces de la colle nécessaire pour adhérer d'une part à l'étiquette et d'autre part à la paroi du moule.8. Method according to claim 7, characterized in that the support (5) is prepared in a sheet directly coated on each of its two faces with the adhesive necessary to adhere on the one hand to the label and on the other hand to the mold wall.
9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'une partie de la surface du support (5), non recouverte par l'étiquette (1) , en dépasse extérieurement (8) et/ou intérieurement (9) .9. Method according to any one of the preceding claims, characterized in that a part of the surface of the support (5), not covered by the label (1), protrudes externally (8) and / or internally (9 ).
10. Procédé selon la revendication 9, caractérisé en ce que ladite partie (8, 9) de surface du support est munie de canaux (17) .10. Method according to claim 9, characterized in that said part (8, 9) of the support surface is provided with channels (17).
11. Dispositif préparatoire pour l'inclusion d'une étiquette électronique mince (1) à face plane, à une profondeur prédéterminée dans une paroi d'un objet moulé en matière plastique (15) sous une pression et une température prédéterminées, caractérisé en ce qu'il comprend d'une part ladite étiquette et d'autre part un support (5) de matière plastique d'épaisseur sensiblement égale à la profondeur d'inclusion recherchée, support sur lequel est fixée ladite face plane de l'étiquette (1), la matière plastique du support (5) d'étiquette étant choisie en fonction de la matière plastique de moulage (15) et desdites pression et température pour qu'une liaison intime se réalise par fusion dans la région de contact (8, 9, 10, 16) entre les deux matières plastiques lors du moulage.11. Preparatory device for the inclusion of a thin electronic label (1) with a flat face, at a predetermined depth in a wall of a molded plastic object (15) under pressure and a predetermined temperature, characterized in that it comprises on the one hand said label and on the other hand a support (5) of plastic material of thickness substantially equal to the desired depth of inclusion, support on which said face is fixed plane of the label (1), the plastic material of the label support (5) being chosen as a function of the plastic molding material (15) and of said pressure and temperature so that an intimate bond is produced by fusion in the contact region (8, 9, 10, 16) between the two plastics during molding.
12. Dispositif selon la revendication 11, caractérisé en ce que le support (5) est fixé par collage à la face plane de l'étiquette (1).12. Device according to claim 11, characterized in that the support (5) is fixed by gluing to the flat face of the label (1).
13. Dispositif selon l'une quelconque des revendications 11 ou 12, caractérisé en ce que le support (5) est collé par l'intermédiaire d'un adhésif relativement faible à un support provisoire antiadhérent (12) .13. Device according to any one of claims 11 or 12, characterized in that the support (5) is bonded by means of a relatively weak adhesive to a temporary non-stick support (12).
14. Dispositif selon l'une quelconque des revendications 11 à 13, caractérisé en ce qu'une partie de la surface du support (5) , non recouverte par l'étiquette (1), en dépasse extérieurement (8) et/ou intérieurement (9) .14. Device according to any one of claims 11 to 13, characterized in that a part of the surface of the support (5), not covered by the label (1), protrudes externally (8) and / or internally (9).
15. Dispositif selon l'une quelconque des revendications 11 à 14, caractérisé en ce que l'étiquette (1) comprend un substrat sur lequel se trouvent un circuit intégré et une antenne imprimée.15. Device according to any one of claims 11 to 14, characterized in that the label (1) comprises a substrate on which there is an integrated circuit and a printed antenna.
16. Objet moulé en matière plastique, caractérisé en ce qu'il comporte une étiquette électronique qui a été incluse dans une paroi de l'objet par le procédé selon l'une quelconque des revendications 1 à 10. 16. Molded plastic object, characterized in that it comprises an electronic label which has been included in a wall of the object by the method according to any one of claims 1 to 10.
PCT/FR1998/000560 1997-03-21 1998-03-20 Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method WO1998042488A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU70494/98A AU7049498A (en) 1997-03-21 1998-03-20 Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method
DE69806912T DE69806912T2 (en) 1997-03-21 1998-03-20 METHOD FOR ENCLOSING AN ELECTRONIC LABEL IN THE WALL OF A THERMOFORMED OBJECT, AND PREPARATION DEVICE FOR THIS METHOD
EP98917190A EP0968078B1 (en) 1997-03-21 1998-03-20 Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method
US09/381,416 US6482287B1 (en) 1997-03-21 1998-03-20 Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method
AT98917190T ATE221443T1 (en) 1997-03-21 1998-03-20 METHOD FOR INCLUSION OF AN ELECTRONIC LABEL INTO THE WALL OF A HEAT-FORMED ARTICLE AND PREPARATION APPARATUS FOR SUCH METHOD
JP54324998A JP2001517167A (en) 1997-03-21 1998-03-20 Method for enclosing an electronic label in a wall surface of a thermally processed product, manufacturing apparatus for this method, and mold body obtained by this method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR97/03456 1997-03-21
FR9703456A FR2760998B1 (en) 1997-03-21 1997-03-21 METHOD OF INCLUDING AN ELECTRONIC LABEL IN AN OBJECT MADE OF PLASTIC, AT THE TIME OF THE MANUFACTURE OF THE OBJECT

