JP2009267398A - スタンピング加工を用いて形成される形状を有する半導体素子パッケージ - Google Patents

スタンピング加工を用いて形成される形状を有する半導体素子パッケージ Download PDF

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JP2009267398A
JP2009267398A JP2009091309A JP2009091309A JP2009267398A JP 2009267398 A JP2009267398 A JP 2009267398A JP 2009091309 A JP2009091309 A JP 2009091309A JP 2009091309 A JP2009091309 A JP 2009091309A JP 2009267398 A JP2009267398 A JP 2009267398A
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Prior art keywords
die
die pad
pin
semiconductor device
pins
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JP2009091309A
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JP2009267398A5 (enExample
Inventor
Anthony C Tsui
シー．ツイ アンソニー
Mohammad Eslamy
エスラミー モハンマド
Anthony Chia
チア アンソニー
Hongbo Yang
ヤン ホンボ
Zhou Ming
チョウ ミン
Jian Xu
スー ジアン
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GEM Services Inc USA
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GEM Services Inc USA
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Publication of JP2009267398A publication Critical patent/JP2009267398A/ja
Publication of JP2009267398A5 publication Critical patent/JP2009267398A5/ja
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EP2695795A1 (en) 2011-04-07 2014-02-12 Mitsubishi Electric Corporation Molded module and electric power steering apparatus
JP2016058612A (ja) * 2014-09-11 2016-04-21 株式会社デンソー 半導体装置
WO2018088080A1 (ja) * 2016-11-14 2018-05-17 株式会社デンソー 半導体装置およびその製造方法
JP2021015936A (ja) * 2019-07-16 2021-02-12 Tdk株式会社 電子部品パッケージ

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US7838339B2 (en) * 2008-04-04 2010-11-23 Gem Services, Inc. Semiconductor device package having features formed by stamping
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