JPH01209791A - Composite circuit substrate and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide excellent durability and to prevent a danger of peeling of a slide pattern by forming by printing the pattern on a mirror-face pate, connecting electronic components, then resin-sealing the connecting side of the component of the plate, and peeling the sealing resin from the plate. CONSTITUTION:After a slide pattern 2 and a circuit pattern 3 are printed on a mirror-face plate 6 and baked, electronic components 4 and a terminal 5 are disposed at predetermined positions, and soldered. The connecting side of the components 4 of the plate 6 is resin-sealed except the terminal 5 by transfer molding metal die, thereby forming a resin package 1. The pattern 2 and the package 1 for sealing the components 4 and the like are peeled off from the plate 6. The peeling method includes coating the plate 6 with a mold release agent before the patterns 2 and 3 are printed, or dipping the package 1 and the plate 6 of hot state immediately after the resin molding is finished in a low temperature liquid tank to quickly cool it.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite circuit board in which a sliding pattern such as a sliding resistor is smoothly formed on the surface of a resin package in which electronic components are embedded, and a method for manufacturing the same.

[Conventional technology]

2. Description of the Related Art In recent years, as devices become smaller and more densely packed, various types of so-called composite circuit boards that combine various different types of components have been developed.

For example, FIG. 16 shows a device in which a circuit board BL on which various electronic components a are mounted is connected to a potentiometer d using a harness C via a coupler n. When integrating the potentiometer d and the potentiometer d, it is conceivable to use a technique such as that disclosed in Japanese Utility Model Publication No. 62-44555, for example.

FIGS. 17 to 19 are partial drawings disclosed in the prior art, in which θ is a storage body, f is a circuit element,
Reference character g represents a connection terminal, h represents a circuit wiring board, 1 represents a cavity for housing a circuit element f, and j represents a positioning claw for crimping and positioning the circuit wiring board in the housing l. When the potentiometer d is integrated, a sliding pattern can be formed on the flat lower surface of the storage body θ or on the flat upper surface t of the circuit wiring board.

[Problem that the invention seeks to solve]

However, when attempting to integrate the circuit board and the potentiometer d using the conventional technique described above, there is a possibility that many problems listed below may occur.

(1) When printing a sliding pattern on the storage body e or circuit wiring board, the sliding pattern protrudes by the thickness of the printing, so when the brush slides on the sliding pattern surface, it cannot be smoothly slid. Operation cannot be performed. In addition, the sliding durability is low,
There is a risk of the sliding pattern peeling off.

(2) Cavity 1 is provided in the storage body θ to accommodate the circuit element f.
In order to accommodate this, it is necessary to control the shape and dimensions of the cavity 1. Also, each time the design of the circuit is changed, the shape of the cavity 1 needs to be changed, so the storage body θ dedicated to each type of circuit has a set width of 1! ? 3.

(3) An extra step is required to tighten the circuit wiring board to the housing e.

(4) Moisture easily enters the interior through the joint m between the circuit wiring board and the storage body θ, and airtightness is not sufficient.

[Means for solving problems]

This invention was developed in view of the many problems mentioned above, and the first object is to obtain a versatile composite circuit board in which electronic components are embedded in a resin package and a sliding pattern is integrated on the surface of the resin package. The second objective is to obtain a composite circuit board in which a sliding pattern is smoothly formed on the surface of a resin package without any unevenness, and the electronic component and the sliding pattern are electrically connected within the resin package. A third objective is to obtain a composite circuit board, and a fourth objective is to obtain a manufacturing method for manufacturing the aforementioned composite circuit board.

As a means for achieving the above object, the present invention forms a smooth sliding pattern on the surface of a resin package without any unevenness, embeds an electronic component therein, and connects the electronic component and the sliding pattern. A first step of providing an electrically connected composite circuit board, printing and forming a sliding pattern on a mirror plate to connect electronic components, and a second step of sealing the connection side of the mirror plate with electronic components with resin. and a third step of peeling the sealing resin together with the sealed electronic components and the sliding pattern from the mirror plate.

[For production]

A composite circuit board comprising the above-mentioned means can be used, for example, when a brush is brought into sliding contact with the sliding pattern, and when the brush is slid manually via an operator or by a mechanical body such as a throttle valve of an automobile, the sliding pattern The electronic components act according to the sliding position of the brush with respect to the moving pattern, and output a predetermined electrical signal to an external device.

