US20090114349A1 - Chip mounter - Google Patents

Chip mounter Download PDF

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Publication number
US20090114349A1
US20090114349A1 US12105639 US10563908A US2009114349A1 US 20090114349 A1 US20090114349 A1 US 20090114349A1 US 12105639 US12105639 US 12105639 US 10563908 A US10563908 A US 10563908A US 2009114349 A1 US2009114349 A1 US 2009114349A1
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US
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Application
Patent type
Prior art keywords
chip
board
printed
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12105639
Inventor
Makoto Takayanagi
Original Assignee
Makoto Takayanagi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate

Abstract

A chip mounter has a manipulator and a bed. The manipulator picks up an electronic component from an electronic component feeding device, transfers the electronic component to the electronic component mounted surface of a printed board, and mounts the electronic component on the electronic component mounted surface. The bed is located above the manipulator or sidewise relative to the manipulator for mounting the printed board vertically or downwardly.

Description

    TECHNICAL FIELD
  • [0001]
    This invention relates to a chip mounter for mounting electronic components or chips on a printed board.
  • BACKGROUND OF INVENTION
  • [0002]
    FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter. As shown in FIG. 4 a conventional chip mounter 10 mounts electronic components or chips 12 on a print-circuit board (PCB) or printed board 18 horizontally located on a bed 16 comprising, for example, a conveyer.
  • [0003]
    The chips 12 are picked up, one at a time, from an electronic component feeding device or chip feeding device 14 in which chips are disposed at the leading end of tapes, transferred, and located in position above a printed board by a manipulator. The manipulator comprises a head 22 and a cable rack chain 24 for moving the head 22 horizontally and at the same time transferring electric power and signals. At that time, the head 22 having a moving range as shown by arrow A picks up the chip 12 at the position as shown by arrow 22 a, thereafter is moved horizontally, and mounts the chip 12 on the printed board 18 at the position as shown by arrow 22 b.
  • [0004]
    Since these operations are carried out in a space above the printed board, the foreign materials 20 such as dust or the like emanated from working parts and power feeding portion of manipulator of chip mounter fall down and are accumulated on the upper surface of the printed board.
  • [0005]
    Conventionally, since the electronic components were large in size, compared with the foreign materials 20 such as dust or the like, there was no problem. However, recently, since the electronic components are miniaturized very much, interference by the foreign materials 20 has been caused. For example, as shown in FIG. 5, when the foreign material 20 such as dust or the like which are large to a degree that interference may be caused are intervened between the electrode 12 a of, for example, 0.1 mm in length of the electronic component 12 of, for example, 0.4 mm in length and the electrode 18 a of, for example, 0.1 mm in length of the printed board 18, the defect in soldering would occur.
  • [0006]
    Therefore, it is an object of the present invention to provide a chip mounter which can inhibit accumulation of the foreign materials such as dust or the like to prevent the defect in soldering.
  • SUMMARY OF INVENTION
  • [0007]
    To accomplish the object, there is provided a chip mounter which comprises a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and a bed located above said manipulator or located sidewise relative to said manipulator for mounting said printed board vertically or downwardly.
  • [0008]
    Other objects, features, and advantages of the present invention will be explained in the following detailed description of the invention having reference to the appended drawings:
  • BRIEF DESCRIPTION OF DRAWINGS
  • [0009]
    FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention,
  • [0010]
    FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention,
  • [0011]
    FIG. 3 is a view for explaining about the second embodiment in more detail, FIG. 3 a is its front view and FIG. 3 b is its side view,
  • [0012]
    FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter, and
  • [0013]
    FIG. 5 is a view for explaining about occurrence of the defect in soldering in a conventional chip mounter.
  • DETAILED DESCRIPTION OF THE INVENTION First Embodiment
  • [0014]
    FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention. As shown in FIG. 1 a bed 16 is disposed above a cable rack chain 24 of manipulator and a printed board 18 is mounted on the lower surface of bed 16. Electronic components or chips 12 are picked up, one at a time, by the manipulator from a chip feeding device 14 in which chips 12 are disposed on tapes. Thereafter by the manipulator the chip is transferred and located in position below the lower surface of printed board 18. At that time, a head 22 having a moving range shown by arrow A picks up the chip 12 at the position shown by arrow 22 a, thereafter moves horizontally, and applies the chip 12 on the lower surface of printed board 18 at the position shown by arrow 22 b.
  • [0015]
    Foreign materials 20 such as dust or the like falling down from the working parts of the chip mounter or foreign materials 20 such as dust or the like floating in the space above the bed 16 are not accumulated on the printed board 18, and therefore the defect in soldering can be avoided.
  • Second Embodiment
  • [0016]
    FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention. As shown in FIG. 2, the printed board 18 is mounted on the bed 16 which is vertically disposed, or the bed 16 is disposed within a range of angle θ of −90 degree to +90 degree relative to horizontal axis and the printed board 18 is mounted downward on the bed 16. Under these circumstances the printed board 18 is disposed vertically or downward. Since the dust or the like falls down, the dust or the like is not accumulated on the printed board 18. Furthermore, in case that θ is equal to 0 degree, the second embodiment corresponds to the first embodiment.
  • [0017]
    FIG. 3 is a view for explaining about the second embodiment in more detail, FIG. 3 a is its front view and FIG. 3 b is its side view. As shown in FIG. 3, the printed board 18 mounted on the bed 16 is installed so that its chip mounted surface is vertically or slightly downward. The working parts of the chip mounter or manipulator, that is, the head 22 and the cable rack chain 24 are located sidewise or downward relative to the printed board 18, not located above the printed board. Since the working parts is not located above the printed board, the dust or the like is not accumulated on the printed board 18. Furthermore, the chip 12 is located on the leading end of tape 12 a.
  • [0018]
    Since in the cases of these embodiments, the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive, force of which is strong to such a degree that it can hold the chip before hardening to prevent falling down of the chip is used.
  • [0019]
    Since in the cases of these embodiments, the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive is hardened or half hardened just before or just after mounting of the chip.
  • [0020]
    It is understood that many modifications and variations may be devised given the above description of the principles of the invention. It is intended that all such modifications and variations be considered as within the spirit and scope of this invention, as it is defined in the following claims.

