JPH0256360U - - Google Patents
Info
- Publication number
- JPH0256360U JPH0256360U JP13626788U JP13626788U JPH0256360U JP H0256360 U JPH0256360 U JP H0256360U JP 13626788 U JP13626788 U JP 13626788U JP 13626788 U JP13626788 U JP 13626788U JP H0256360 U JPH0256360 U JP H0256360U
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- terminal
- box
- lead terminal
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は従来の気密端子の斜視図、第２図は従
来の気密端子の断面図、第３図は本考案の一実施
例の断面図、第４図は本考案による一実施例の斜
視図、第５図は本考案による気密端子の製造方法
を説明するための概略図である。
１……絶縁材、１１……側面、１２……底面、
２……気密空間、３……リード端子、４……金属
枠、５……回路部品、７……導電性樹脂のメツキ
部、８……金属メツキの導電部。
Fig. 1 is a perspective view of a conventional airtight terminal, Fig. 2 is a sectional view of a conventional airtight terminal, Fig. 3 is a sectional view of an embodiment of the present invention, and Fig. 4 is a perspective view of an embodiment of the invention. FIG. 5 is a schematic diagram for explaining a method of manufacturing a hermetic terminal according to the present invention. 1...Insulating material, 11...Side surface, 12...Bottom surface,
2... Airtight space, 3... Lead terminal, 4... Metal frame, 5... Circuit component, 7... Conductive resin plating part, 8... Metal plating conductive part.
Claims (1)
に、前記箱状体の上端に金属枠を設け、さらに前
記気密空間内外を貫通するリード端子を形成した
気密端子において、前記リード端子は導電性樹脂
に金属メツキを施したものであることを特徴とす
る気密端子。 In an airtight terminal in which an insulating material is box-shaped to form an airtight space, a metal frame is provided at the upper end of the box-like body, and a lead terminal is formed that penetrates inside and outside the airtight space, the lead terminal is made of conductive resin. An airtight terminal characterized by being plated with metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626788U JPH0256360U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626788U JPH0256360U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256360U true JPH0256360U (en) | 1990-04-24 |
Family
ID=31396615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13626788U Pending JPH0256360U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256360U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622592A (en) * | 1985-06-28 | 1987-01-08 | 株式会社東芝 | Manufacture of smoothing type circuit module |
-
1988
- 1988-10-19 JP JP13626788U patent/JPH0256360U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622592A (en) * | 1985-06-28 | 1987-01-08 | 株式会社東芝 | Manufacture of smoothing type circuit module |
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