CN101587849B - 具有通过冲压形成的特征的半导体器件封装 - Google Patents

具有通过冲压形成的特征的半导体器件封装 Download PDF

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CN101587849B
CN101587849B CN200910149767XA CN200910149767A CN101587849B CN 101587849 B CN101587849 B CN 101587849B CN 200910149767X A CN200910149767X A CN 200910149767XA CN 200910149767 A CN200910149767 A CN 200910149767A CN 101587849 B CN101587849 B CN 101587849B
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pin
die
stamping
package
pins
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CN101587849A (zh
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A·C·特苏
M·艾斯拉米
谢方德
杨宏波
周明
J·徐
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GEM Services Inc USA
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GEM Services Inc USA
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US7838339B2 (en) * 2008-04-04 2010-11-23 Gem Services, Inc. Semiconductor device package having features formed by stamping
JP5220714B2 (ja) * 2009-09-18 2013-06-26 セイコーインスツル株式会社 樹脂封止型半導体装置及びその製造方法
DE102010062346A1 (de) * 2010-12-02 2012-06-06 Robert Bosch Gmbh Elektronische Baugruppe sowie Verfahren zu deren Herstellung
EP3536582B1 (en) 2011-04-07 2022-08-10 Mitsubishi Electric Corporation Mold module and electric power steering apparatus
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