JPS52145767U - - Google Patents
Info
- Publication number
- JPS52145767U JPS52145767U JP1976053606U JP5360676U JPS52145767U JP S52145767 U JPS52145767 U JP S52145767U JP 1976053606 U JP1976053606 U JP 1976053606U JP 5360676 U JP5360676 U JP 5360676U JP S52145767 U JPS52145767 U JP S52145767U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976053606U JPS52145767U (enExample) | 1976-04-28 | 1976-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976053606U JPS52145767U (enExample) | 1976-04-28 | 1976-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52145767U true JPS52145767U (enExample) | 1977-11-04 |
Family
ID=28512646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976053606U Pending JPS52145767U (enExample) | 1976-04-28 | 1976-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52145767U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58101443A (ja) * | 1981-12-11 | 1983-06-16 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JP2009267398A (ja) * | 2008-04-04 | 2009-11-12 | Gem Services Inc | スタンピング加工を用いて形成される形状を有する半導体素子パッケージ |
| JP2016058612A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社デンソー | 半導体装置 |
-
1976
- 1976-04-28 JP JP1976053606U patent/JPS52145767U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58101443A (ja) * | 1981-12-11 | 1983-06-16 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JP2009267398A (ja) * | 2008-04-04 | 2009-11-12 | Gem Services Inc | スタンピング加工を用いて形成される形状を有する半導体素子パッケージ |
| JP2016058612A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社デンソー | 半導体装置 |