WO1998042488A1 - Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method - Google Patents
Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method Download PDFInfo
- Publication number
- WO1998042488A1 WO1998042488A1 PCT/FR1998/000560 FR9800560W WO9842488A1 WO 1998042488 A1 WO1998042488 A1 WO 1998042488A1 FR 9800560 W FR9800560 W FR 9800560W WO 9842488 A1 WO9842488 A1 WO 9842488A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support
- label
- plastic
- wall
- mold
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229920003023 plastic Polymers 0.000 claims abstract description 31
- 239000004033 plastic Substances 0.000 claims abstract description 31
- 238000000465 moulding Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000010137 moulding (plastic) Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 239000002991 molded plastic Substances 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000012778 molding material Substances 0.000 claims description 17
- 229920001903 high density polyethylene Polymers 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 5
- 239000004700 high-density polyethylene Substances 0.000 claims description 5
- -1 polypropylene Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 229920006268 silicone film Polymers 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
- B65D25/205—Means for the attachment of labels, cards, coupons or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14114—Positioning or centering articles in the mould using an adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2203/00—Decoration means, markings, information elements, contents indicators
- B65D2203/10—Transponders
Definitions
- thermotransformed object Method for including an electronic label in the wall of a thermotransformed object, preparatory device for this method, and molded object obtained by this method
- the present invention relates to a method for inserting a thin electronic label with a flat face into the wall of an object produced by plastic transformation (injection or compression molding, rotational molding or blowing) with heat and pressure of thermotransformable plastics, in particular ABS (acrylonitrile-butadiene-styrene), polyurethanes, polyolefins such as polypropylene or polyethylene (and in particular high density polyethylene [HDPE]).
- molding will be called any thermotransformation performed in a mold, whether it is a true molding, or a blowing.
- the inserted label allows the remote and contactless identification of the object that contains it, which is particularly advantageous when the identified objects must be authenticated or sorted. It is introduced without the need to modify either the process or the injection device.
- the objects targeted are very diverse and can in particular be containers (bins, trash cans, flasks and bottles), pallets, component parts of vehicles (shield, dashboard), works of art.
- the object of the invention is to improve the method of including an electronic label during molding, and in particular to allow simple placement, practically at will and achievable even in thin walls.
- the flat face of the label is first fixed on a plastic support of thickness substantially equal to the desired depth of inclusion, the support is fixed to the wall of the mold, the plastic molding is brought into the mold under predetermined pressure and temperature, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that a connection is made between the two plastics intimate in the contact region.
- This bond is of the autogenous weld type, obtained by fusion and interpenetration of the two plastics in the contact region.
- the support during molding serves as a cushion for transient pressures due to injection.
- the melting point of the plastic material of the support is lower (and preferably sufficiently lower) than that of the plastic molding material, so as to ensure its melting well by contact with the molding material.
- the plastic molding material and that of the support are advantageously chosen from high density polyethylenes, that of the support having a lower density than that of molding to establish the difference between the melting points mentioned above.
- the melting temperatures of the first and second HDPE can be in the ranges of 150 ° C-200 ° C and 200 ° C-250 ° C respectively.
- ABS or polyurethanes are also particularly suitable.
- the label can be placed anywhere in the mold, but preferably an area close to reinforcements and therefore unlikely to cause undue bending in the label itself.
- the thin planar electronic label used in the invention is of a type known in itself, although it is the invention to have established that thin labels could be incorporated during the molding without protection by housing, contrary to what teaches for example the document WO 93 24381 A cited above.
- the label is an inductive label, without energy, constituted by an electrical circuit forming an antenna, printed on an insulating substrate of suitable quality, connected to an integrated circuit comprising a memory and the devices for communication with this memory from the outside and without contact.
- substrate of suitable quality is understood to mean in particular that it is resistant to the temperatures of around 200 ° C. encountered during molding, and that it has a certain rigidity, while being flexible, this rigidity contributing to its correct maintenance without wrinkling during molding.
- the substrates commonly used in thin epoxy for example from one to a few tenths of a mm, have this quality.