[First Embodiment] FIGS. 1 to 6 are drawings showing a first embodiment of the present invention. First, the configuration of the first embodiment will be explained based on FIGS. 1 and 2.

In the drawings, reference numeral 1 denotes a resin package, which is made of, for example, epoxy resin. On the surface 1a of the resin package 1, a sliding pattern 2 and a circuit pattern 3 are smoothly formed on the same plane as the surface 1a, and an electronic component 4 is inside the resin package 1 below the circuit pattern B. It is electrically connected to the sliding pattern 2 via the buried circuit pattern 3. Further, a terminal 5 protrudes from the side surface 1b of the resin package 1, and the terminal 5 is electrically connected to the circuit pattern B inside the resin package 1.

Next, the manufacturing method of the first embodiment will be explained based on FIGS. 3 to 6.

m 1st step 2 In the first step, the sliding pattern 2 and the circuit pattern 6 are printed on the Gyeongbo board 6 as shown in FIG.
Place it in a predetermined position and solder it.

(2) Second step 2 In the second step, as shown in FIG. 5, the connection side of the mirror plate 6 to which the electronic components 4 are connected is sealed with resin using a transfer mold (not shown) or the like, leaving the terminals 5. A package 1 is formed.

(3) Third step: In the third step, as shown in FIG. 6, the resin package 1 in which the sliding pattern 2, electronic components 4, etc. are sealed is peeled off from the mirror plate 6. As a method for peeling off the mirror plate B, one or a combination of the following methods may be used.

First, the first method is a peeling method using a mold release agent, in which the sliding pattern 2 and the circuit pattern 3 are removed in the first step.
This is a method in which a template agent is applied to the mirror plate B prior to printing.

Due to the action of this mold release agent, the resin package 1 is released with a slight force.
can be peeled off from the mirror plate 6. The second method is a peeling method that utilizes the difference in thermal expansion coefficient between the resin package 1 and the mirror plate 6, and in the second step, the resin package 1 which is still hot immediately after resin molding is finished. Another method is to immerse the mirror plate 6 in a low-temperature liquid bath and rapidly cool it. This rapid cooling generates stress on the joint surfaces of the resin package 1 and the mirror plate 6, causing them to separate.

[Second Embodiment] FIGS. 7 to 12 are drawings showing a second embodiment of the present invention. First, the configuration of the second embodiment will be explained based on FIGS. 7 and 8. The second embodiment and the first embodiment described above
The difference from the embodiment is mainly in the connection structure of the electronic component 4.

That is, in the second embodiment, the electronic component 4 is placed on a substrate 7 as shown in FIG. 7, whereas the first embodiment does not have a structure similar to that of the substrate 7.

A circuit pattern 71 is formed on the board 7, and the electronic component 4 is soldered thereto, and a terminal 5-1 for connecting to an external device, a lead 8 for connecting to the sliding pattern 2-1, and a circuit pattern 71 for connecting the board 7 to the lead. A dummy lead 9, which cooperates with the lead 8 to support the lead in a predetermined position, is soldered to the lead 9. and,
The substrate 7 is embedded in a resin package 1-1, and a sliding pattern 2-1 is smoothly formed on its surface 1a-1. In FIGS. 7 and 8, the resin package 1
-1, a brush 10, a pressing member 11, an operator 12
, a bearing 13, a retaining ring 14, and a cover 15 are assembled to form a completed potentiometer 16.

Note that the cover 15 is coupled to the resin package 1-1 by a caulking piece 15a. The rotation of the operator 12 causes the brush 10 to slide on the sliding pattern 2-1, and a signal corresponding to the rotation angle of the operator 12 is applied to the electronic component 4. Furthermore, the electronic component 4 can electrically process the input signal from the sliding pattern 2-1 and output it as an electrical signal such as a pulse signal to an external device via the terminal 5-1.

Next, the manufacturing method of the second embodiment will be explained based on FIGS. 9 to 12.

it) First step: In the first step, the sliding pattern 2-1 is printed on the mirror plate 6-1 as shown in FIG. 9, and after baking, the electronic component 4 and the terminal 5-1 are printed as shown in FIG. 1a. ,
The board 7 to which the IJ-board 8 and dummy leads 9 are fixed is placed in a predetermined position and soldered.

