CN101426361A - 贴片机 - Google Patents
贴片机 Download PDFInfo
- Publication number
- CN101426361A CN101426361A CNA2008101287677A CN200810128767A CN101426361A CN 101426361 A CN101426361 A CN 101426361A CN A2008101287677 A CNA2008101287677 A CN A2008101287677A CN 200810128767 A CN200810128767 A CN 200810128767A CN 101426361 A CN101426361 A CN 101426361A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- chip
- printed panel
- chip mounter
- operator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Abstract
一种贴片机具有操作器和底。操作器从电子元件馈送装置上拾起电子元件,将该电子元件传送至印刷板的电子元件贴装表面,并且将该电子元件贴装在电子元件贴装表面上。底位于操作器的上方或者位于相对于操作器的侧向上,用于垂直地或向下地贴装所述印刷板。
Description
技术领域
本发明涉及用于在印刷板上贴装电子元件或芯片的贴片机(chip mounter)。
背景技术
图4为示出传统贴片机的结构以及操作的概略视图。如图4中所示,传统贴片机10在印刷电路板(PCB)或印刷板18上贴装电子元件或芯片12,其中印刷电路板(PCB)或印刷板18水平地位于底16上,底16包括例如传送器。
自电子元件馈送装置或芯片馈送装置14上拾起芯片12,一次拾起一个芯片,在电子元件馈送装置或芯片馈送装置14中,通过操作器,将芯片设置在带的前引端,以及传输芯片,并且将芯片置于印刷板之上的位置中。操作器包括头22和用于水平移动该头22并且同时传送电力和信号的电缆齿链条24。此时,具有如箭头A所示的运动范围的头22在如箭头22a所示的位置拾起芯片12,其后水平运动,并且在如箭头22b所示的位置处将芯片12贴装在印刷板18上。
由于是在印刷板之上的空间中执行这些操作,因此来自贴片机的操作器的工作部件和功率馈送部分的例如灰尘或类似物的异物20落了下来,并且聚积在印刷板的上表面上。
通常,由于电子元件与例如灰尘或类似物的异物20相比尺寸大,因此不存在问题。然而,近来,由于电子元件极度微型化,导致了与异物20相关的冲突。例如,如图5中所示,当大到会引起冲突的程度的例如灰尘或类似物的异物20,介入到例如长度为0.4mm的电子元件12的例如长度为0.1mm的电极12a和印刷板18的例如长度为0.1mm的电极18a之间时,焊接中将会出现缺陷。
发明内容
因此,本发明的目标是提供一种贴片机,其可以抑制例如灰尘或类似物的异物的聚积,以防止焊接中的缺陷。
为了实现该目的,本发明提供了一种贴片机,其包括操作器和底,该操作器用于从电子元件馈送装置上拾起电子元件,以及将电子元件传送至印刷板的电子元件贴装表面,并且将电子元件贴装在电子元件贴装表面上,所述底位于所述操作器之上或者位于相对所述操作器的侧向上用于垂直或向下贴装所述印刷板。
附图说明
参考附图,将在本发明的下列详细描述中解释本发明的其他目的、特征和优点:
图1为示出根据本发明贴片机的第一实施例的视图;
图2为用于解释有关其中芯片贴装在作为根据本发明贴片机的第二实施例的印刷板上的方法的视图;
图3为用于解释有关更详细的第二实施例的视图,图3a是其前视图,图3b是其侧视图;
图4为示出传统贴片机的结构以及操作的概略视图;
图5为用于解释有关在传统贴片机中的焊接中缺陷发生的视图。
具体实施方式
第一实施例
图1为示出根据本发明的贴片机的第一实施例的视图。如图1a中所示,底16设置在操作器的电缆齿链条24的上方,印刷板18贴装在底16的下表面上。通过操作器自芯片馈送装置14上拾起电子元件或芯片12,一次拾起一个电子元件或芯片,其中,芯片12在芯片馈送装置14中设置在带上。然后,通过操作器,芯片被传送并且定位在印刷板18的下表面下面的位置中。此时,具有如箭头A所示的运动范围的头22在如箭头22a所示的位置处拾起芯片12,然后水平运动,并且在如箭头22b所示的位置处将芯片12施加在印刷板18的下表面上。
从贴片机的工作部件上落下的例如灰尘或类似物的异物20或者在底16上方的空间中漂浮的例如灰尘或类似物的异物20不会在印刷板18上聚积,因此可避免焊接中的缺陷。
第二实施例
图2为用于解释有关其中芯片贴装在作为根据本发明贴片机的第二实施例的印刷板上的方法的视图。如图2中所示,印刷板18贴装在垂直设置的底16上,或者底16设置在相对水平轴-90度至90度的角θ范围之内,印刷板18向下贴装在底16上。在这些环境下,印刷板18垂直或向下设置。由于灰尘或类似物落下去,因此灰尘或类似物不会在印刷板18上聚积。此外,在θ等于0度的情况下,第二实施例与第一实施例一致。
图3为用于解释有关更详细的第二实施例的视图,图3a是其前视图,图3b是其侧视图。如图3中所示,贴装在底16上的印刷板18这样安装,从而它的芯片贴装表面是垂直或稍微向下的。贴片机或操作器的工作部件即头22和电缆齿链条24相对于印刷板18位于侧向上或向下方向上,而不位于印刷板的上方。由于工作部件不位于印刷板的上方,因此灰尘或类似物不会在印刷板18上聚积。此外,芯片12位于带12a的前引端上。