- Other materials such as kapton or PET are also suitable.
- the contents of the memory can be read, even modified, without contact by the passage of electromagnetic waves through a certain thickness of the plastic material of the substrate and the wall of the object in which it is molded.
- the identification electromagnetic waves can theoretically be BF, HF or UHF waves, the invention first of all focuses on labels using rather high frequencies (around 10 MHz, and in particular the approved frequency 13.56 MHz), with which it is possible to use an antenna of small dimensions, printed on the substrate (as opposed in particular to certain transponders of one prior art using antennas with multiple coils which risk being damaged during molding).
- the method is however applicable to lower frequencies, and in particular below 150 kHz, provided with a printed antenna.
- the printing of an antenna, in particular by screen-printed conductive ink, is well known to those skilled in the art (cf. for example the document FR 2 753 305 A).
- the label comprises at least one substantially flat face, generally that opposite to the integrated circuit, the other face often comprising a bead of resin protecting the chip of the integrated circuit.
- the total thickness of the thin label is of the order of 0.6 mm to 1 mm in line with the chip.
- flat is mainly meant a substantially planar geometric surface, but also more generally a developable surface (for example cylindrical), making it possible to stick a support sheet thereon, such a surface being able to better match the shape of certain molded objects.
- the support is advantageously fixed by gluing on the one hand to the flat face of the label and / or on the other hand to the wall of the mold, gluing in particular produced using a double-sided adhesive tape.
- the adhesive used to stick the label to the support is a double-sided adhesive having strong adhesion qualities on both sides (because it must stick materials with low adhesion power, such as polyethylene), and resistant to molding temperatures.
- the adhesive used to stick the support to the mold is strongly adherent on its face intended to receive the support, but only weakly adhered on the other face intended to stick on the steel of the mold. Repositionable adhesive type adhesion is sufficient because steel allows good natural bonding. Moreover, it is advantageous to present the labels provided with their support and the two adhesives on a temporary non-stick support, such as a silicone film, from which they are detached to stick them on the mold.
- the double-sided adhesive which is during molding in contact with the mold and is not directly exposed to the molding material, must withstand a temperature generally less than 100 ° C. (taking into account the cooling of the molds generally strong). Its thickness is as small as possible, so as not to create on the molded object, once removed, too large a recess.
- the label support is cut from a thin sheet of plastic material, of a chemical nature and of physical characteristics chosen to obtain the fusion welding mentioned above.
- Its thickness is preferably less than 1 mm, and advantageously of the order of 500 ⁇ m: an excessively large thickness opposes more thermal inertia to the localized heating and melting of the support in contact with the molding material; on the other hand, too much thickness can lead to phenomena of reflux and irregularities in molding, when the molten molding material passes over the label glued to the mold.
- the support is prepared in a sheet directly coated on each of its two faces with the adhesive necessary to stick on the one hand the label and on the other hand the mold (or the provisional support), making unnecessary use of the double-sided adhesives mentioned above.
- the support protrudes from the label so as to create a sufficiently large contact surface between it and the molding material to produce solid integration of the molded object label.
- This contact surface is provided outside the label, and / or, by cutting a central part of the label not occupied by the printed circuit, inside the label itself.
- the support when the dimensions of the label make it advisable to make a central cut, also has a central hole, so that the molding material can flow to the wall of the mold, in the center of the label. and support, and facilitate the degassing of the plastic.
- the surface part of the support which protrudes from the label, externally and / or internally, can be provided with channels facilitating the evacuation of gases and contributing to the absence of bubbles.
- the label can receive on its face other than the flat face other covering elements such as a sheet of plastic material; it can also be previously embedded in a block of plastic before being placed on the support, or else said block can directly constitute, on the side of the flat face of the label, said support if the material constituting the block is chosen properly.
- the invention also relates, as an intermediate means for the above method, to a preparatory device for the inclusion of a thin electronic label with a flat face, at a predetermined depth in a wall of a molded object.
- a preparatory device for the inclusion of a thin electronic label with a flat face at a predetermined depth in a wall of a molded object.
