JPS63269598A - Connection of terminal of electronic component - Google Patents
Connection of terminal of electronic componentInfo
- Publication number
- JPS63269598A JPS63269598A JP10414387A JP10414387A JPS63269598A JP S63269598 A JPS63269598 A JP S63269598A JP 10414387 A JP10414387 A JP 10414387A JP 10414387 A JP10414387 A JP 10414387A JP S63269598 A JPS63269598 A JP S63269598A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- thermosetting resin
- terminals
- fpc
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 32
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000013035 low temperature curing Methods 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 20
- 230000001070 adhesive effect Effects 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 7
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 description 10
- 239000005060 rubber Substances 0.000 description 10
- 239000011295 pitch Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
「技術分野」
本発明は、例えば液晶表示装置やＥＬ表示装冨等の端子
部と、プリント配線板の端子部を接続するための電子部
品の端子接続方法に間する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for connecting terminals of electronic components, for example, for connecting the terminals of a liquid crystal display device, an EL display device, etc., and the terminals of a printed wiring board. .
「従来技術およびその問題点」
この種の端子接続方法としては、ヒートシールコネクタ
を用いて接続する方法、異方導電シートを用いて接続す
る方法、導電ラバーコネクタを用いて接続する方法ある
いは半田付けにて接続する方法等がある。"Prior art and its problems" This type of terminal connection method includes a method of connecting using a heat seal connector, a method of connecting using an anisotropic conductive sheet, a method of connecting using a conductive rubber connector, and a method of connecting using a conductive rubber connector, or a method of connecting using a conductive rubber connector. There are several ways to connect.
ヒートシールコネクタ接続法は、菓２図に示すように、
ベースフィルム１上に、熱可塑性樹脂に導電粒子を加え
た熱接着性導電層２と、熱接着性樹脂からなるＷｉ着層
３とをパターン形成したものを用い、この熱接着性導電
層２を基板４側の引出し端子５に位置合わせし、加熱、
加圧することで接続するものである。これで、熱接着性
導電層２が引出し端子５に接着して導通し、ざらに接着
層３によってベースフィルム１と基板４が接着保持され
る。しかし、この接着法では、熱接着性導電層２が金層
箔等に比べて導通性が悪く、該導電層２の抵抗が大きく
なるため、液晶表示装置のような微小電流用の装置だけ
にしか適用できない、また、主に接着層３によってベー
スフィルム１と基板４を保持しでいるので、接着力が弱
い。The heat seal connector connection method is as shown in Figure 2.
A heat-adhesive conductive layer 2 made of a thermoplastic resin containing conductive particles and a Wi adhesion layer 3 made of a heat-adhesive resin are patterned on a base film 1. Align with the lead-out terminal 5 on the board 4 side, heat,
The connection is made by applying pressure. The heat-adhesive conductive layer 2 is now adhered to the lead-out terminal 5 for electrical conduction, and the base film 1 and the substrate 4 are adhered and held by the rough adhesive layer 3. However, with this adhesive method, the thermal adhesive conductive layer 2 has poor conductivity compared to gold foil, etc., and the resistance of the conductive layer 2 increases, so it is suitable only for devices for microcurrent such as liquid crystal display devices. Moreover, since the base film 1 and the substrate 4 are mainly held by the adhesive layer 3, the adhesive force is weak.
また、異方導電シート接続法は、第３図１こ示すように
、熱接着性樹脂に導電粒子を混合しでなる異方導電シー
ト６を、引出し端子５を有する基板４と、この引出し端
子５と対応する接続端子７を有するフレキシブルプリン
ト配線板（以下、ＦＰＣと略称する）８との間に挟み、
加熱、加圧して接着するものである。加熱、加圧により
、両端子５と７の間に導電粒子が入り、これが両端子５
と７に接触することで、上下の端子５と７は導通する。In addition, as shown in FIG. 3, the anisotropic conductive sheet connection method involves connecting an anisotropic conductive sheet 6 made of a thermoadhesive resin mixed with conductive particles to a substrate 4 having a lead terminal 5, and the lead terminal 5. 5 and a flexible printed circuit board (hereinafter abbreviated as FPC) 8 having a corresponding connection terminal 7,
It is bonded by applying heat and pressure. Due to heating and pressurization, conductive particles enter between both terminals 5 and 7, and these
By contacting with and 7, the upper and lower terminals 5 and 7 are electrically connected.
