CN101431867B - 安装结构体 - Google Patents

安装结构体 Download PDF

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Publication number
CN101431867B
CN101431867B CN200810174448XA CN200810174448A CN101431867B CN 101431867 B CN101431867 B CN 101431867B CN 200810174448X A CN200810174448X A CN 200810174448XA CN 200810174448 A CN200810174448 A CN 200810174448A CN 101431867 B CN101431867 B CN 101431867B
Authority
CN
China
Prior art keywords
circuit board
flux
mounting structure
solder
underfill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810174448XA
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English (en)
Chinese (zh)
Other versions
CN101431867A (zh
Inventor
松野行壮
宫川秀规
酒谷茂昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101431867A publication Critical patent/CN101431867A/zh
Application granted granted Critical
Publication of CN101431867B publication Critical patent/CN101431867B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/287—Flow barriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
CN200810174448XA 2007-11-05 2008-11-05 安装结构体 Expired - Fee Related CN101431867B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP287673/2007 2007-11-05
JP2007287673 2007-11-05

Publications (2)

Publication Number Publication Date
CN101431867A CN101431867A (zh) 2009-05-13
CN101431867B true CN101431867B (zh) 2011-03-09

Family

ID=40587895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810174448XA Expired - Fee Related CN101431867B (zh) 2007-11-05 2008-11-05 安装结构体

Country Status (4)

Country Link
US (1) US8138426B2 (https=)
JP (1) JP5153574B2 (https=)
KR (1) KR101138599B1 (https=)
CN (1) CN101431867B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627097B2 (ja) * 2009-10-07 2014-11-19 ルネサスエレクトロニクス株式会社 配線基板
KR20110041179A (ko) * 2009-10-15 2011-04-21 한국전자통신연구원 패키지 구조
US8536672B2 (en) * 2010-03-19 2013-09-17 Xintec, Inc. Image sensor package and fabrication method thereof
JP5807145B2 (ja) * 2010-05-20 2015-11-10 パナソニックＩｐマネジメント株式会社 実装構造体
US20120002386A1 (en) * 2010-07-01 2012-01-05 Nokia Corporation Method and Apparatus for Improving the Reliability of Solder Joints
WO2012147352A1 (ja) * 2011-04-26 2012-11-01 パナソニック株式会社 太陽電池セル、接合構造体、および太陽電池セルの製造方法
US10261370B2 (en) 2011-10-05 2019-04-16 Apple Inc. Displays with minimized border regions having an apertured TFT layer for signal conductors
US9171818B2 (en) * 2011-12-13 2015-10-27 Cyntec Co., Ltd. Package structure and the method to manufacture thereof
JP5516696B2 (ja) * 2012-11-01 2014-06-11 株式会社豊田自動織機 基板
FR2998710B1 (fr) 2012-11-29 2016-02-05 Commissariat Energie Atomique Procede ameliore de realisation d'une structure pour l'assemblage de dispositifs microelectroniques
CN103889149B (zh) * 2012-12-21 2017-07-14 华为终端有限公司 电子装置和栅格阵列模块
JP6182928B2 (ja) * 2013-03-27 2017-08-23 セイコーエプソン株式会社 半導体装置
JP6362066B2 (ja) * 2013-12-17 2018-07-25 キヤノン株式会社 プリント回路板の製造方法及びプリント回路板
US9711474B2 (en) * 2014-09-24 2017-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure with polymeric layer and manufacturing method thereof
JP6468054B2 (ja) * 2015-04-28 2019-02-13 富士通株式会社 プリント基板及びシールド板金固定方法
CN106356353A (zh) * 2015-07-14 2017-01-25 苏州旭创科技有限公司 基板及应用该基板的焊接结构和焊接方法
US10276402B2 (en) * 2016-03-21 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing process thereof
JP2018125436A (ja) * 2017-02-01 2018-08-09 株式会社デンソー 電子装置
JP2018182005A (ja) * 2017-04-10 2018-11-15 株式会社デンソー 電子装置
CN107293482B (zh) * 2017-06-14 2021-03-23 成都海威华芯科技有限公司 一种氮化镓高电子迁移率晶体管栅电极的制作方法
CN109659291A (zh) * 2018-12-24 2019-04-19 烟台艾睿光电科技有限公司 一种焊接环防溢流结构
JP7491209B2 (ja) * 2020-12-22 2024-05-28 株式会社デンソー 電気部品
KR102897594B1 (ko) 2021-06-25 2025-12-10 삼성전자주식회사 반도체 패키지

