CN101407417A - 电介质陶瓷组合物及电子部件 - Google Patents

电介质陶瓷组合物及电子部件 Download PDF

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CN101407417A
CN101407417A CNA2008101769256A CN200810176925A CN101407417A CN 101407417 A CN101407417 A CN 101407417A CN A2008101769256 A CNA2008101769256 A CN A2008101769256A CN 200810176925 A CN200810176925 A CN 200810176925A CN 101407417 A CN101407417 A CN 101407417A
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oxide compound
mentioned
ray diffraction
tio
diffraction maximum
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CN101407417B (zh
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关秀明
阿满三四郎
宫内真理
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TDK Corp
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Abstract

本发明为电介质陶瓷组合物和电子部件。本发明涉及一种电介质陶瓷组合物,其含有BaTiO3、BaZrO3、R氧化物(R为稀土类元素),相对于100mol的BaTiO3,BaZrO3的含量为A mol,R氧化物的含量为C mol时,满足40≤A≤65mol、4≤C≤15mol,且同时满足式(1)和(2)。本发明可提供IR寿命长,可适用于额定电压高(例如100V以上)的中高压用途的电介质陶瓷组合物。式(1)...0.0038A-0.147≤B≤0.004A+0.04(B为BaZrO3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比)、式(2)...0.0041C-0.0115≤D≤0.0046C+0.084(D为R氧化物的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比)。

Description

电介质陶瓷组合物及电子部件
技术领域
本发明涉及具有耐还原性的电介质陶瓷组合物、以及电介质层具有该电介质陶瓷组合物的电子部件。更详细地说,本发明涉及适用于额定电压高的(例如100V以上)中高压用途的电介质陶瓷组合物以及电子部件。
背景技术
作为电子部件的一个例子的叠层陶瓷电容器例如是将包含规定的电介质陶瓷组合物的陶瓷生片(グリ一ンシ一ト)与规定图案的内部电极层交替层叠,然后一体化得到生芯片(グリ一ンチツプ),将该生芯片同时烧成而制造的。叠层陶瓷电容器的内部电极层要通过烧成与陶瓷电介质一体化,所以必须选择不与陶瓷电介质反应的材料。因此,作为构成内部电极层的材料,以往不得不使用铂、钯等高价贵金属。
但是近年来,开发了可使用镍、铜等廉价贱金属的电介质陶瓷组合物,实现了大幅度的成本降低。
一方面,随着电子电路的高密度化,对电子部件小型化的要求高,叠层陶瓷电容器正在急速地小型和大容量化。与之相伴随地,叠层陶瓷电容器向着每层电介质层的薄层化方向发展,需要即使薄层化也可维持电容器的可靠性的电介质陶瓷组合物。尤其是在高额定电压(例如100V以上)下使用的中高压用电容器的小型和大容量化,对构成电介质层的电介质陶瓷组合物的可靠性提出了非常高的要求。
对此,例如日本特许第3567759号公报中,作为在高频、高压交流下使用的电容器用电介质陶瓷组合物,公开了下述电介质陶瓷组合物:相对于用组成式ABO3+aR+bM(其中,ABO3是钛酸钡系固溶体,R是La等金属元素的氧化物,M是Mn等金属元素的氧化物)表示的主成分,包含含有B元素和Si元素中的至少一种的烧结助剂作为副成分。并且,在该日本特许3567759号公报中记载,相对于主成分中用ABO3所表示的钛酸钡固溶体1mol,添加0.35mol以下作为主成分添加成分的XZrO3(X是选自Ba、Sr、Ca中的至少一种金属元素)。