由于在这些实施例的情况中,印刷板的芯片贴装表面为垂直或向下的,因此优选的是使用粘结剂,该粘结剂的粘结力强到其在硬化之前能够保持住芯片以防止芯片落下的程度。
由于在这些实施例的情况中,印刷板的芯片贴装表面为垂直或向下的,优选的是粘结剂正好在芯片贴装之前或正好在芯片贴装之后硬化或半硬化。
可以理解,在给定上面对本发明原理的描述后,可以对本发明做出许多改进和变型。应该认为,所有这样的改进和变型是在本发明的精神和范围之内的,如在下面的权利要求中限定的。
Claims (3)
1、一种贴片机,其包括:
操作器,用于从电子元件馈送装置上拾起电子元件,以及将该电子元件传送至印刷板的电子元件贴装表面,并且将该电子元件贴装在电子元件贴装表面上,以及
底,位于所述操作器的上方或者位于相对于所述操作器的侧向上,用于垂直地或向下地贴装所述印刷板。
2、根据权利要求1所述的贴片机,其中,用于电子元件的粘结剂具有在硬化之前保持电子元件不落下的这样程度的粘结力。
3、根据权利要求1所述的贴片机,其中,用于电子元件的粘结剂正好在该芯片贴装之前或正好在该芯片贴装之后硬化或半硬化,以防止该电子元件落下。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284872A JP2009111312A (ja) | 2007-11-01 | 2007-11-01 | チップマウンター |
JP2007284872 | 2007-11-01 | ||
JP2007-284872 | 2007-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101426361A true CN101426361A (zh) | 2009-05-06 |
CN101426361B CN101426361B (zh) | 2011-07-20 |
Family
ID=40299618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810128767.7A Expired - Fee Related CN101426361B (zh) | 2007-11-01 | 2008-04-30 | 贴片机 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20090114349A1 (zh) |
EP (1) | EP2056661B1 (zh) |
JP (1) | JP2009111312A (zh) |
KR (1) | KR101009534B1 (zh) |
CN (1) | CN101426361B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108995866A (zh) * | 2018-09-29 | 2018-12-14 | 歌尔股份有限公司 | 自动贴膜设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10271437B2 (en) * | 2014-08-14 | 2019-04-23 | The United States Of America As Represented By The Secretary Of The Army | Motion-based reconfigurable microelectronics system |
KR20240037755A (ko) | 2022-09-15 | 2024-03-22 | 박은정 | 3d 조절 방식의 부품 마운터 |
KR20240037767A (ko) | 2022-09-15 | 2024-03-22 | 박은정 | 릴투릴 실장기 |
Family Cites Families (24)
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US3711922A (en) * | 1971-03-02 | 1973-01-23 | Amp Inc | Assembling apparatus |
US4915565A (en) * | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
JPS6142994A (ja) * | 1984-08-07 | 1986-03-01 | 松下電器産業株式会社 | チツプ電子部品の実装方法 |
US5135098A (en) * | 1987-01-20 | 1992-08-04 | Ikegami Tsushinki Co., Ltd. | Apparatus for mounting chip device on printed circuit board |
JPH0191500A (ja) * | 1987-01-20 | 1989-04-11 | Ikegami Tsushinki Co Ltd | チップ部品の自動装着装置 |
JPH03101141A (ja) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
US5094381A (en) * | 1990-11-20 | 1992-03-10 | International Business Machines Corporation | System for automated mounting of electronic components to circuit boards |