Publications (1)

Publication Number Publication Date
WO1998042488A1 true WO1998042488A1 (en) 1998-10-01

Family

ID=9505041

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR1998/000560 WO1998042488A1 (en) 1997-03-21 1998-03-20 Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method

Country Status (10)

Country Link
US (1) US6482287B1 (en)
EP (1) EP0968078B1 (en)
JP (1) JP2001517167A (en)
AT (1) ATE221443T1 (en)
AU (1) AU7049498A (en)
DE (1) DE69806912T2 (en)
ES (1) ES2181201T3 (en)
FR (1) FR2760998B1 (en)
PT (1) PT968078E (en)
WO (1) WO1998042488A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791034A1 (en) 1999-03-19 2000-09-22 Allibert Equipement Electronic labeling of molding, commences by inserting labeling chip on substrate into sleeve and sealing hermetically whilst excluding air, followed by in-mold bonding with introduced plastic
FR2791035A1 (en) 1999-03-19 2000-09-22 Allibert Equipement Protective envelopment of electronic chip label, is carried out by e.g. pressure-bonding of extruded plastic sheets above fusion point around label, before in-mold incorporation into surface of object
EP1315116A1 (en) * 2001-11-09 2003-05-28 Allibert Equipement Device which is traceable by an electronic identifier
FR2840253A1 (en) * 2002-05-31 2003-12-05 Knauf Snc Decoration of polycarbonate substrate during e.g. injection or blow-molding, prepares printed polycarbonate label and locates it on mold internal wall
EP1401645A1 (en) * 2001-05-22 2004-03-31 Michael J. Stevenson Graphics transfers for use in rotational molding
EP1419977A3 (en) * 2002-11-15 2005-08-31 Linpac Plastics GmbH Food package, in particular a tray, with electronic tag