また、端子部以外のＦＰＣ８と基板４との間は、導電性
粒子が分散しているので、絶縁性が保たれる。しかし、
この接続法でも、ＦＰＣ８と基板４との接着を熱接着性
樹脂によって行なっているため接着力が弱く、導通性の
比較的悪い導電粒子によって両端子５と７を導通させる
ので、微小電流用の装置にしか適用できない、また、耐
熱、耐湿特性においても、接触抵抗の変化が激しい。Further, since conductive particles are dispersed between the FPC 8 and the substrate 4 other than the terminal portion, insulation is maintained. but,
In this connection method as well, the FPC 8 and the board 4 are bonded using a thermoadhesive resin, so the adhesive force is weak, and the terminals 5 and 7 are made conductive by conductive particles with relatively poor conductivity, so it is suitable for micro currents. It can only be applied to devices, and the contact resistance changes drastically in terms of heat resistance and moisture resistance.
導電ラバーコネクタ接続法は、第４図に示すように、導
電ラバー９と非導電ラバー１０を交互に有するラバーコ
ネクタ１１を、基板４とプリント配線基板１２の間に挟
み、導電ラバー９を引出し端子５と接続端子７に位置合
わせしたうえで、上下からホルダ１３で圧接させるもの
である。この接続法では、ラバーコネクタ１１の位置ズ
レによる短絡防止の観点から、隣接する導電ラバー９の
ピッチを大きく取らなければならないため、微小な端子
ピッチには適用できない、また、導電ラバー９で導通さ
せるので、微小電流用の装置にしか適用しにくい、ざら
に、ゴミ等の侵入にも弱く、ホルダ１３を用いるため構
造が複雑化し、接続部分も大型化する。In the conductive rubber connector connection method, as shown in FIG. 4, a rubber connector 11 having conductive rubber 9 and non-conductive rubber 10 alternately is sandwiched between a board 4 and a printed wiring board 12, and the conductive rubber 9 is pulled out and connected to a terminal. 5 and the connecting terminal 7, and then press them into contact with the holder 13 from above and below. This connection method requires a large pitch between adjacent conductive rubbers 9 in order to prevent short circuits due to misalignment of the rubber connector 11, so it cannot be applied to minute terminal pitches. Therefore, it is difficult to apply it only to devices for microcurrent, it is susceptible to roughness and intrusion of dust, etc., and the use of the holder 13 complicates the structure and increases the size of the connecting portion.
半田付（プ接続法は、第５図に示すように、ＦＰＣ８側
の引出し端子５に予備半田１４を施し、引出し端子５と
接続端子７を位置合わせしたうえで、これを加熱、加圧
し、予備半田１４の溶解によって引出し端子５と接続端
子７を接続するものである。As shown in Fig. 5, the soldering (pull connection method) applies preliminary solder 14 to the lead-out terminal 5 on the FPC 8 side, aligns the lead-out terminal 5 and the connecting terminal 7, and then heats and pressurizes this. The lead terminal 5 and the connecting terminal 7 are connected by melting the preliminary solder 14.
しかし、この接続法では、加圧、加熱によって流れ出た
予備半田１４がｌ１ｌＷｉ端子間を短絡させることがあ
るため、端子どツチを大きく取らなければならず、また
、基板４とＦＰＣ８との接続を予備半田１４だけで行な
うので、接着力が弱い難点がある。However, with this connection method, the preliminary solder 14 that flows out due to pressure and heating may cause a short circuit between the l1lWi terminals, so the terminals must be made larger, and the connection between the board 4 and the FPC 8 is difficult. Since this is done using only the preliminary solder 14, the adhesive strength is weak.
このように、上記いずれの従来法も、端子接続部分の接
着力が弱いため、端子接続後は、補強用の樹脂等で端子
接続部分を別に固定している。また、半田法を除いては
微小電流の電子部品にしか適用できず、大きな電流が使
用されるＥＬ表示装置等には適用することが困難であっ
た。As described above, in any of the above-mentioned conventional methods, since the adhesive strength of the terminal connecting portion is weak, after the terminal is connected, the terminal connecting portion is separately fixed with reinforcing resin or the like. In addition, methods other than the soldering method can only be applied to electronic components that use a small current, and are difficult to apply to EL display devices that use a large current.