另外,日本特许第3139444号公报中,公开了一种耐还原性优良,介电常数提高的电介质陶瓷组合物的制造方法,该方法是将作为起始原料的BaTiO3和BaZrO3进行煅烧(仮焼),使BaTiO3的X射线衍射最大峰强度与BaZrO3的X射线衍射最大峰强度之比为5以下。
但是,日本特许第3567759号公报中,耐压(破坏电压)低,寿命特性(绝缘电阻的加速寿命)不够,因此,可靠性差。尤其是,在叠层陶瓷电容器小型化、大容量化的情况下,上述问题更加明显。为了实现小型化、大容量化,希望提高耐压和寿命特性(绝缘电阻的加速寿命)。还有日本特许第3139444号公报中,对于所制造的叠层陶瓷电容器的寿命特性(绝缘电阻的加速寿命)没有任何公开,没有解决该问题。
发明内容
鉴于这样的情况,本发明的目的是提供一种电介质陶瓷组合物,其能够在还原性气氛中烧成,施加电压时电致伸缩量低,在良好地保持介电常数、DC偏压特性、耐压(破坏电压)以及容量温度特性的同时,可提高绝缘电阻的加速寿命(高温加速寿命);同时本发明提供具有上述电介质陶瓷组合物作为电介质层的电子部件。
为了达成上述目的,本发明人经深入研究发现,当特定成分的X射线衍射最大峰强度与该成分的含量具有特定关系的时候,在良好地保持介电常数、容量温度特性等各特性的同时,可提高高温加速寿命(HALT),从而完成了本发明。
即,本发明的电介质陶瓷组合物具有:
BamTiO2+m(其中m满足0.99≤m≤1.01)
BanZrO2+n(其中n满足0.99≤n≤1.01)
R的氧化物(其中R为选自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb和Lu中的至少一种),其特征在于,
相对于100mol的上述BamTiO2+m,上述BanZrO2+n的含量为A mol、上述R的氧化物的含量为C mol时,上述A以BanZrO2+n计满足40≤A≤65mol,上述C以R2O3计满足4≤C≤15mol,并且同时满足下式(1)和(2):
式(1)...0.0038A-0.147≤B≤0.004A+0.04(其中B为上述BanZrO2+n的X射线衍射最大峰强度与上述BamTiO2+m的X射线衍射最大峰强度之比)
式(2)...0.0041C-0.0115≤D≤0.0046C+0.084(其中,D为上述R的氧化物的X射线衍射最大峰强度与上述BamTiO2+m的X射线衍射最大峰强度之比)。
本发明的电介质陶瓷组合物具有BamTiO2+m、BanZrO2+n和R的氧化物,认为在烧成后的状态,BanZrO2+n和R的氧化物固溶在BamTiO2+m中。当BanZrO2 +n和稀土类元素氧化物全部固溶在BamTiO2+m中时,作为该电介质陶瓷组合物的X射线衍射峰,仅观察到BamTiO2+m的峰。但是,当BanZrO2+n和稀土类元素氧化物超过可固溶于BamTiO2+m的限度时,不仅观察到BamTiO2+m的X射线衍射峰,而且观察到未固溶的BanZrO2+n和稀土类元素氧化物的X射线衍射峰。即,BanZrO2+n的X射线衍射最大峰强度与BamTiO2+m的X射线衍射最大峰强度之比(B)可作为BanZrO2+n在BamTiO2+m中的固溶度的指标,R的氧化物的X射线衍射最大峰强度与BamTiO2+m的X射线衍射最大峰强度之比(D)可作为R的氧化物在BamTiO2+m中的固溶度的指标。本发明中,B和D若在上述范围,即,未固溶的BanZrO2+n和R氧化物以上述范围存在于电介质陶瓷组合物中,能够提高高温加速寿命。
优选进一步具有Mg的氧化物、选自Mn、Cr、Co和Fe中的至少一种的氧化物、选自Si、Li、Al、Ge和B中的至少一种的氧化物,
相对于上述BamTiO2+m 100mol,以各成分的氧化物或复合氧化物计的比率为:
Mg的氧化物:4~12mol
Mn、Cr、Co和Fe的氧化物:0.5~3mol
Si、Li、Al、Ge和B的氧化物:3~9mol。
本发明还提供一种电子部件,其具有电介质层和内部电极层,其中上述电介质层由上述任何一种电介质陶瓷组成物构成。
对本发明的电子部件没有特别限制,例如可列举叠层陶瓷电容器、压电元件、片式电感器、片式压敏电阻、片式热敏电阻、片式电阻、其它表面安装(SMD)的片式电子部件等。