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2770172B1 (en) * 1997-10-24 1999-12-10 Allibert Equipement MOLDING PROCESS FOR PRODUCING A PART MADE OF PLASTIC MATERIAL PROVIDED ON A SURFACE OF AN ADDED ELEMENT OF LOW THICKNESS, AND PART THUS PRODUCED
FR2796880B1 (en) * 1999-07-26 2002-06-14 Europlastiques Sa PRODUCT MADE BY INJECTING PLASTIC MATERIAL INTO A MOLD AND INCORPORATING AN ELECTRONIC LABEL
FR2798362B1 (en) * 1999-09-09 2001-11-16 Knauf Snc PACKAGING CONTAINER, ESPECIALLY FOR FOOD PRODUCTS, AND METHOD FOR MANUFACTURING SUCH A CONTAINER
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
EP1221738A3 (en) * 2000-12-27 2002-10-23 The Furukawa Electric Co., Ltd. Small antenna and manufacturing method thereof
US6773653B2 (en) * 2001-10-05 2004-08-10 Avery Dennison Corporation In-mold labeling method
US7037455B2 (en) * 2001-12-21 2006-05-02 Mattel, Inc. Insert molding method
DE112004000012B4 (en) * 2003-01-21 2012-06-14 Polyic Gmbh & Co. Kg Plastic product with integrated organic electronic component, method of manufacturing
DE10310238A1 (en) * 2003-03-08 2004-09-23 Bekuplast Kunststoffverarbeitungs-Gmbh Plastic container with integrated transponder
FR2854098B1 (en) * 2003-04-23 2007-04-06 Daniel Andre Gastel LAMINATED PRODUCT WITH ELECTRONIC IDENTIFICATION MEMBER AND DEVICE FOR IDENTIFYING AND MONITORING SUCH PRODUCTS
FR2862947B1 (en) * 2003-11-28 2010-01-01 Cebal Sas FLEXIBLE TUBE WITH ELECTRONIC COMPONENT
GB2413108A (en) * 2004-03-08 2005-10-19 Mtr Corp Ltd Detachable label and in-mould labelling
DE502004008276D1 (en) * 2004-08-23 2008-11-27 Schreiner Group Gmbh & Co Kg Label for covering gas exchange openings
DE102004045459A1 (en) * 2004-09-20 2006-03-30 Hekuma Gmbh Method of applying electronic product labels to thermoformed articles
DE102004061633A1 (en) * 2004-12-17 2006-06-29 Lossau, Harald, Dr. Container with transponder
US7256742B2 (en) * 2005-08-09 2007-08-14 Inpaq Technology Co., Ltd. Flexible antenna apparatus and a manufacturing method thereof
US7736568B2 (en) * 2006-09-19 2010-06-15 Mattel, Inc. Systems and methods of incorporating preformed items into a molded article
WO2008143868A1 (en) * 2007-05-15 2008-11-27 Mks Instruments, Corporated Electrostatically applying a label to a mold cavity
FR2955287B1 (en) * 2010-01-20 2012-08-24 Faurecia Interieur Ind METHOD OF FIXING A COMPONENT OF AN INTERIOR TRIM ASSEMBLY ON AN ORGAN OF A FORMING TOOL
CN102004937B (en) * 2010-11-29 2013-05-22 四川新源现代智能科技有限公司 Small-size remote passive electronic tag capable of being adhered to surface of metal
JP6249329B2 (en) * 2013-09-13 2017-12-20 パナソニックＩｐマネジメント株式会社 Manufacturing method of insert molded products
WO2018087894A1 (en) * 2016-11-11 2018-05-17 信越エンジニアリング株式会社 Resin-sealing device and resin-sealing method
GB2546637B (en) * 2017-02-10 2018-04-11 Postsaver Europe Ltd An identifiable protective sheet
CN110847306B (en) 2018-08-21 2022-09-27 科勒公司 Front apron board water tank with interchangeable surface
US11324318B2 (en) 2018-10-04 2022-05-10 Kohler Co. Apron front sink panel assembly
DE102019130175A1 (en) * 2019-11-08 2021-05-12 Hellermanntyton Gmbh Injection molding of a component, such as a cable holder, with an integrated wireless identification film
US20210230852A1 (en) * 2020-01-24 2021-07-29 Kohler Co. Sink systems
US11781302B2 (en) 2020-01-24 2023-10-10 Kohler Co. Sink having removable apron and accessory systems
USD952808S1 (en) 2020-01-24 2022-05-24 Kohler Co. Sink