In this step, the terminal 5-1 is formed into a lead frame shape, and is cut after the third step is completed.

(2) 2nd step, 3rd step 2 The 2nd and 3rd steps are the 11th step
Although shown in FIG. 1 and FIG. 12, the steps are the same as those in the first embodiment described above, and the explanation thereof will be omitted.

[Other Examples]

FIGS. 13 to 15 are drawings showing other embodiments of the present invention, and in the embodiment shown in FIGS. In the embodiment shown in FIG. 14, a circuit pattern 3-3 and an electronic component 4 are mounted on the front and back surfaces of the resin package 1-6, and in the embodiment shown in FIG. An example is shown in which electronic components 4 are mounted on the front and back surfaces of the pattern 6-4. By appropriately combining this embodiment with the first and second embodiments described above, high-density packaging becomes possible.

Note that the present invention is not limited to the above-described embodiments; for example, the sliding pattern may be formed of a low-resistance material, or the rotary contact may be formed by forming a low-resistance material into a mosaic shape. .

〔Effect of the invention〕

Since this invention is configured as described above, it produces effects that can be arbitrarily enumerated.

First, in the composite circuit board of claim 1, since the sliding pattern is formed smoothly on the surface of the resin package in which electronic components are embedded, the sliding pattern and the electronic components can be integrated, and the electronic components can be protected from moisture. It can be protected, and there is no need to change the resin package when the circuit design is changed, so it has versatility. In addition, a brush or the like can slide smoothly on the sliding pattern surface, and it has excellent durability and there is no risk of the sliding pattern peeling off.

Furthermore, since the electronic components and the sliding pattern are electrically connected within the resin package, there is no need for a conventional connection harness, which has the effect of reducing the number of components and the noise induced by the connection harness.

Further, the method for manufacturing a composite circuit board according to the second aspect has the effect that a resin package having a smooth sliding pattern formed on the surface and electronic components embedded inside can be efficiently formed through simple steps.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the first embodiment of the invention, and FIG. 2 is a plan view of the first embodiment of the invention.
It is a cross-sectional view taken along arrow AA of the thing shown in the figure. 5 and 6 are drawings showing the manufacturing process of the first embodiment,
3 and 4 are perspective views showing the first step, FIG. 5 is a perspective view showing the second step, and FIG. 6 is a perspective view showing the third step. FIG. 7 is a cross-sectional view of a second embodiment of the invention, and FIG. 8 is a perspective view of the second embodiment. 9 to 12 are drawings showing the manufacturing process of the first embodiment, FIGS. 9 and 10 are perspective views showing the first process, FIG. 11 is a perspective view showing the second process, FIG. 12 is a perspective view showing the third step. 13 to 15 are drawings showing other embodiments of the present invention, in which FIG. 13 is a sectional view of an embodiment with a crossover, and FIG. 14 is a diagram showing electronic components on the front and back surfaces of a resin package. FIG. 15 is a sectional view of an embodiment in which electronic components are mounted on the front and back surfaces of a circuit pattern. FIG. 16 is an exploded perspective view showing a conventional technique. 17 to 19 are cross-sectional views showing the assembly process of the prior art. 1, 1-1.1-2.1-3.1-4・Curved/resin package, 2.2-1...Sliding pattern, 3.
3-1.3-2.3-3.3-4...Circuit pattern, 4...Tune electronic component y5, 5-1...Terminal,
6. ．． 6-1.4.Mirror plate. 7... Board, 8... Lead, 9. Concave.
dummy lead. 10... Brush, 11... Bent expansion member, 12...
...Manipulator. 16... Bearing, 14... Four retaining rings, 15...
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Claims (1)

[Scope of Claims] 1) Consisting of a resin package, a sliding pattern formed smoothly on the surface of the resin package, and an electronic component embedded within the resin package and electrically connected to the sliding pattern. A composite circuit board characterized by: 2) A first step of printing and forming a sliding pattern on a mirror plate and connecting the electronic components, a second step of sealing the connection side of the electronic components of the mirror plate with resin, and the sealed electronic components and A method for manufacturing a composite circuit board, comprising a third step of peeling the sealing resin together with the sliding pattern from the mirror plate.