本发明的电介质陶瓷组合物中,在BamTiO2+m中未固溶完的BanZrO2+n和稀土类元素的氧化物以未固溶状态存在,并且峰强度比与BanZrO2+n和稀土类元素氧化物的含量满足特定的关系。其结果是,在保持良好的介电常数、耐压(破坏电压)、容量温度特性等特性的同时,能够提高高温加速寿命。
因此,通过叠层陶瓷电容器等电子部件的电介质层使用本发明的电介质陶瓷组合物,例如即使在将电介质层薄化至20μm左右,在额定电压高(例如100V以上,特别是250V以上)的中高压用途中使用,也能够实现高的可靠性。即,能够提供既满足小型、大容量化需要,又有高可靠性的中高压用途的电子部件。
这样的本发明的电子部件可适用于例如:各种汽车相关用途(ECM(发动机电子计算机模块)、燃料喷射装置、电子控制节流阀、逆变器、转换器、HID灯、混合发动机电池控制单元等)、数码相机用途等方面。
附图说明
以下,结合附图所示的实施方式对本发明进行说明:
图1是本发明的一个实施方式的叠层陶瓷电容器的截面图;
图2是显示BaTiO3、BaZrO3和Gd2O3的X射线衍射最大峰强度的X射线衍射图;
图3是BaZrO3的含量(A),同BaZrO3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(B)的关系图;
图4是Gd2O3的含量(C),同Gd2O3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(D)的关系图。
具体实施方式
叠层陶瓷电容器1
如图1所示,本发明的一个实施方式的叠层陶瓷电容器1具有电介质层2和内部电极层3交替层叠构成的电容器元件本体10。该电容器元件本体10的两端部形成一对外部电极4,这一对外部电极4与在元件本体10内部交替配置的内部电极层3分别导通。对电容器元件本体10的形状没有特别的限制,通常为长方体。对其尺寸也没有特别限制,可根据用途做成适当的尺寸。
内部电极层3以各端面交替露出在电容器元件本体10相对的2端部的表面的方式层叠。并且,在电容器元件本体10的两端部形成一对外部电极4,与交替配置的内部电极3的露出端面连接,构成电容器电路。
电介质层2
电介质层2含有本发明的电介质陶瓷组合物。
本发明的电介质陶瓷组合物至少具有:BamTiO2+m(其中m满足0.99≤m≤1.01)、BanZrO2+n(其中n满足0.99≤n≤1.01)、R的氧化物(其中R为选自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb和Lu中的至少一种)。此时,氧(O)量可以与上式的化学计量组成有稍许偏差。
BamTiO2+m具有强介电性,显示高介电常数。BamTiO2+m中的m满足0.99≤m≤1.01。BamTiO2+m主要作为母材包含在电介质陶瓷组合物中。
相对于100mol的BamTiO2+m,以BanZrO2+n计,BanZrO2+n的含量(A)为40~65mol,优选为40~55mol,更优选为40~50mol。并且BanZrO2+n中的n满足0.99≤n≤1.01。通过以上述范围添加BanZrO2+n,可谋求提高容量温度特性和耐压。如果BanZrO2+n的含量过少,不仅容量温度特性和耐压降低,而且寿命特性也有恶化的倾向。另一方面,如果含量过多,则介电常数有降低的倾向。
R的氧化物的含量(C),相对于100mol的BamTiO2+m,以R2O3计,为4~15mol,优选为6~12mol,更优选为7~11mol。R的氧化物主要具有抑制BamTiO2 +m的强介电性的效果。如果R的氧化物的含量过少,则耐压会降低,或施加电压时的电致伸缩量有增大的倾向。另一方面,如果含量过多,则介电常数有下降的倾向。要说明的是,构成上述R的氧化物的R元素是选自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb和Lu中的至少一种,这些元素中,最优选Gd。
进一步地,本发明中,同时控制了BamTiO2+m和BanZrO2+n的X射线衍射最大峰强度之比、和BamTiO2+m和R的氧化物的X射线衍射最大峰强度之比,使它们在特定范围。具体的说,设BanZrO2+n的X射线衍射最大峰强度与BamTiO2 +m的X射线衍射最大峰强度之比为B,设R的氧化物的X射线衍射最大峰强度与BamTiO2+m的X射线衍射最大峰强度之比为D时,满足下式(1)和(2):