「発明の目的」
本発明の目的は、上記従来の端子接続方法の問題点を解
消し、微小電流用から大電流用の装置まで幅の広い適用
が可能で、接続部分の接着力に優れ、微小端子ピッチに
も適用することのできる電子部品の端子接続方法を提供
することにある。``Object of the Invention'' The purpose of the present invention is to solve the problems of the conventional terminal connection method described above, to be applicable to a wide range of devices from microcurrent to large current, and to have excellent adhesive strength at the connection part. It is an object of the present invention to provide a terminal connection method for electronic components that can be applied even to minute terminal pitches.
「発明の構成」
本発明による電子部品の端子接続方法は、電子部品が形
成された基板側の引出し端子と、この引出し端子に適合
するプリント配線板側の接続端子とにそれぞれ予備半田
を施し、この予備半田の上から上記基板および／または
プリント配線板の端子形成面の全面に熱硬化性樹Ｓを塗
布し、上記基板とプリント配線板の端子同士を突き合わ
せて半田溶融温度以上にて加熱加圧し、半田付けにより
両端子を導通させると同時に上記熱硬化性樹脂を少なく
とも半硬化させることを特徴とする。"Structure of the Invention" The method for connecting terminals of electronic components according to the present invention includes pre-soldering each lead-out terminal on the board side on which the electronic component is formed and a connection terminal on the printed wiring board side that is compatible with the lead-out terminal, respectively. Thermosetting resin S is applied over the preliminary solder to the entire terminal forming surface of the board and/or printed wiring board, and the terminals of the board and printed wiring board are brought together and heated to a temperature above the solder melting temperature. The thermosetting resin is at least semi-hardened at the same time as both the terminals are electrically connected by pressing and soldering.
このように、基板およびＦＰＣの端子部にそれぞれ予備
半田を施した後、基板および／またはＦＰＣの端子部全
面に熱硬化性樹脂を塗布し、基板とＦＰＣの端子同士を
突き合わせて半田溶融温度以上にて加熱加圧すると、熱
硬化性樹脂は、半田溶融温度に高められると硬化し始め
るが、すぐには硬化しないので、加圧の作用によって端
子の横に逃げ、端子同士が接触して溶融した半田により
接続される。この状態をしばらく保持すると、熱硬化性
樹脂がある程度硬化し、基板とＦＰＣとを容易には剥が
れない程度に接着する。その後、さらに加熱を行ない、
熱硬化性樹脂を完全に硬化させることにより、強い接着
力が得られる。In this way, after preliminary soldering is applied to the terminals of the board and FPC, thermosetting resin is applied to the entire surface of the terminals of the board and/or FPC, and the terminals of the board and FPC are butted together to reach a temperature above the solder melting temperature. When heated and pressurized, the thermosetting resin begins to harden when raised to the solder melting temperature, but it does not harden immediately, so it escapes to the side of the terminals due to the action of pressure, and the terminals come into contact and melt. Connected using solder. When this state is maintained for a while, the thermosetting resin hardens to some extent, and the substrate and FPC are bonded to such an extent that they cannot be easily peeled off. After that, further heating is performed,
Strong adhesive strength can be obtained by completely curing the thermosetting resin.
そして、本発明においては、端子部の接着が熱硬化性樹
脂と半田との両方によってなされるので、強い接着力が
得られる。また、半田を介して両端子が導通するので、
ＥＬ表示装置等の大きな電流が使用される電子部品にも
適用できる。ざらに、熱硬化性樹脂により強固な接着力
が得られるため、半田による接着力はそれほど要求され
ず、予備半田の量を少なくすることができ、よって隣接
する端子間のショートを防止して像細なピッチにも適用
することができる。Further, in the present invention, since the terminal portion is bonded using both the thermosetting resin and the solder, strong adhesive force can be obtained. Also, since both terminals are electrically connected through the solder,
It can also be applied to electronic components that use large currents, such as EL display devices. In general, since the thermosetting resin provides strong adhesive strength, the adhesive strength of solder is not required as much, and the amount of preliminary solder can be reduced, thereby preventing short circuits between adjacent terminals and improving image quality. It can also be applied to fine pitches.