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166516A (en) * 1984-02-08 1985-08-29 Kinugawa Rubber Ind Co Ltd Preparation of corner joint member
JPS645023A (en) * 1987-06-26 1989-01-10 Nissha Printing Manufacture of resin mold having electronic parts
EP0340100A1 (en) * 1988-04-28 1989-11-02 Schlumberger Industries Manufacturing process for memory cards, and cards obtained by this process
JPH04138296A (en) * 1990-09-29 1992-05-12 Mitsubishi Electric Corp Thin semiconductor device
EP0521343A1 (en) * 1991-06-24 1993-01-07 Mitsubishi Denki Kabushiki Kaisha Electronic device and its production method
WO1993024381A1 (en) * 1992-05-29 1993-12-09 Idesco Oy Method for providing a transport or storage structure with a remote-readable escort memory and a transport or storage structure
FR2697801A1 (en) * 1992-11-06 1994-05-13 Allibert Equipement Materials handling pallet tracking process - uses electronic transponder located in corner of pallet storing data on pallet route, destination and contents
JPH0781284A (en) * 1993-09-14 1995-03-28 Casio Comput Co Ltd Manufacture of information medium
NL9400402A (en) * 1993-12-20 1995-07-17 Gerritse Beheer Bv Container with identification device
WO1996011098A1 (en) * 1994-10-06 1996-04-18 Perstorp Ab Process of incorporating a unit or object by moulding

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270101A (en) * 1963-04-01 1966-08-30 Kaumagraph Co Method of using static charge to decorate molded thermoplastic articles
US4795657A (en) * 1984-04-13 1989-01-03 Energy Conversion Devices, Inc. Method of fabricating a programmable array
US4911873A (en) * 1986-12-15 1990-03-27 Toyoda Gosei Co., Ltd. Terminal-treated extrusion and the method of terminal treatment therefor
ATE185914T1 (en) * 1991-04-03 1999-11-15 Integrated Silicon Design Pty GOODS SORTING SYSTEM
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
US6173514B1 (en) * 1995-02-28 2001-01-16 Contemporary, Inc. All plastic do-it-yourself name badge
US5697319A (en) * 1996-06-12 1997-12-16 Lowrance Electronics, Inc. Boat hull having the capability of installing an optional transducer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166516A (en) * 1984-02-08 1985-08-29 Kinugawa Rubber Ind Co Ltd Preparation of corner joint member
JPS645023A (en) * 1987-06-26 1989-01-10 Nissha Printing Manufacture of resin mold having electronic parts
EP0340100A1 (en) * 1988-04-28 1989-11-02 Schlumberger Industries Manufacturing process for memory cards, and cards obtained by this process
JPH04138296A (en) * 1990-09-29 1992-05-12 Mitsubishi Electric Corp Thin semiconductor device
EP0521343A1 (en) * 1991-06-24 1993-01-07 Mitsubishi Denki Kabushiki Kaisha Electronic device and its production method
WO1993024381A1 (en) * 1992-05-29 1993-12-09 Idesco Oy Method for providing a transport or storage structure with a remote-readable escort memory and a transport or storage structure
FR2697801A1 (en) * 1992-11-06 1994-05-13 Allibert Equipement Materials handling pallet tracking process - uses electronic transponder located in corner of pallet storing data on pallet route, destination and contents
JPH0781284A (en) * 1993-09-14 1995-03-28 Casio Comput Co Ltd Manufacture of information medium
NL9400402A (en) * 1993-12-20 1995-07-17 Gerritse Beheer Bv Container with identification device
WO1996011098A1 (en) * 1994-10-06 1996-04-18 Perstorp Ab Process of incorporating a unit or object by moulding

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 9544, Derwent World Patents Index; AN 95-342557 *
PATENT ABSTRACTS OF JAPAN vol. 10, no. 2 (M - 444) 8 January 1986 (1986-01-08) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 173 (E - 748) 24 April 1989 (1989-04-24) *
PATENT ABSTRACTS OF JAPAN vol. 16, no. 410 (M - 1302) 28 August 1992 (1992-08-28) *
PATENT ABSTRACTS OF JAPAN vol. 95, no. 6 31 July 1995 (1995-07-31) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791034A1 (en) 1999-03-19 2000-09-22 Allibert Equipement Electronic labeling of molding, commences by inserting labeling chip on substrate into sleeve and sealing hermetically whilst excluding air, followed by in-mold bonding with introduced plastic
FR2791035A1 (en) 1999-03-19 2000-09-22 Allibert Equipement Protective envelopment of electronic chip label, is carried out by e.g. pressure-bonding of extruded plastic sheets above fusion point around label, before in-mold incorporation into surface of object
EP1401645A1 (en) * 2001-05-22 2004-03-31 Michael J. Stevenson Graphics transfers for use in rotational molding
EP1401645A4 (en) * 2001-05-22 2009-09-30 Michael J Stevenson Graphics transfers for use in rotational molding
EP1315116A1 (en) * 2001-11-09 2003-05-28 Allibert Equipement Device which is traceable by an electronic identifier
FR2840253A1 (en) * 2002-05-31 2003-12-05 Knauf Snc Decoration of polycarbonate substrate during e.g. injection or blow-molding, prepares printed polycarbonate label and locates it on mold internal wall
EP1419977A3 (en) * 2002-11-15 2005-08-31 Linpac Plastics GmbH Food package, in particular a tray, with electronic tag