式(1)...0.0038A-0.147≤B≤0.004A+0.04
式(2)...0.0041C-0.0115≤D≤0.0046C+0.084
B是BanZRO2+n在BamTiO2+m中的固溶度指标,未固溶的BanZrO2+n越多,B越大。D是R2O3在BamTiO2+m中的固溶度指标,未固溶的R2O3越多,D越大。
本发明中,B和D必定显示大于0的值。即表示,本发明的电介质陶瓷组合物中,存在超过可固溶于BamTiO2+m中的限度的BanZrO2+n和R氧化物。这样,电介质陶瓷组合物中存在固溶了BanZrO2+n和R氧化物的BamTiO2+m和未固溶的BanZrO2+n和R氧化物,由此不仅能够保持良好的各特性(介电常数、容量温度特性等),又能够提高高温加速寿命。可以认为其原因是BanZrO2+n和R氧化物具有比BamTiO2+m、Mg的氧化物、选自Mn、Cr、Co和Fe中的至少一种的氧化物、选自Si、Li、Al、Ge和B中的至少一种的氧化物、以及这些氧化物的化合物或者复合氧化物优异的高温加速寿命。
另外,后面将会述及,上述的峰强度比(B)和(D)可通过改变原料的煅烧条件、烧成条件进行控制。
本实施方式的电介质陶瓷组合物优选还具有Mg的氧化物。Mg的氧化物的含量,相对于100mol的BamTiO2+m,以MgO计,优选为4~12mol,更优选为6~10mol。Mg的氧化物具有抑制BamTiO2+m的强介电性的效果。Mg的氧化物若含量过少,不仅容量温度特性、耐压降低,并且施加电压时的电致伸缩量有增大的倾向。另一方面,若含量过多,不仅介电常数下降,并且寿命特性和耐压有恶化的倾向。
本实施方式的电介质陶瓷组合物更优选地还具有选自Mn、Cr、Co和Fe中的至少一种的氧化物。它们的含量相对于100mol的BamTiO2+m,以MnO、Cr2O3、Co3O4或者Fe2O3计,优选为0.5~3mol,更优选为0.5~2.5mol。这些氧化物若含量过少,则寿命特性有恶化的倾向。另一方面,若含量过多,则介电常数下降,同时容量温度特性有恶化的倾向。
本实施方式的电介质陶瓷组合物中更优选地还含有选自Si、Li、Al、Ge和B中的至少一种的氧化物。它们的含量相对于100mol的BamTiO2+m,以SiO2、Li2O、Al2O3、GeO2或者B2O3计,优选为3~9mol,更优选为3~5mol。这些氧化物若含量过少,介电常数下降,同时寿命特性有恶化的倾向。另一方面,若含量过多,容量温度特性有恶化的倾向。要说明的是,上述各氧化物中,从特性改善效果大的角度考虑,优选使用Si的氧化物。
本说明书中,以化学计量组成表示构成各成分的各氧化物或者复合氧化物,但各氧化物或者复合氧化物的氧化状态可以与化学计量组成存在偏差。各成分的上述比率,可以由构成各成分的氧化物或者复合氧化物中所含的金属量换算为上述化学计量组成的氧化物或复合氧化物而求得。
对电介质层2的厚度没有特别的限制,可根据叠层陶瓷电容器1的用途适当确定。
内部电极层3
对内部电极层3中含有的导电材料没有特别的限制,但因为电介质层2的构成材料具有耐还原性,可以使用比较便宜的贱金属。用作导电材料的贱金属,优选Ni或Ni合金。Ni合金优选选自Mn、Cr、Co和Al中的一种以上元素与Ni的合金。合金中的Ni含量优选为95重量%以上。Ni或者Ni合金中可以含有0.1重量%左右以下的P等各种微量成分。另外,内部电极层3可以使用市售的电极用糊料形成。内部电极层3的厚度可根据用途等适当决定。
外部电极4
对外部电极4中含有的导电材料没有特别的限制,在本发明中,可以使用便宜的Ni、Cu或者它们的合金。外部电极4的厚度可根据用途等来适当决定。
叠层陶瓷电容器1的制造方法
本实施方式中的叠层陶瓷电容器1与以往的叠层陶瓷电容器一样,通过使用糊料的通常的印刷法、薄片法(シ一ト法)制造生芯片,将其烧成后,印刷或转印外部电极并进行烧成而制造。以下对制造方法具体说明。
首先,准备电介质层用糊料中所含的电介质原料(电介质陶瓷组合物粉末),将其涂料化(塗料化),制成电介质层用糊料。电介质层用糊料可以是电介质原料与有机连接料混炼而成的有机系涂料,也可以是水系涂料。
作为电介质原料,可以使用上述各成分的氧化物、它们的混合物、复合氧化物,另外,也可以适当选择通过烧成成为上述氧化物、复合氧化物的各种化合物,例如碳酸盐、草酸盐、硝酸盐、氢氧化物、有机金属化合物等,混合使用。举例说明,作为BamTiO2+m的原料,可以使用BamTiO2+m,也可以使用BaCO3和TiO2。作为BanZrO2+n的原料,可以使用BanZrO2+n,也可以使用BaCO3和ZrO2。确定电介质原料中各化合物的含量,使得烧成后达到上述电介质陶瓷组合物的组成即可。涂料化之前的状态,电介质原料的平均粒径一般是0.1~1μm左右。