本発明の好ましい態様によれば、熱硬化性樹脂の塗布膜
厚は２０〜２００ｕｍとされる。塗布膜厚が２０ｕｍ未
満であると、強い接着力が得られないし、２００ｕｍを
超えると、加熱、加圧段階で端子同士の間に残りやすく
なり、端子同士の導通を妨げる虞れがある。熱硬化性樹
脂は、基板またはＦＰＣのいずれかまたは両方の端子部
に塗布すればよく、両方の端子部に塗布する場合は、そ
の合計の膜厚が上記範囲となるようにすることが好まし
い。According to a preferred embodiment of the present invention, the coating thickness of the thermosetting resin is 20 to 200 um. If the coating film thickness is less than 20 um, strong adhesion cannot be obtained, and if it exceeds 200 um, it tends to remain between the terminals during the heating and pressurizing steps, which may impede electrical conduction between the terminals. The thermosetting resin may be applied to the terminal portions of either or both of the substrate and the FPC, and when it is applied to both terminal portions, it is preferable that the total film thickness falls within the above range.
また、本発明の別の好ましい態様によれば、予備半田の
膜厚は５〜２００ｕｍとされる。予備半田の膜厚が５
ｕｍ未溝であると、半田量が不足して導通不良が生じや
すくなり、２００ｕｍを超えると、過剰の半田が横に広
がって、隣り合う端子間で短絡が生じやすくなる。なお
、端子ピッチが極めて狭い場合、例えば０．３ｍｍ程度
の場合には、予備半田の膜厚は、５〜３０ｕｍとするこ
とが好ましい。According to another preferred embodiment of the present invention, the thickness of the preliminary solder is 5 to 200 um. Preliminary solder film thickness is 5
If the um groove is not formed, the amount of solder is insufficient, which tends to cause poor conduction, and if it exceeds 200 um, the excess solder spreads laterally, making it easy to cause a short circuit between adjacent terminals. Note that when the terminal pitch is extremely narrow, for example, about 0.3 mm, the thickness of the preliminary solder is preferably 5 to 30 um.
「発明の実施例」
以下に、本発明による端子接続方法の一実施例を第１図
に基いて説明する。"Embodiment of the Invention" An embodiment of the terminal connection method according to the present invention will be described below with reference to FIG.
各種電子部品が形成された基板２１には、所定パターン
で複数の引出し端子２２が形成され、また、ＦＰＣ２３
には、引出し端子２２に対応したパターンで複数の接続
端子２４が形成されている。A plurality of lead-out terminals 22 are formed in a predetermined pattern on the substrate 21 on which various electronic components are formed, and the FPC 23
A plurality of connection terminals 24 are formed in a pattern corresponding to the lead-out terminals 22.
まず、基板２１の各引出し端子２２とＦＰＣ２３の各接
続端子２４に、それぞれ予備半田２５および２６を施す
（第１図（ａ））、この場合、予備半田２５および２６
の膜厚は、５〜２００μｍとすることが好ましく、ざら
に端子ピッチが極めて狭い場合には、５〜３０μｍとす
ることが好ましい、この半田膜厚は、例えば浸漬法を採
用する場合、半田液の温度や半田液への浸漬速度によっ
て適宜調整される。First, preliminary solder 25 and 26 are applied to each lead-out terminal 22 of the board 21 and each connecting terminal 24 of the FPC 23 (FIG. 1(a)).
The solder film thickness is preferably 5 to 200 μm, and if the terminal pitch is extremely narrow, it is preferably 5 to 30 μm. It is adjusted appropriately depending on the temperature and the immersion speed in the solder liquid.
次に本発明では、上記の端子形成面の全面に熱硬化性樹
脂３０を塗布する（第１図（ｂ））、この熱硬化性樹脂
３０は、基板２１とＦＰＣ２３を接着させるためのもの
である。この場合、熱硬化性樹脂３０は、基板２１側ま
たはＦＰＣ２３側の一方、あるいは両方に塗布される。Next, in the present invention, a thermosetting resin 30 is applied to the entire surface of the terminal forming surface (FIG. 1(b)). This thermosetting resin 30 is for bonding the substrate 21 and the FPC 23. be. In this case, the thermosetting resin 30 is applied to one or both of the substrate 21 side and the FPC 23 side.