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH1187899A (ja) 1997-09-09 1999-03-30 Sony Corp 実装基板
US6228466B1 (en) * 1997-04-11 2001-05-08 Ibiden Co. Ltd. Printed wiring board and method for manufacturing the same
JP2006269772A (ja) * 2005-03-24 2006-10-05 Nec Saitama Ltd 半導体パッケージ、配線基板、及び半導体装置
CN1906746A (zh) * 2003-09-26 2007-01-31 倒装晶片技术有限公司 晶片水平壕沟结构
JP2007220940A (ja) * 2006-02-17 2007-08-30 Matsushita Electric Ind Co Ltd プリント基板及び半導体装置

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JP3080512B2 (ja) * 1993-05-21 2000-08-28 株式会社日立製作所 表面実装部品搭載用配線基板及び部品搭載接続方法
JPH07283493A (ja) * 1994-04-14 1995-10-27 Nippon Chemicon Corp フラックス残渣付着防止機能付き回路基板
JPH11145176A (ja) 1997-11-11 1999-05-28 Fujitsu Ltd ハンダバンプの形成方法及び予備ハンダの形成方法
JP3700598B2 (ja) 2001-03-21 2005-09-28 セイコーエプソン株式会社 半導体チップ及び半導体装置、回路基板並びに電子機器
JP3692978B2 (ja) * 2001-07-24 2005-09-07 日立電線株式会社 配線基板の製造方法
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JP3631230B2 (ja) 2002-11-21 2005-03-23 富士通株式会社 予備ハンダの形成方法
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KR100555706B1 (ko) 2003-12-18 2006-03-03 삼성전자주식회사 미세 솔더볼 구현을 위한 ｕｂｍ 및 이를 이용한 플립칩패키지 방법
US7575955B2 (en) * 2004-01-06 2009-08-18 Ismat Corporation Method for making electronic packages
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JP4060806B2 (ja) * 2004-01-09 2008-03-12 日本オプネクスト株式会社 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール
JP2006294835A (ja) 2005-04-11 2006-10-26 Seiko Epson Corp 印刷回路基板及びその作製方法
JP5264585B2 (ja) * 2009-03-24 2013-08-14 パナソニック株式会社 電子部品接合方法および電子部品

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US6228466B1 (en) * 1997-04-11 2001-05-08 Ibiden Co. Ltd. Printed wiring board and method for manufacturing the same
JPH1187899A (ja) 1997-09-09 1999-03-30 Sony Corp 実装基板
CN1906746A (zh) * 2003-09-26 2007-01-31 倒装晶片技术有限公司 晶片水平壕沟结构
JP2006269772A (ja) * 2005-03-24 2006-10-05 Nec Saitama Ltd 半導体パッケージ、配線基板、及び半導体装置
JP2007220940A (ja) * 2006-02-17 2007-08-30 Matsushita Electric Ind Co Ltd プリント基板及び半導体装置

Also Published As

Publication number Publication date
JP5153574B2 (ja) 2013-02-27
KR20090046712A (ko) 2009-05-11
US8138426B2 (en) 2012-03-20
US20090116203A1 (en) 2009-05-07
JP2009135470A (ja) 2009-06-18
CN101431867A (zh) 2009-05-13
KR101138599B1 (ko) 2012-05-10

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