本实施方式中,作为上述各成分的原料,对于BamTiO2+m以外的原料中至少一部分,可以直接使用各氧化物或者复合氧化物、通过烧成成为各氧化物或复合氧化物的化合物;或者也可以预先进行煅烧,使用焙烧粉。或者,对于BanZrO2 +n和R的氧化物以外的原料中的一部分,与BamTiO2+m一起煅烧也可以。但是,如果将BamTiO2+m和、BanZrO2+n和/或R的氧化物煅烧,难以得到本发明的效果,因此不优选以这样的组合进行煅烧。另外,煅烧时优选在800~1100℃进行。
BamTiO2+m的原料的平均粒径优选为0.2~1μm。以BanZrO2+n为首的其它成分的原料,平均粒径优选为0.2~1μm。又,将这些原料预先煅烧制成焙烧粉的情况下,它们的平均粒径也优选在上述范围。
有机连接料(ビヒクル)是将粘合剂溶解在有机溶剂中形成的。对有机连接料所用的粘合剂没有特别的限制,可以由乙基纤维素、聚乙烯醇缩丁醛等通常的各种粘合剂适当选择。对所用的有机溶剂也没有特别的限制,根据印刷法、薄片法等所利用的方法,可以适当选择萜品醇、丁基卡必醇、丙酮、甲苯等各种有机溶剂。
将电介质层用糊料制成水系涂料的情况下,可以将水溶性的粘合剂、分散剂等溶解在水中,将得到的水系连接料与电介质原料混炼。对水系连接料所用的水溶性粘合剂没有特别的限制,例如可使用聚乙烯醇、纤维素、水溶性丙烯酸类树脂等。
内部电极层用糊料是将包含上述各种导电性金属、合金的导电材料、或者烧成后成为上述导电材料的各种氧化物、有机金属氧化物、树脂酸盐(レジネ一ト)等与上述的有机连接料混炼而调制。
外部电极用糊料与上述内部电极层用糊料同样地调制即可。
对上述各糊料中的有机连接料的含量没有特别的限制,通常的含量例如粘合剂为1~5重量%左右,溶剂为10~50重量%左右即可。各糊料中可以根据需要含有选自各种分散剂、增塑剂、电介质、绝缘体等中的添加物。它们的总含量优选为10重量%以下。
采用印刷法时,将电介质层用糊料和内部电极层用糊料印刷、层叠在PET等基板上,切成规定的形状后,从基板上剥离制成生芯片。
采用薄片法时,使用电介质层用糊料形成生片,在其上印刷内部电极层用糊料,然后将它们层叠制成生芯片。
烧成前对生芯片进行脱粘合剂处理。脱粘合剂的条件为:升温速度优选为5~300℃/小时,保持温度优选180~400℃,温度保持时间优选0.5~24小时。烧成气氛可以为空气或者还原性气氛。
生芯片烧成时的气氛可根据内部电极层用糊料中的导电材料的种类适当确定,使用Ni、Ni合金等贱金属作为导电材料时,烧成气氛中的氧分压优选为10-14~10-10MPa。如果氧分压低于上述范围,内部电极层的导电材料会发生异常烧结,有时会断裂(途切れ)。如果氧分压高于上述范围,内部电极层有氧化的倾向。
烧成时的保持温度优选为1000~1400℃,更优选为1100~1360℃。保持温度如果低于上述范围,致密化不充分,如果高于上述范围,容易发生内部电极层异常烧结而导致的电极断裂、内部电极层构成材料的扩散导致的容量温度特性变坏、电介质陶瓷组合物的还原。
除此之外的烧成条件有:升温速度优选为50~500℃/小时,更优选为200~300℃/小时,温度保持时间优选为0.5~8小时,更优选为1~3小时,冷却速度优选为50~500℃/小时,更优选为200~300℃/小时。烧成气氛优选还原性气氛,例如可以将N2和H2的混合气体加湿用作气氛气体。本实施方式中,通过控制烧成时的保持温度、保持时间等烧成条件,可以控制BanZrO2+n和R氧化物在BamTiO2+m中的固溶。例如,烧成温度低的情况下,由于难以固溶,X射线衍射图中,出现未固溶于BamTiO2+m中的原料的峰,峰强度比(B)和(D)有变大的倾向。
在还原性气氛中烧成后,优选对电容器元件本体进行退火。退火是使电介质层再氧化的处理,由此可使IR寿命显著延长,可靠性提高。
退火氛围中的氧分压优选为10-9~10-5MPa,氧分压如果低于上述范围,电介质层难以再氧化,如果高于上述范围,内部电极层有被氧化的倾向。