ただし、作業性の面からは、ＦＰＣ２３側のみに塗布す
るのが好ましい、この熱硬化性樹脂３０としては、５０
〜１００℃程度で硬化し始める樹脂が好ましく用いられ
、例えばエポキシ樹脂、ポリエステル樹脂などが用いら
れる。特に低温硬化型エポキシ樹脂が最適である。また
、熱硬化性樹脂３０の塗布膜厚は、好ましくは２０〜２
００μｍとされる。However, from the viewpoint of workability, it is preferable to apply it only to the FPC 23 side.As this thermosetting resin 30, 50%
A resin that begins to harden at about 100° C. is preferably used, such as an epoxy resin or a polyester resin. In particular, low-temperature curing epoxy resins are most suitable. Further, the coating film thickness of the thermosetting resin 30 is preferably 20 to 2
00 μm.
次に、基板２１の引出し端子２２とＦＰＣ２３の接続端
子２４とを、位置合わせして突き合わせ、上下から加圧
力Ｐをかけながら、両端子部を突き合せて半田溶融温度
以上で加熱、加圧する（第１図（Ｃ））。Next, the lead terminals 22 of the board 21 and the connection terminals 24 of the FPC 23 are aligned and butted together, and while applying pressure P from above and below, both terminals are butted together and heated and pressurized at a temperature higher than the solder melting temperature ( Figure 1 (C)).
熱硬化性樹脂３０は、加熱直後にはまだ充分に硬化して
いないので、引出し端子２２と接続端子２４の間にある
ものは、横に逃げて押出される。したがって、引出し端
子２２と接続端子２４の予備半田２５．２６が接触し、
溶融した状態で接合して、両端子２２．２４ヲ導通させ
る。このように、両端子２２．２４の導通は、導電性の
高い半田を介して行なわれるので、比較的高電圧を印加
する電子部品にも適用可能となる。そして、この加熱加
圧状態をさらに保持すると、熱硬化性樹脂３０が半硬化
状態となり、極端な力を加えない限り、基板２１とＦＰ
Ｃ２３が剥がれない程度の接着力Ｉｖ主しるようになる
。したがって、熱硬化性樹脂３０が半硬化状態となれば
、加圧状態を解除しで取扱うことができ、多数の電子部
品を一度に加熱、処理することができる。こうして、ざ
らに加熱して、熱硬化性樹Ｆｉ１を完全に硬化させ、強
力な接着力で基板２１とＦＰＣ２３を接着する。これで
、ｍ着力の強い端子接続が得られる。Immediately after heating, the thermosetting resin 30 has not yet sufficiently hardened, so that the material between the pull-out terminal 22 and the connecting terminal 24 escapes laterally and is extruded. Therefore, the preliminary solder 25 and 26 of the lead-out terminal 22 and the connecting terminal 24 come into contact,
The two terminals 22 and 24 are connected in a molten state to be electrically connected. In this way, since the terminals 22 and 24 are electrically connected via the highly conductive solder, the present invention can be applied to electronic components to which a relatively high voltage is applied. If this heated and pressurized state is further maintained, the thermosetting resin 30 becomes a semi-hardened state, and unless extreme force is applied, the substrate 21 and FP
The adhesive strength Iv becomes high enough to prevent C23 from peeling off. Therefore, once the thermosetting resin 30 is in a semi-hardened state, it can be handled without being pressurized, and a large number of electronic components can be heated and processed at once. In this way, the thermosetting resin Fi1 is completely cured by heating roughly, and the substrate 21 and the FPC 23 are bonded with strong adhesive force. With this, a terminal connection with strong adhesion force can be obtained.
なあ、上記接続方法において、予備半田２５および２６
を、従来例に比べて少ない量で形成することが可能とな
るので、加熱溶解による流出によって隣接する端子間に
短絡の生じることがない、したがって、引出し端子２２
と接続端子２４を微細ピッチに形成したものにも、本接
続方法を適用することができる。By the way, in the above connection method, the preliminary solder 25 and 26
can be formed in a smaller amount than in the conventional example, so there will be no short circuit between adjacent terminals due to outflow due to heating and melting.