- made of plastic under a predetermined pressure and temperature characterized in that it comprises on the one hand said label and on the other hand a plastic support of thickness substantially equal to the desired depth of inclusion, support on which said flat face of the label is fixed, the plastic material of the label support being chosen as a function of the plastic molding material and of said pressure and temperature so that an intimate bond is produced by fusion in the contact region between the two plastics during molding.
- the support is advantageously fixed by gluing to the flat face of the label.
- the support is bonded by means of a relatively weak adhesive to a temporary non-stick support, for example in strip which can group together several labels, each label comprising a substrate on which there is an integrated circuit and an antenna. printed.
- a temporary non-stick support for example in strip which can group together several labels, each label comprising a substrate on which there is an integrated circuit and an antenna. printed.
- the invention naturally relates to the molded plastic object itself, comprising an electronic label which has been included in a wall of the object by the process according to the invention.
- FIG. 1 is a schematic top view of a label presented on a temporary support
- FIG. 2 is a section II-II of the Figure 1
- Figure 3 is a sectional view of the label in place in the mold.
- the thin label 1 shown in FIGS. 1 to 3 is in the form of a substrate or thin film, for example made of 0.13 mm thick epoxy, of generally square shape (for example 28 mm ⁇ 28 mm ), on which are on the one hand the integrated circuit (chip), protected by a resin bead 3 (thickness at the right of the chip 0.70 mm), and on the other hand a screen-printed antenna 4 (thickness at the right 0.18 mm), arranged in a square so as to have a large interception surface.
- a substrate or thin film for example made of 0.13 mm thick epoxy, of generally square shape (for example 28 mm ⁇ 28 mm ), on which are on the one hand the integrated circuit (chip), protected by a resin bead 3 (thickness at the right of the chip 0.70 mm), and on the other hand a screen-printed antenna 4 (thickness at the right 0.18 mm), arranged in a square so as to have a large interception surface.
- the label 1 is glued to its support 5 according to the invention by means of a double-sided adhesive 6, 0.127 mm thick and of very high adhesion, for example the adhesive sold by the company 3M. under the reference Y9492 (180 ° peel resistance on steel of 16.3 N / cm after 72 hours).
- the label 1 and its adhesive 6 are cut internally to release an interior opening 7 (no active element of the label being in the central area of the label 1).
- the support 5 is for example made of a polyethylene film of relatively high molecular weight, and of thickness between 0.55 mm and 0.65 mm.
- the support 5 is placed with a double-sided adhesive 11 on a silicone film 12 (temporary support) 0.10 mm thick.
- a silicone film 12 temporary support
- Several labels can be placed in succession on a strip of silicone film, possibly wound.
- the double-sided adhesive is for example that, of thickness 0.062 mm, supplied by the company 3M under the reference 9871.
- a hole 10 (diameter for example of 12 mm) is provided in the center of the support 5 and of the adhesive 11.
- the periphery of the adhesive 11 may be very slightly set back relative to the periphery of the support 5, or even of plumb, but preferably not overflowing so as not to create during molding bonds with the molded material which may hinder the subsequent removal of the adhesive 11 after demolding.
- the label 1 is removed, with its support 5 and the adhesive 11, from the silicone film 12 and, when the mold is opened, is glued by the adhesive 11 at the desired location on the steel wall 13 of the mold 13.14.
- the plastic molding material 15 can then fill the gap between the two walls 13, 14 and comes into contact with the label 1 and parts of the support 5 not covered by the label 1.
- the plastic material of the support 5 melts at least superficially in contact with the material molding 15 so that a weld zone is formed between the two materials, shown in thick lines in FIG. 3.
- the hole 10 allows the molded material to reach the wall of the mold in the central part of the label and therefore facilitates the degassing of polyethylene by the walls.
- FIG. 1 shows only a few of these channels 17.