US5249349A (en) * | 1991-01-24 | 1993-10-05 | Matsushita Electric Works, Ltd. | Parts mounting device |
JP3313224B2 (ja) * | 1994-01-25 | 2002-08-12 | 松下電器産業株式会社 | 電子部品実装装置 |
JP3295529B2 (ja) * | 1994-05-06 | 2002-06-24 | 松下電器産業株式会社 | Ic部品実装方法及び装置 |
US5777886A (en) * | 1994-07-14 | 1998-07-07 | Semiconductor Technologies & Instruments, Inc. | Programmable lead conditioner |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
JP3333417B2 (ja) * | 1997-02-04 | 2002-10-15 | 松下電器産業株式会社 | Icチップの封止方法及び装置 |
DE69832337T2 (de) * | 1997-07-28 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd., Kadoma | Bauteilzuführer und Vorrichtung zur Bestückung |
JP3200401B2 (ja) * | 1997-09-02 | 2001-08-20 | 富士通テン株式会社 | コネクタ実装装置 |
TW460906B (en) * | 1999-03-05 | 2001-10-21 | Siemens Ag | Equipment to insert a substrate with flip-chips |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
JP2001313493A (ja) * | 2000-04-27 | 2001-11-09 | Sony Corp | 電子部品の実装システム |
JP3939119B2 (ja) * | 2001-10-03 | 2007-07-04 | 松下電器産業株式会社 | 部品装着装置 |
JP3739752B2 (ja) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
JP4129837B2 (ja) * | 2003-06-03 | 2008-08-06 | 松下電器産業株式会社 | 実装構造体の製造方法 |
JP2005252118A (ja) * | 2004-03-08 | 2005-09-15 | Juki Corp | 電子部品実装装置 |
JP4680704B2 (ja) * | 2005-07-19 | 2011-05-11 | パナソニック株式会社 | 基板クリーニング装置、及び基板搬送装置 |
JP4595740B2 (ja) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | チップ反転装置およびチップ反転方法ならびにチップ搭載装置 |
-
2007
- 2007-11-01 JP JP2007284872A patent/JP2009111312A/ja active Pending
-
2008
- 2008-04-18 US US12/105,639 patent/US20090114349A1/en not_active Abandoned
- 2008-04-24 EP EP08007954.4A patent/EP2056661B1/en not_active Expired - Fee Related
- 2008-04-30 CN CN200810128767.7A patent/CN101426361B/zh not_active Expired - Fee Related
- 2008-06-13 KR KR1020080055581A patent/KR101009534B1/ko active IP Right Grant
-
2011
- 2011-12-21 US US13/333,145 patent/US8800139B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108995866A (zh) * | 2018-09-29 | 2018-12-14 | 歌尔股份有限公司 | 自动贴膜设备 |
Also Published As
Publication number | Publication date |
---|---|
EP2056661A2 (en) | 2009-05-06 |
EP2056661B1 (en) | 2014-03-26 |
US20090114349A1 (en) | 2009-05-07 |
KR101009534B1 (ko) | 2011-01-19 |
US20120110840A1 (en) | 2012-05-10 |
KR20090044984A (ko) | 2009-05-07 |
US8800139B2 (en) | 2014-08-12 |
EP2056661A3 (en) | 2010-08-04 |
JP2009111312A (ja) | 2009-05-21 |
CN101426361B (zh) | 2011-07-20 |
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