CN101615574B - 处理装置 - Google Patents

处理装置 Download PDF

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Publication number
CN101615574B
CN101615574B CN2009101494883A CN200910149488A CN101615574B CN 101615574 B CN101615574 B CN 101615574B CN 2009101494883 A CN2009101494883 A CN 2009101494883A CN 200910149488 A CN200910149488 A CN 200910149488A CN 101615574 B CN101615574 B CN 101615574B
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CN
China
Prior art keywords
processing unit
substrate
rectifying
porous body
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101494883A
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English (en)
Chinese (zh)
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CN101615574A (zh
Inventor
南雅人
佐佐木芳彦
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN101615574A publication Critical patent/CN101615574A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

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  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
CN2009101494883A 2008-06-25 2009-06-25 处理装置 Expired - Fee Related CN101615574B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008166420A JP5067279B2 (ja) 2008-06-25 2008-06-25 処理装置
JP2008-166420 2008-06-25
JP2008166420 2008-06-25

Publications (2)

Publication Number Publication Date
CN101615574A CN101615574A (zh) 2009-12-30
CN101615574B true CN101615574B (zh) 2011-07-13

Family

ID=41495136

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101494883A Expired - Fee Related CN101615574B (zh) 2008-06-25 2009-06-25 处理装置

Country Status (4)

Country Link
JP (1) JP5067279B2 (enExample)
KR (1) KR101092071B1 (enExample)
CN (1) CN101615574B (enExample)
TW (1) TW201001607A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5141520B2 (ja) * 2008-12-02 2013-02-13 東京エレクトロン株式会社 プラズマ処理装置
JP6368282B2 (ja) * 2015-06-29 2018-08-01 クアーズテック株式会社 ウエハボート及びその製造方法
CN107808838A (zh) * 2017-11-13 2018-03-16 武汉华星光电半导体显示技术有限公司 干刻蚀装置及干刻蚀方法
JP7325256B2 (ja) 2019-08-05 2023-08-14 東京エレクトロン株式会社 プラズマ処理装置
JP7665464B2 (ja) * 2021-07-26 2025-04-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7655126B2 (ja) * 2021-07-26 2025-04-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN115682652A (zh) * 2021-10-09 2023-02-03 广东聚华印刷显示技术有限公司 烘烤设备以及烘烤方法
JP7814200B2 (ja) * 2022-03-11 2026-02-16 東京エレクトロン株式会社 成膜装置および成膜方法
JP2025172575A (ja) 2024-05-13 2025-11-26 東京エレクトロン株式会社 プラズマ処理装置及び基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7220497B2 (en) * 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276322A (ja) * 1985-05-31 1986-12-06 Mitsubishi Electric Corp 半導体製造装置
JPH1022263A (ja) * 1996-06-28 1998-01-23 Sony Corp プラズマエッチング装置
JP3251215B2 (ja) * 1996-10-02 2002-01-28 松下電器産業株式会社 電子デバイスの製造装置及び電子デバイスの製造方法
JP2002217172A (ja) * 2001-01-17 2002-08-02 Mitsubishi Electric Corp 製造装置
JP4025030B2 (ja) * 2001-04-17 2007-12-19 東京エレクトロン株式会社 基板の処理装置及び搬送アーム
DE10217806A1 (de) * 2002-04-22 2003-10-30 Aixtron Ag Verfahren und Vorrichtung zum Abscheiden dünner Schichten auf einem Substrat in einer höherverstellbaren Prozesskammer
JP2004289003A (ja) * 2003-03-24 2004-10-14 Seiko Epson Corp 石英リング、プラズマ処理装置および半導体装置の製造方法
JP2005259989A (ja) * 2004-03-11 2005-09-22 Sharp Corp ガス整流部材およびドライプロセス装置
JP2007042744A (ja) * 2005-08-01 2007-02-15 Sharp Corp プラズマ処理装置
JP2009054720A (ja) * 2007-08-24 2009-03-12 Tokyo Electron Ltd 処理装置
JP5256866B2 (ja) * 2008-02-05 2013-08-07 東京エレクトロン株式会社 処理装置
JP5113016B2 (ja) * 2008-04-07 2013-01-09 東京エレクトロン株式会社 基板処理装置
JP5120089B2 (ja) * 2008-06-17 2013-01-16 東京エレクトロン株式会社 処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7220497B2 (en) * 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平1-128518A 1989.05.22

Also Published As

Publication number Publication date
KR20100002173A (ko) 2010-01-06
KR101092071B1 (ko) 2011-12-12
JP5067279B2 (ja) 2012-11-07
TW201001607A (en) 2010-01-01
CN101615574A (zh) 2009-12-30
JP2010010304A (ja) 2010-01-14

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