Also Published As

Publication number Publication date
FR2760998A1 (en) 1998-09-25
AU7049498A (en) 1998-10-20
DE69806912D1 (en) 2002-09-05
US6482287B1 (en) 2002-11-19
PT968078E (en) 2002-12-31
JP2001517167A (en) 2001-10-02
FR2760998B1 (en) 1999-05-21
EP0968078A1 (en) 2000-01-05
DE69806912T2 (en) 2003-03-27
ES2181201T3 (en) 2003-02-16
ATE221443T1 (en) 2002-08-15
EP0968078B1 (en) 2002-07-31

Similar Documents

Publication Publication Date Title
EP0968078B1 (en) Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method
EP0618548B1 (en) Method and device for manufacturing a memory card
EP1060457B1 (en) Electronic device with disposable chip and method for making same
EP2087460B1 (en) Radiofrequency identification device and method for producing said device
EP0709804B1 (en) Process of fabricating contactless cards
EP1256096B1 (en) Silicon chip token and methods for making same
EP0570784B1 (en) Card with at least one electronic element and process for manufacturing said card
EP1040448B1 (en) Smart card provided with guarantee label
EP1846874B1 (en) Method for applying an electronic assembly to a substrate and a device for applying said assembly
CA2805201A1 (en) Polycarbonate radiofrequency identification device, and method for manufacturing same
EP0692770A1 (en) Manufacturing process of a contactless card by overmoulding and contactless card obtained by such process
FR2520541A1 (en) Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
EP2002384B1 (en) Radiofrequency device
EP1459252B1 (en) Smart card
EP1687216B1 (en) Flexible tube comprising an electronic component
WO2003032241A1 (en) Electronic module with protective bump
EP0922555A1 (en) Moulding method for producing a plastic article provided on a surface with an insert of small thickness and article produced in this way
EP0641469B1 (en) Method for producing a card with at least one electronic component
WO2000048250A1 (en) Method for the production of a chip-card type portable storage medium
FR3138546A1 (en) Laminated electronic device and method of manufacturing such a device
FR3102066A1 (en) CLIMBING ASSOCIATED WITH A RADIO-IDENTIFICATION ELEMENT
EP2767935A1 (en) Plastic layer for electronic card
FR2801122A1 (en) Non contact memory card, includes micro-module and associated antenna with directly-superposed connection points
FR2833754A1 (en) Production of electronic component uses film handle fixed permanently to rear surface of semiconductor wafer for manipulating it
FR2962576A1 (en) RADIO LABEL ASSEMBLY, MOLDED PIECE COMPRISING SUCH AN ASSEMBLY AND METHOD OF MANUFACTURING SUCH A PIECE

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AU BA BB BG BR CA CN CU CZ EE GE HU ID IL IS JP KP KR LC LK LR LT LV MG MK MN MX NO NZ PL RO SG SI SK SL TR TT UA US UZ VN YU

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1998917190

Country of ref document: EP

ENP Entry into the national phase

Ref country code: JP

Ref document number: 1998 543249

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 09381416

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1998917190

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: CA

WWG Wipo information: grant in national office

Ref document number: 1998917190

Country of ref document: EP