退火时的保持温度优选为1100℃以下,特别优选为500~1100℃。保持温度如果低于上述范围,由于电介质层的氧化不充分,因此IR低,且高温加速寿命容易变短。另一方面,保持温度高于上述范围,不仅内部电极层发生氧化容量降低,而且内部电极层和电介质本身反应,容易发生容量温度特性恶化、IR降低、高温加速寿命的降低。退火可以仅由升温过程和降温过程构成。即,温度保持时间可以为0。这种情况下,保持温度与最高温度意义相同。
除此之外的退火条件有:温度保持时间优选为0~20小时,更优选为2~10小时,冷却速度优选为50~500℃/小时,更优选为100~300℃/小时。退火的氛围气体例如优选使用加湿的N2气等。
上述脱粘合剂处理、烧成和退火中,可以使用例如加湿器等给N2、混合气体等加湿。此时,水温优选为5~75℃左右。脱粘合剂处理、烧成和退火可以连续进行,也可以独立进行。
按照上述方法得到的电容器元件本体,通过滚筒抛光或喷砂实施端面研磨,涂布外部电极用糊料并进行烧成,形成外部电极4。然后,根据需要,在外部电极4表面通过镀敷形成被覆层。
如此制造的叠层陶瓷电容器可以通过软钎焊安装在印刷基板上,用于各种电子设备等中。
以上对本发明的实施方式进行了说明,但本发明并不限于上述的实施方式,可在不脱离于本发明要意范围内做出各种改变。
例如,上述的实施方式中,本发明的电子部件是以叠层陶瓷电容器为例,但是本发明的电子部件并不仅限于叠层陶瓷电容器,凡是含有上述构成的电介质层的电子部件均可。
实施例
以下根据详细的实施例对本发明进行说明,但本发明不限于这些实施例。
实施例1
首先,准备BaTiO3(m=1.000)、BaZrO3(n=1.000)、MgCO3、Gd2O3、MnO和SiO2。电介质原料使用以下两种方法制备。第一种方法:首先将BaZrO3、MgCO3、Gd2O3、MnO以及SiO2用球磨机混合,将得到的混合粉在1000℃预先煅烧,制成平均粒径为0.2μm的焙烧粉。接着,向得到的焙烧粉中加入BaTiO3,用球磨机湿法粉碎15小时,干燥,得到平均粒径为0.15μm的电介质原料。
第二种方法:预先将BaTiO3和BaZrO3用球磨机混合,将得到的混合粉在1000℃下预先煅烧,制成平均粒径为0.2μm的焙烧粉。这种焙烧粉中,BaZrO3完全固溶于BaTiO3。然后向所得的焙烧粉中加入MgCO3、Gd2O3、MnO以及SiO2,用球磨机湿法粉碎15小时,干燥,得到平均粒径为0.15μm的电介质原料。
不论使用哪种方法,烧成后,MgCO3均以MgO的形式包含于电介质陶瓷组合物中。
表1示出了相对于100mol的BaTiO3,BaZrO3成分的添加量(A)。相对于100mol的BaTiO3,Gd2O3成分的添加量(C)为10mol。编号为2和7的样品使用通过上述第二种方法制备的电介质原料。即,BaZrO3完全固溶于BaTiO3。编号为1、3~6、8~18的样品,使用通过上述第一种方法制备的电解质原料。表1所示的各成分的添加量为相对于100mol的BaTiO3,换算为复合氧化物或各氧化物的添加量。
另外,相对于100mol的BaTiO3,MgCO3成分的添加量为8mol,MnO成分的添加量为1.5mol,SiO2成分的添加量为4.5mol。
接着,将所得的电介质材料100重量份,聚乙烯醇缩丁醛树脂10重量份,作为增塑剂的邻苯二甲酸二辛酯(DOP)5重量份,作为溶剂的乙醇100重量份用球磨机混合,制得糊料,得到电介质层用糊料。
另外,将Ni颗粒44.6重量份、萜品醇52重量份、乙基纤维素3重量份、苯并三唑0.4重量份用三辊磨混炼,浆化而得到内部电极层用糊料。
然后,使用上述制作的电介质层用糊料,在PET膜上形成生片使干燥后厚度为30μm。接着使用内部电极层用糊料,在其上以规定图案印刷电极层,然后将薄片从PET膜上剥离,制成具有电极层的生片。接着将数枚具有电极层的生片层叠,通过加压粘接形成生叠层体。将生叠层体切成规定的尺寸,制得生芯片。
接下来对得到的生芯片按照下述条件进行脱粘合剂处理,烧成和退火,制得叠层陶瓷烧成体。
脱粘合剂处理条件是:升温速度25℃/小时,保持温度260℃,温度保持时间8小时,气氛是空气中。
烧成条件:升温速度200℃/小时,保持温度1220~1380℃,温度保持时间2小时,冷却速度200℃/小时,气氛气体是加湿的N2+H2混合气体(氧分压为10-12MPa)。
退火条件:升温速度200℃/小时,保持温度1000~1100℃,温度保持时间2小时,冷却速度200℃/小时,气氛气体是加湿的N2气(氧分压为7.5×10-8~2.3×10-7MPa)。另外,烧成和退火时使用加湿器对气氛气体进行加湿。