This connection method can also be applied to those in which the connection terminals 24 are formed at a fine pitch.
（実施例）
基板とＦＰＣの各端子部に、それぞれロジン系のフラッ
クスを塗布し、該端子部を半田槽に浸漬し、半田膜厚２
０μｍの予備半田を施した猾、端子部以外に付着してい
るフラックスを、イソプロピルアルコールを用いて超音
波洗浄により除去した。その後、ＦＰＣ側だけの端子形
成部全面に、低温硬化型エポキシ樹脂ｒＲＩ５８Ａ−２
＋Ｈ−８２Ｊ （商品名工日本合成化工■製）を膜厚
１００ ｕｍ ″Ｃ−塗布した。塗布後３０分以内に、
ＦＰＣと基板の端子部を位置合わせして突き合わせ、２
５０℃のヒータブロックで端子部を加熱、加圧して、予
備半田を溶解させ、この状態を１分間保持した。この結
果、エポキシ樹脂が半硬化して、極端な力を与えない限
り剥がれない程度の接着力が得られた。その後、接続さ
れたＦＰＣと基板とを取出し、１５０℃にして３０分間
ざらに加熱したところ、エポキシ樹脂が完全硬化して、
強力な接着力をもった端子接続が得られた。(Example) Rosin-based flux is applied to each terminal part of the board and FPC, and the terminal part is immersed in a solder bath, and the solder film thickness is 2.
The flux adhering to areas other than the terminals of the 0 μm pre-soldered ring was removed by ultrasonic cleaning using isopropyl alcohol. After that, apply low-temperature curing epoxy resin rRI58A-2 to the entire surface of the terminal forming area only on the FPC side.
+H-82J (trade name manufactured by Nippon Gosei Kako) was applied to a film thickness of 100 um''C-. Within 30 minutes after application,
Align and butt the terminals of the FPC and the board, 2
The terminal portion was heated and pressurized with a heater block at 50° C. to melt the preliminary solder, and this state was maintained for 1 minute. As a result, the epoxy resin was semi-cured, and adhesive strength was obtained to the extent that it could not be peeled off unless extreme force was applied. After that, the connected FPC and board were taken out and heated at 150°C for 30 minutes, and the epoxy resin was completely cured.
A terminal connection with strong adhesive force was obtained.
「発明の効果」
以上説明したように、本発明による電子部品の端子接続
方法によれば、熱硬化性樹脂と半田とにより基板とプリ
ント配線板を１！着するので、接着強度が向上する。ま
た、半田付けにより端子同士を接続するので、電流を多
く使用する電子部品にも適用することができる。さらに
、熱硬化性樹脂により強固なＷｉ着力が得られるため、
半田によるＩｇｉ着力はそれほど要求されず、予備半田
の量を少なくすることができ、よって隣接する端子間の
ショートを防止して微細なピッチの端子接続にも適用す
ることができる。"Effects of the Invention" As explained above, according to the method for connecting terminals of electronic components according to the present invention, a substrate and a printed wiring board can be bonded together using thermosetting resin and solder. This improves adhesive strength. Furthermore, since the terminals are connected to each other by soldering, it can be applied to electronic components that use a large amount of current. Furthermore, since the thermosetting resin provides strong Wi bonding strength,
The Igi adhesion strength of the solder is not required so much, the amount of preliminary solder can be reduced, and short circuits between adjacent terminals can be prevented and it can be applied to terminal connections with a fine pitch.
第１図（ａ） 、（ｂ） 、（ｃ）は本発明による端子
接続方法を工程順に示す断面図、第２図、第３図、第４
図および第５図は従来の端子接続方法のそれぞれ異なる
例を示す断面図である。
図中、２１は基板、２２は引出し端子、２３はＦＰＣ１
２４は接続端子、２５．２６は予備半田、３０は熱硬化
性樹脂である。
特許出願人 アルプス電気株式会社同代理人
三浦邦夫
同 松井 茂
（ａ）
（ｂ）
（ｃ）
第１図
第３図
第４図
第５図FIGS. 1(a), (b), and (c) are cross-sectional views showing the terminal connection method according to the present invention in the order of steps, and FIGS.
