JP6621681B2 - リードフレーム及びその製造方法、並びに半導体パッケージ - Google Patents
リードフレーム及びその製造方法、並びに半導体パッケージ Download PDFInfo
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- JP6621681B2 JP6621681B2 JP2016028068A JP2016028068A JP6621681B2 JP 6621681 B2 JP6621681 B2 JP 6621681B2 JP 2016028068 A JP2016028068 A JP 2016028068A JP 2016028068 A JP2016028068 A JP 2016028068A JP 6621681 B2 JP6621681 B2 JP 6621681B2
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- 239000004065 semiconductor Substances 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000007747 plating Methods 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 41
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 28
- 229910052709 silver Inorganic materials 0.000 claims description 28
- 239000004332 silver Substances 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 20
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 16
- 239000005751 Copper oxide Substances 0.000 claims description 14
- 229910000431 copper oxide Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000007788 roughening Methods 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 41
- 229960004643 cupric oxide Drugs 0.000 description 15
- 239000000758 substrate Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
Claims (12)
- パッドと、前記パッドの周囲に配置されるリードと、前記パッドの角部に連設し前記パッドを支持するサポートバーと、を備えるリードフレームであって、
当該リードフレームの一方の主面において前記サポートバー及び前記リードは、粗面と当該粗面より平滑である平滑面とをそれぞれ有し、
前記サポートバーは、前記パッドが前記リードよりも他方の主面側に突出するように屈曲する屈曲部を有し、
前記サポートバーは、前記屈曲部及び前記屈曲部の外側に隣接する平坦部に前記平滑面を有し、
前記サポートバーの前記平滑面は、前記リードの前記平滑面よりも前記パッドに近接しているリードフレーム。 - 前記屈曲部は、前記サポートバーの長手方向に平行で且つ前記一方の主面に垂直な断面でみたときに、水平部と該水平部を挟んで傾斜部を有し、
前記一方の主面側において、前記サポートバーは、前記水平部に前記平滑面を有する、請求項1に記載のリードフレーム。 - 前記平滑面は銀めっき膜で構成される、請求項1又は2に記載のリードフレーム。
- 互いに隣接する前記リードの前記平滑面の内縁同士を結ぶ第1仮想枠線よりも、前記サポートバーの前記平滑面の内縁は前記パッド側に延在している、請求項1〜3のいずれか一項に記載のリードフレーム。
- 互いに隣接する前記リードの前記平滑面の内縁同士を結ぶ第1仮想枠線と、隣接する前記リードの前記平滑面の外縁同士を結ぶ第2仮想枠線と、で挟まれる環状領域に対して、前記サポートバーの前記平滑面は前記パッド側にずれている、請求項1〜4のいずれか一項に記載のリードフレーム。
- 前記粗面は酸化銅皮膜で構成される、請求項1〜5のいずれか一項に記載のリードフレーム。
- 前記粗面は粗化めっき皮膜で構成される、請求項1〜5のいずれか一項に記載のリードフレーム。
- 前記一方の主面側において、前記パッドの表面全体は前記粗面で構成される、請求項1〜7のいずれか一項に記載のリードフレーム。
- 請求項1〜8のいずれか一項に記載のリードフレームと、
前記リードフレームの一方の主面側において、前記パッドの表面上に半導体チップと、
前記半導体チップを封止する封止樹脂と、を備えており、
前記リードフレームの他方の主面側において、前記封止樹脂は、前記パッドの表面が露出するように設けられている半導体パッケージ。 - パッドと、前記パッドの周囲に配置されるリードと、前記パッドを支持するサポートバーと、を備えるリードフレームの製造方法であって、
リードフレーム基材の一方の主面側において、前記サポートバー及び前記リードに、粗面と平滑面とをそれぞれ形成する表面処理工程と、
前記サポートバーにおける前記平滑面をストリッパーで押さえながら前記パッドをパンチで押圧して前記サポートバーを屈曲して屈曲部を形成し、前記パッドを前記リードよりも前記リードフレーム基材の他方の主面側に突出させる第1加工工程を有する、リードフレームの製造方法。 - 前記屈曲部よりも前記パッド側の前記平滑面をストリッパーで押さえながら前記パッドをパンチで押圧して屈曲部を拡張し、前記パッドを前記リードよりも前記他方の主面側にさらに突出させる第2加工工程を有する、請求項10に記載のリードフレームの製造方法。
- 前記表面処理工程では、銀めっき処理によって前記平滑面を形成し、銅めっき処理又は粗化めっき処理によって前記粗面を形成する、請求項10又は11に記載のリードフレームの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016028068A JP6621681B2 (ja) | 2016-02-17 | 2016-02-17 | リードフレーム及びその製造方法、並びに半導体パッケージ |
CN201710078784.3A CN107093594B (zh) | 2016-02-17 | 2017-02-14 | 引线框及其制造方法、以及半导体封装 |