接着通过喷砂研磨得到的叠层陶瓷烧成体的端面,涂布In-Ga作为外部电极,制得如图1所示的叠层陶瓷电容器样品。在本实施例中,如表1所示,制作了具有由组成不同的电介质陶瓷组合物构成的电介质层的多个电容器样品(样品编号1~19)。得到的电容器样品尺寸为3.2mm×1.6mm×3.2mm,电介质层厚度为20μm,内部电极层厚度为1.5μm,内部电极层中所夹的电介质层数为10。
对得到的叠层陶瓷电容器的电介质层进行下示的X射线衍射。另外,按照下述方法测定得到的各电容器样品的介电常数(εs)、容量温度特性(TC)、DC偏压特性、高温加速寿命(HALT)、破坏电压(耐压)以及施加电压时的电致伸缩量。
X射线衍射
对于X射线衍射,X射线源使用Cu-Kα射线,测定条件为:电压50kV,电流300mA,在2θ=10°~80°的范围,扫描速度1/16deg/min,累积时间1sec。所得的X射线衍射图中,鉴定表示BaTiO3、BaZrO3以及Gd2O3的最大强度的峰,求得BaZrO3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(B),以及Gd2O3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(D)。例如,图2所示在2θ=27°~35°范围的X射线衍射图中,设BaTiO3的X射线衍射最大峰强度为1。这时,可求得BaZrO3的X射线衍射最大峰强度为0.08,Gd2O3的X射线衍射最大峰强度为0.03。即,B为0.08,D为0.03。所得的峰强度比的结果如表1所示。另外,表示BaZrO3的含量(A)与峰强度比(B)的关系的图如图3所示。
介电常数εs
对电容器样品在基准温度25℃下,使用数字LCR仪(YHP公司制4284A)输入频率1kHz、输入信号水平(测定电压)1Vrms的信号,测定静电容量C。然后根据电介质层厚度、有效电极面积和测得的静电容量C计算介电常数εs(无单位)。介电常数越高越好,本实施例中,250以上为良好。结果如表1所示。
容量温度特性(TC)
对电容器样品在125℃下使用数字LCR仪(YHP公司制4284A),在频率1kHz、输入信号水平(测定电压)1Vrms的条件下测定静电容量,计算相对于基准温度25℃下的静电容量的变化率。本实施例中,±15%以内为良好。结果如表1所示。
DC偏压特性
电容器样品在25℃、,10V/μm的电场中,保持施加直流电压的状态,计算容量变化率。在本实施例中,-10%以上为良好。结果如表1所示。
高温加速寿命(HALT)
电容器样品在200℃、40V/μm的电场中,保持施加直流电压的状态,测定寿命时间,从而评价高温加速寿命(HALT)。本实施例中所定义的寿命是从施加开始到绝缘电阻值数字下降一位为止的时间。这里的高温加速寿命对10个电容器样品进行。本实施例中,20小时以上为良好。结果如表1所示。
破坏电压(耐压)
电容器样品在25℃施加直流电压,升压速度为100V/sec,以通过10mA电流时的电压值与电介质层厚度之比(单位:V/μm)为破坏电压,通过对破坏电压的测定,评价电容器样品的耐压。本实施例中,破坏电压50V/μm以上为良好。结果如表1所示。
施加电压时的电致伸缩量
首先,将电容器样品通过软钎焊固定在印有规定图案电极的玻璃环氧基板上。然后对固定于基板上的电容器样品施加AC为10Vrms/μm、频率为3kHz的电压,测定施加电压时电容器样品表面的振动幅度,将其作为电致伸缩量。电容器样品表面振动幅度的测定使用激光多普勒振动仪。在本实施例中,电致伸缩量是用10个电容器样品测得的平均值。电致伸缩量越低越好,本实施例中,不到10ppm为良好。结果如表1所示。
表1
Figure A20081017692500161
·样品编号中带“*”的样品是本发明范围外的样品。
·0.0038A-0.147≤B≤0.004A+0.04...式(1)
·0.0041C-0.0115≤D≤0.0046C+0.084...式(2)
·相对于100mol的BaTiO3,MgO为8mol,MnO为1.5mol,SiO2为4.5mol
根据表1和图3可以确认,当BaZrO3的含量(A)以及Gd2O3的含量(C)在本发明规定的范围,BaZrO3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(B)、Gd2O3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(D)同时满足式(1)以及式(2)的时候,介电常数(εs)、容量温度特性(TC)、DC偏压特性、破坏电压以及电致伸缩量都保持良好,同时可提高高温加速寿命(HALT)。