- the relatively weak adhesion of the adhesive 11 to the steel wall 13 does not prevent it from being removed from the mold, and the adhesive 11 can subsequently be removed from the surface of the molded object. The following tests have been successfully completed.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/381,416 US6482287B1 (en) | 1997-03-21 | 1998-03-20 | Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method |
AU70494/98A AU7049498A (en) | 1997-03-21 | 1998-03-20 | Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method |
EP98917190A EP0968078B1 (en) | 1997-03-21 | 1998-03-20 | Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method |
DE69806912T DE69806912T2 (en) | 1997-03-21 | 1998-03-20 | METHOD FOR ENCLOSING AN ELECTRONIC LABEL IN THE WALL OF A THERMOFORMED OBJECT, AND PREPARATION DEVICE FOR THIS METHOD |
AT98917190T ATE221443T1 (en) | 1997-03-21 | 1998-03-20 | METHOD FOR INCLUSION OF AN ELECTRONIC LABEL INTO THE WALL OF A HEAT-FORMED ARTICLE AND PREPARATION APPARATUS FOR SUCH METHOD |
JP54324998A JP2001517167A (en) | 1997-03-21 | 1998-03-20 | Method for enclosing an electronic label in a wall surface of a thermally processed product, manufacturing apparatus for this method, and mold body obtained by this method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9703456A FR2760998B1 (en) | 1997-03-21 | 1997-03-21 | METHOD OF INCLUDING AN ELECTRONIC LABEL IN AN OBJECT MADE OF PLASTIC, AT THE TIME OF THE MANUFACTURE OF THE OBJECT |
FR97/03456 | 1997-03-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998042488A1 true WO1998042488A1 (en) | 1998-10-01 |
Family
ID=9505041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1998/000560 WO1998042488A1 (en) | 1997-03-21 | 1998-03-20 | Method for including an electronic label in the wall of a heat-transformed object, preparatory device for this method, and moulded object resulting from this method |
Country Status (10)
Country | Link |
---|---|
US (1) | US6482287B1 (en) |
EP (1) | EP0968078B1 (en) |
JP (1) | JP2001517167A (en) |
AT (1) | ATE221443T1 (en) |
AU (1) | AU7049498A (en) |
DE (1) | DE69806912T2 (en) |
ES (1) | ES2181201T3 (en) |
FR (1) | FR2760998B1 (en) |
PT (1) | PT968078E (en) |
WO (1) | WO1998042488A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2791035A1 (en) | 1999-03-19 | 2000-09-22 | Allibert Equipement | Protective envelopment of electronic chip label, is carried out by e.g. pressure-bonding of extruded plastic sheets above fusion point around label, before in-mold incorporation into surface of object |
FR2791034A1 (en) | 1999-03-19 | 2000-09-22 | Allibert Equipement | Electronic labeling of molding, commences by inserting labeling chip on substrate into sleeve and sealing hermetically whilst excluding air, followed by in-mold bonding with introduced plastic |
EP1315116A1 (en) * | 2001-11-09 | 2003-05-28 | Allibert Equipement | Device which is traceable by an electronic identifier |
FR2840253A1 (en) * | 2002-05-31 | 2003-12-05 | Knauf Snc | Decoration of polycarbonate substrate during e.g. injection or blow-molding, prepares printed polycarbonate label and locates it on mold internal wall |
EP1401645A1 (en) * | 2001-05-22 | 2004-03-31 | Michael J. Stevenson | Graphics transfers for use in rotational molding |
EP1419977A3 (en) * | 2002-11-15 | 2005-08-31 | Linpac Plastics GmbH | Food package, in particular a tray, with electronic tag |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2770172B1 (en) * | 1997-10-24 | 1999-12-10 | Allibert Equipement | MOLDING PROCESS FOR PRODUCING A PART MADE OF PLASTIC MATERIAL PROVIDED ON A SURFACE OF AN ADDED ELEMENT OF LOW THICKNESS, AND PART THUS PRODUCED |