5 and 5 are cross-sectional views showing different examples of conventional terminal connection methods. In the figure, 21 is a board, 22 is a lead-out terminal, and 23 is an FPC1
24 is a connection terminal, 25 and 26 are preliminary solders, and 30 is a thermosetting resin. Patent applicant Alps Electric Co., Ltd. Agent
Kunio Miura Shigeru Matsui (a) (b) (c) Figure 1 Figure 3 Figure 4 Figure 5
Claims (5)
の引出し端子に適合するプリント配線板側の接続端子と
にそれぞれ予備半田を施し、この予備半田の上から上記
基板および／またはプリント配線板の端子形成面の全面
に熱硬化性樹脂を塗布し、上記基板とプリント配線板の
端子同士を突き合わせて半田溶融温度以上にて加熱加圧
し、半田付けにより両端子を導通させると同時に上記熱
硬化性樹脂を少なくとも半硬化させることを特徴とする
電子部品の端子接続方法。(1) Preliminary solder is applied to the lead-out terminals on the board on which electronic components are formed and the connection terminals on the printed wiring board that are compatible with the lead-out terminals, and the board and/or printed wiring Thermosetting resin is applied to the entire surface of the terminal forming surface of the board, and the terminals of the board and printed wiring board are brought together and heated and pressurized at a temperature higher than the solder melting temperature. A method for connecting terminals of electronic components, which comprises at least semi-curing a curable resin.
脂を２０〜２００μｍの厚さで塗布する電子部品の端子
接続方法。(2) The method for connecting terminals of electronic components according to claim 1, wherein the thermosetting resin is applied to a thickness of 20 to 200 μm.
記予備半田を５〜２００μｍの膜厚で施す電子部品の端
子接続方法。(3) The method for connecting terminals of electronic components according to claim 1 or 2, wherein the preliminary solder is applied to a film thickness of 5 to 200 μm.
前記熱硬化性樹脂は、５０〜１００℃で硬化し始める樹
脂である電子部品の端子接続方法。(4) In any one of claims 1 to 3,
The thermosetting resin is a resin that begins to harden at a temperature of 50 to 100°C.
脂は、低温硬化型エポキシ樹脂である電子部品の端子接
続方法。(5) The terminal connection method for electronic components according to claim 4, wherein the thermosetting resin is a low temperature curing epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10414387A JPS63269598A (en) | 1987-04-27 | 1987-04-27 | Connection of terminal of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10414387A JPS63269598A (en) | 1987-04-27 | 1987-04-27 | Connection of terminal of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63269598A true JPS63269598A (en) | 1988-11-07 |
Family
ID=14372869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10414387A Pending JPS63269598A (en) | 1987-04-27 | 1987-04-27 | Connection of terminal of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63269598A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4132995A1 (en) * | 1991-10-04 | 1993-04-08 | Bodenseewerk Geraetetech | METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS ON PCB |
| KR20040043990A (en) * | 2002-11-20 | 2004-05-27 | 삼성전자주식회사 | Method of mounting connector and flexible printed circuit board using the same |
| JPWO2012165321A1 (en) * | 2011-05-27 | 2015-02-23 | コニカミノルタ株式会社 | INK JET HEAD MANUFACTURING METHOD, INK JET HEAD, MANUFACTURING METHOD FOR INTERMEDIATE ELECTRIC STRUCTURE |
-
1987
- 1987-04-27 JP JP10414387A patent/JPS63269598A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4132995A1 (en) * | 1991-10-04 | 1993-04-08 | Bodenseewerk Geraetetech | METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS ON PCB |
| KR20040043990A (en) * | 2002-11-20 | 2004-05-27 | 삼성전자주식회사 | Method of mounting connector and flexible printed circuit board using the same |
| JPWO2012165321A1 (en) * | 2011-05-27 | 2015-02-23 | コニカミノルタ株式会社 | INK JET HEAD MANUFACTURING METHOD, INK JET HEAD, MANUFACTURING METHOD FOR INTERMEDIATE ELECTRIC STRUCTURE |
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