与此相对,上述(A)~(D)的任一个不在本发明范围的情况下,将导致高温加速寿命的恶化。例如,2号和7号样品,由于BaZrO3在BaTiO3中完全固溶,不存在未固溶的BaZrO3,B为0,可以确认高温加速寿命恶化。要说明的是,图3中用斜线表示本发明的范围,黑色圆点是表1的实施例,白色三角是比较例。
实施例2
电介质原料的组成除了Gd2O3的含量(C)如表2所示之外,其它与10号样品相同。第20号、22~25号、27~37号样品使用的是通过上述第一种方法制备的电介质原料。
第21号和26号样品,使用的是通过下述第三种方法制备的电介质原料。第三种方法是:预先将BaTiO3和Gd2O3用球磨机混合,将得到的混合粉在1000℃预先煅烧,制备平均粒径为0.2μm的焙烧粉。即,使Gd2O3完全固溶于BaTiO3。接着在所得焙烧粉中加入BaZrO3、MgCO3、MnO以及SiO2,用球磨机湿法粉碎15小时,干燥,得到电介质原料。
由所得的电介质原料与实施例1同样地制造叠层陶瓷电容器,并与实施例1同样地进行评价。结果如表2所示。另外,Gd2O3的含量(C)和峰强度比(D)的关系图如图4所示。
表2
Figure A20081017692500181
·样品编号中带“*”的样品是本发明范围外的样品。
·0.0038A-0.147≤B≤0.004A+0.04...式(1)
·0.0041C-0.0115≤D≤0.0046C+0.084...式(2)
·相对于100mol的BaTiO3,MgO为8mol,MnO为1.5mol,SiO2为4.5mol
根据表2和图4可以确认,当BaZrO3的含量(A)以及Gd2O3的含量(C)在本发明规定的范围,BaZrO3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(B)、Gd2O3的X射线衍射最大峰强度与BaTiO3的X射线衍射最大峰强度之比(D)同时满足式(1)以及式(2)的时候,介电常数(εs)、容量温度特性(TC)、直流偏压特性、破坏电压以及电致伸缩量都保持良好,并且可提高高温加速寿命(HALT)。
与此相对,上述(A)~(D)的任何一个在本发明范围外的情况下,将导致高温加速寿命的恶化。与实施例1一样,21号和26号样品,D的值为0,可以看出高温加速寿命恶化。另外,图4中用斜线表示本发明的范围,黑色圆点是表2的实施例,白色三角是比较例。

Claims (3)

1、一种电介质陶瓷组合物,其含有BamTiO2+m(其中m满足0.99≤m≤1.01)、BanZrO2+n(其中n满足0.99≤n≤1.01)、R的氧化物(其中R为选自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb和Lu中的至少一种),
其特征在于:相对于上述BamTiO2+m100mol,上述BanZrO2+n的含量为A mol、上述R的氧化物的含量为C mol时,上述A以BanZrO2+n计,满足40≤A≤65mol,上述C以R2O3计,满足4≤C≤15mol,并且同时满足下式(1)和(2):
式(1)...0.0038A-0.147≤B≤0.004A+0.04(其中,B为上述BanZrO2+n的X射线衍射最大峰强度与上述BamTiO2+m的X射线衍射最大峰强度之比)
式(2)...0.0041C-0.0115≤D≤0.0046C+0.084(其中,D为上述R的氧化物的X射线衍射最大峰强度与上述BamTiO2+m的X射线衍射最大峰强度之比)。
2、根据权利要求1所述的电介质陶瓷组合物,其还含有Mg的氧化物、选自Mn、Cr、Co和Fe中的至少一种的氧化物、选自Si、Li、Al、Ge和B中的至少一种的氧化物,
相对于上述BamTiO2+m100mol,以各成分的氧化物或者复合氧化物计的比率为:
Mg的氧化物:4~12mol
Mn、Cr、Co和Fe的氧化物:0.5~3mol
Si、Li、Al、Ge和B的氧化物:3~9mol。
3、电子部件,其具有:包含权利要求1或2所述的电介质陶瓷组合物的电介质层和内部电极层。
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