MYPI2017700493A MY192355A (en) | 2016-02-17 | 2017-02-15 | Lead frame and manufacturing method thereof, and semiconductor package |
TW106105053A TWI642146B (zh) | 2016-02-17 | 2017-02-16 | 導線架及其製造方法、以及半導體封裝體 |
JP2019209739A JP6905031B2 (ja) | 2016-02-17 | 2019-11-20 | リードフレーム及び半導体パッケージ |
Applications Claiming Priority (1)
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JP2016028068A JP6621681B2 (ja) | 2016-02-17 | 2016-02-17 | リードフレーム及びその製造方法、並びに半導体パッケージ |
Related Child Applications (1)
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JP2019209739A Division JP6905031B2 (ja) | 2016-02-17 | 2019-11-20 | リードフレーム及び半導体パッケージ |
Publications (2)
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JP2017147332A JP2017147332A (ja) | 2017-08-24 |
JP6621681B2 true JP6621681B2 (ja) | 2019-12-18 |
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Country Status (4)
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JP (1) | JP6621681B2 (ja) |
CN (1) | CN107093594B (ja) |
MY (1) | MY192355A (ja) |
TW (1) | TWI642146B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7016677B2 (ja) * | 2017-11-21 | 2022-02-07 | 新光電気工業株式会社 | リードフレーム、半導体装置、リードフレームの製造方法 |
JP6736716B1 (ja) * | 2019-03-22 | 2020-08-05 | 大口マテリアル株式会社 | リードフレーム |
JP6741356B1 (ja) * | 2019-03-22 | 2020-08-19 | 大口マテリアル株式会社 | リードフレーム |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03295262A (ja) * | 1990-04-13 | 1991-12-26 | Mitsubishi Electric Corp | リードフレームおよびその製造方法 |
JP2000243889A (ja) * | 1999-02-22 | 2000-09-08 | Sony Corp | 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム |
JP3314754B2 (ja) * | 1999-04-22 | 2002-08-12 | 松下電器産業株式会社 | 鉛を含まない錫ベース半田皮膜を有する半導体装置およびその製造方法 |
JP3841768B2 (ja) * | 2003-05-22 | 2006-11-01 | 新光電気工業株式会社 | パッケージ部品及び半導体パッケージ |
US7049683B1 (en) * | 2003-07-19 | 2006-05-23 | Ns Electronics Bangkok (1993) Ltd. | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound |
US7838339B2 (en) * | 2008-04-04 | 2010-11-23 | Gem Services, Inc. | Semiconductor device package having features formed by stamping |
KR101113891B1 (ko) * | 2009-10-01 | 2012-02-29 | 삼성테크윈 주식회사 | 리드 프레임 및 리드 프레임 제조 방법 |
JP5669495B2 (ja) * | 2010-09-17 | 2015-02-12 | 株式会社大貫工業所 | 樹脂封止金属部品、それに用いるリードフレーム、及び金属部品の製造方法 |
JP2014007363A (ja) * | 2012-06-27 | 2014-01-16 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
JP2014093452A (ja) * | 2012-11-05 | 2014-05-19 | Hitachi Cable Ltd | 打ち抜き金型、リードフレーム及びリードフレームの製造方法 |
JP6093646B2 (ja) * | 2013-05-14 | 2017-03-08 | 新光電気工業株式会社 | めっき膜の製造方法 |
-
2016
- 2016-02-17 JP JP2016028068A patent/JP6621681B2/ja active Active
-
2017
- 2017-02-14 CN CN201710078784.3A patent/CN107093594B/zh active Active
- 2017-02-15 MY MYPI2017700493A patent/MY192355A/en unknown
- 2017-02-16 TW TW106105053A patent/TWI642146B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI642146B (zh) | 2018-11-21 |
JP2017147332A (ja) | 2017-08-24 |
CN107093594A (zh) | 2017-08-25 |
CN107093594B (zh) | 2019-05-03 |
TW201742197A (zh) | 2017-12-01 |
MY192355A (en) | 2022-08-17 |
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