FR2796880B1 (en) * | 1999-07-26 | 2002-06-14 | Europlastiques Sa | PRODUCT MADE BY INJECTING PLASTIC MATERIAL INTO A MOLD AND INCORPORATING AN ELECTRONIC LABEL |
FR2798362B1 (en) * | 1999-09-09 | 2001-11-16 | Knauf Snc | PACKAGING CONTAINER, ESPECIALLY FOR FOOD PRODUCTS, AND METHOD FOR MANUFACTURING SUCH A CONTAINER |
GB0024070D0 (en) * | 2000-10-02 | 2000-11-15 | Innavisions Ltd | Mpulding apparatus and method |
EP1221738A3 (en) * | 2000-12-27 | 2002-10-23 | The Furukawa Electric Co., Ltd. | Small antenna and manufacturing method thereof |
US6773653B2 (en) * | 2001-10-05 | 2004-08-10 | Avery Dennison Corporation | In-mold labeling method |
US7037455B2 (en) | 2001-12-21 | 2006-05-02 | Mattel, Inc. | Insert molding method |
WO2004066197A1 (en) * | 2003-01-21 | 2004-08-05 | Siemens Aktiengesellschaft | Plastic product comprising an integrated low-cost chip |
DE10310238A1 (en) * | 2003-03-08 | 2004-09-23 | Bekuplast Kunststoffverarbeitungs-Gmbh | Plastic container with integrated transponder |
FR2854098B1 (en) * | 2003-04-23 | 2007-04-06 | Daniel Andre Gastel | LAMINATED PRODUCT WITH ELECTRONIC IDENTIFICATION MEMBER AND DEVICE FOR IDENTIFYING AND MONITORING SUCH PRODUCTS |
FR2862947B1 (en) | 2003-11-28 | 2010-01-01 | Cebal Sas | FLEXIBLE TUBE WITH ELECTRONIC COMPONENT |
GB2411860A (en) * | 2004-03-08 | 2005-09-14 | Mtr Corp Ltd | A label attachable to a settable material |
ATE411586T1 (en) * | 2004-08-23 | 2008-10-15 | Schreiner Group Gmbh & Co Kg | LABEL TO COVER GAS EXCHANGE OPENINGS |
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FR2791035A1 (en) | 1999-03-19 | 2000-09-22 | Allibert Equipement | Protective envelopment of electronic chip label, is carried out by e.g. pressure-bonding of extruded plastic sheets above fusion point around label, before in-mold incorporation into surface of object |
FR2791034A1 (en) | 1999-03-19 | 2000-09-22 | Allibert Equipement | Electronic labeling of molding, commences by inserting labeling chip on substrate into sleeve and sealing hermetically whilst excluding air, followed by in-mold bonding with introduced plastic |
EP1401645A1 (en) * | 2001-05-22 | 2004-03-31 | Michael J. Stevenson | Graphics transfers for use in rotational molding |
EP1401645A4 (en) * | 2001-05-22 | 2009-09-30 | Michael J Stevenson | Graphics transfers for use in rotational molding |
EP1315116A1 (en) * | 2001-11-09 | 2003-05-28 | Allibert Equipement | Device which is traceable by an electronic identifier |
FR2840253A1 (en) * | 2002-05-31 | 2003-12-05 | Knauf Snc | Decoration of polycarbonate substrate during e.g. injection or blow-molding, prepares printed polycarbonate label and locates it on mold internal wall |
EP1419977A3 (en) * | 2002-11-15 | 2005-08-31 | Linpac Plastics GmbH | Food package, in particular a tray, with electronic tag |
Also Published As
Publication number | Publication date |
---|---|
FR2760998B1 (en) | 1999-05-21 |
EP0968078B1 (en) | 2002-07-31 |
DE69806912D1 (en) | 2002-09-05 |
DE69806912T2 (en) | 2003-03-27 |
AU7049498A (en) | 1998-10-20 |
JP2001517167A (en) | 2001-10-02 |
US6482287B1 (en) | 2002-11-19 |
FR2760998A1 (en) | 1998-09-25 |
EP0968078A1 (en) | 2000-01-05 |
PT968078E (en) | 2002-12-31 |
ATE221443T1 (en) | 2002-08-15 |
ES2181201T3 (en) | 2003-02-16 |
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