Claims (3)

  1. 1. A chip mounter which comprises
    a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and
    a bed located above said manipulator or sidewise relative to said manipulator for mounting said printed board vertically or downwardly.
  2. 2. A chip mounter according to claim 1 in which the adhesive for electronic component has an adhesive force to such a degree that the electronic component does not fall down before hardening.
  3. 3. A chip mounter according to claim 1 in which the adhesive for electronic component is hardened or half hardened just before or just after mounting of the chip to prevent falling down of the electronic component.
US12105639 2007-11-01 2008-04-18 Chip mounter Abandoned US20090114349A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007-284872 2007-11-01
JP2007284872A JP2009111312A (en) 2007-11-01 2007-11-01 Chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13333145 US8800139B2 (en) 2007-11-01 2011-12-21 Method of chip mounting onto downwardly-facing mounting surface of printed circuit board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13333145 Division US8800139B2 (en) 2007-11-01 2011-12-21 Method of chip mounting onto downwardly-facing mounting surface of printed circuit board

Publications (1)

Publication Number Publication Date
US20090114349A1 true true US20090114349A1 (en) 2009-05-07

Family

ID=40299618

Family Applications (2)

Application Number Title Priority Date Filing Date
US12105639 Abandoned US20090114349A1 (en) 2007-11-01 2008-04-18 Chip mounter
US13333145 Active US8800139B2 (en) 2007-11-01 2011-12-21 Method of chip mounting onto downwardly-facing mounting surface of printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13333145 Active US8800139B2 (en) 2007-11-01 2011-12-21 Method of chip mounting onto downwardly-facing mounting surface of printed circuit board

Country Status (5)

Country Link
US (2) US20090114349A1 (en)
EP (1) EP2056661B1 (en)
JP (1) JP2009111312A (en)
KR (1) KR101009534B1 (en)
CN (1) CN101426361B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711922A (en) * 1971-03-02 1973-01-23 Amp Inc Assembling apparatus
US4908092A (en) * 1987-01-20 1990-03-13 Ikegami Tsushinki Co., Ltd. Apparatus for mounting chip device on printed circuit board
US5135098A (en) * 1987-01-20 1992-08-04 Ikegami Tsushinki Co., Ltd. Apparatus for mounting chip device on printed circuit board
US5667129A (en) * 1994-05-06 1997-09-16 Matsushita Electric Industrial Co., Ltd. IC component mounting method and apparatus
US20070039686A1 (en) * 2005-08-16 2007-02-22 Matsushita Electric Industrial Co., Ltd. Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method

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US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JPS6142994A (en) * 1984-08-07 1986-03-01 Matsushita Electric Ind Co Ltd Method of mounting chip electronic part
JPH03101141A (en) * 1989-09-13 1991-04-25 Sumitomo Bakelite Co Ltd Manufacture of semiconductor device
US5094381A (en) * 1990-11-20 1992-03-10 International Business Machines Corporation System for automated mounting of electronic components to circuit boards
US5249349A (en) * 1991-01-24 1993-10-05 Matsushita Electric Works, Ltd. Parts mounting device
JP3313224B2 (en) * 1994-01-25 2002-08-12 松下電器産業株式会社 The electronic component mounting apparatus
US5777886A (en) * 1994-07-14 1998-07-07 Semiconductor Technologies & Instruments, Inc. Programmable lead conditioner
US5864944A (en) 1996-01-08 1999-02-02 Matsushita Electric Industrial Co., Ltd. Mounting apparatus of electronic components and mounting methods of the same
JP3333417B2 (en) * 1997-02-04 2002-10-15 松下電器産業株式会社 Ic chip sealing method and apparatus
DE69832337D1 (en) * 1997-07-28 2005-12-22 Matsushita Electric Ind Co Ltd Component feeders, and mounting apparatus
JP3200401B2 (en) * 1997-09-02 2001-08-20 富士通テン株式会社 Connector mounting apparatus
WO2000054564A1 (en) * 1999-03-05 2000-09-14 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP4480840B2 (en) * 2000-03-23 2010-06-16 パナソニック株式会社 Component mounting apparatus, and a component mounting method
JP2001313493A (en) 2000-04-27 2001-11-09 Sony Corp System for mounting electronic component
JP3939119B2 (en) * 2001-10-03 2007-07-04 松下電器産業株式会社 Component mounting apparatus
JP3739752B2 (en) * 2003-02-07 2006-01-25 株式会社 ハリーズ Random period shiftable piece transfer device
JP4129837B2 (en) * 2003-06-03 2008-08-06 松下電器産業株式会社 Method of producing the mounting structure
JP2005252118A (en) 2004-03-08 2005-09-15 Juki Corp Electronic component packaging apparatus
JP4680704B2 (en) 2005-07-19 2011-05-11 パナソニック株式会社 Substrate cleaning apparatus, and the substrate transfer device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711922A (en) * 1971-03-02 1973-01-23 Amp Inc Assembling apparatus
US4908092A (en) * 1987-01-20 1990-03-13 Ikegami Tsushinki Co., Ltd. Apparatus for mounting chip device on printed circuit board
US5135098A (en) * 1987-01-20 1992-08-04 Ikegami Tsushinki Co., Ltd. Apparatus for mounting chip device on printed circuit board
US5667129A (en) * 1994-05-06 1997-09-16 Matsushita Electric Industrial Co., Ltd. IC component mounting method and apparatus
US20070039686A1 (en) * 2005-08-16 2007-02-22 Matsushita Electric Industrial Co., Ltd. Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method

Also Published As

Publication number Publication date Type
US8800139B2 (en) 2014-08-12 grant
EP2056661A3 (en) 2010-08-04 application
EP2056661A2 (en) 2009-05-06 application
JP2009111312A (en) 2009-05-21 application
KR101009534B1 (en) 2011-01-19 grant
US20120110840A1 (en) 2012-05-10 application
CN101426361A (en) 2009-05-06 application
CN101426361B (en) 2011-07-20 grant
KR20090044984A (en) 2009-05-07 application
EP2056661B1 (en) 2014-03-26 grant

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