CN101371346A - 压接装置及安装方法 - Google Patents
压接装置及安装方法 Download PDFInfo
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- CN101371346A CN101371346A CNA2007800023961A CN200780002396A CN101371346A CN 101371346 A CN101371346 A CN 101371346A CN A2007800023961 A CNA2007800023961 A CN A2007800023961A CN 200780002396 A CN200780002396 A CN 200780002396A CN 101371346 A CN101371346 A CN 101371346A
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- 238000000034 method Methods 0.000 title claims description 17
- 230000006835 compression Effects 0.000 claims abstract description 90
- 238000007906 compression Methods 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 229920001971 elastomer Polymers 0.000 claims description 86
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 54
- 238000002788 crimping Methods 0.000 claims description 52
- 238000009434 installation Methods 0.000 claims description 10
- 235000019589 hardness Nutrition 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 3
- 239000013536 elastomeric material Substances 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- 235000019994 cava Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
- B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
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- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
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- H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
本发明的压接装置(1)具有阻挡部件(24),将按压头(20)压接按压在压接对象物(10)上时,压接部(22)的周围由阻挡部件(24)包围。由此,即使因按压而使压接部(22)的表面膨胀,也由阻挡部件(24)阻挡其膨胀部分,压接部(22)的表面不在水平方向上扩张。若压接部(22)不在水平方向上扩张,则不对压接对象物(10)施加在水平方向上移动的力,在竖直方向上按压电气部件(16、18)而将其与基板(11)的端子(12)连接,因此得到连接可靠性高的电气装置(10a)。
Description
技术领域
本发明涉及将电气部件安装在基板上的压接装置和其安装方法。
背景技术
以往,在将半导体元件这样的电气部件连接在基板上的安装工序中,采用一边用按压头将电气部件按压在基板上一边进行加热的压接装置。
图18(a)的附图标记101示出了现有技术的压接装置,压接装置101具有基座126和按压头120。
按压头120有将按压橡胶嵌入金属框中的按压头、用粘结剂将按压橡胶粘贴在金属板上的按压头、使液状的橡胶流入金属框并使橡胶在金属框内硬化的按压头等。
说明将按压橡胶122嵌入由金属框构成的头本体121中的按压头,按压橡胶122的表面与头本体121的表面成为一个面,或比头本体121的表面向下方突出,若将按压头120压接在基座126上的压接对象物110上,则按压橡胶122的表面与压接对象物110接触。
压接对象物110具有基板111、和配置在基板111上的厚度不同的电气部件116、118,由于电气部件116、118的厚度的差别而在基板111上形成有阶差。
按压橡胶122由受到施力则变形的弹性材料构成,按压橡胶122首先与最厚的电气部件116接触,按压橡胶122变形而从厚的电气部件116直到薄的电气部件118依次接触,最后全部的电气部件116、118由按压橡胶122按压。
在用压接装置101按压电气部件116、118之前,进行电气部件116、118和基板111的定位,电气部件116、118的端子隔着粘结剂115而位于基板111的端子的正上方。
基座126的表面成为大致水平,在该表面上水平配置基板111,只要使按压头120向竖直下方移动而按压电气部件116、118时,则电气部件116、118推开粘结剂115而向正下方移动,因此电气部件116、118的端子和基板111的端子接触,电气部件116、118和基板111电气连接(图18(b)),这样,以往的压接装置101能够将厚度不同的电气部件同时连接在一张基板上。
此外,按压橡胶122具有若在按压电气部件116、118时凹陷、则因其反作用力其周围部分膨胀的性质,按压橡胶122的膨胀部分越过头本体121的框,按压橡胶122的表面在水平方向上扩张。
图19是示出按压橡胶122的表面在水平方向上扩张的状态的俯视图,按压橡胶122以其平面形状的中心C为中心向放射方向流动。与按压橡胶122的中心C附近相比,在端部移动量多,因此按压橡胶122的端部被按压的电气部件166、118与按压橡胶122的扩张一同在水平方向上移动,电气部件116、118的端子从基板111的端子的正上方位置偏离。
若产生电气部件116、118的位置偏离,则电气部件116、118的端子和基板111的端子变得不接触电气部件116、118和基板111的连接可靠性下降。
专利文献1:特开2002-359264号公报
专利文献2:特开2005-32952号公报
发明内容
本发明为了上述问题而提出,其目的在于提供一种能够可靠地连接电气部件和基板的压接装置。
为了解决上述问题,本发明是一种压接装置,具有基座和按压头,使上述按压头和上述基座相对地移动,用上述按压头按压配置在上述基座的载置面上的压接对象物,其中,上述按压头具有头本体和配置在上述头本体上的按压橡胶,在上述按压橡胶的周围配置有比上述按压橡胶的表面高度高的阻挡部件,上述按压橡胶一边变形一边按压配置在上述基座上的上述压接对象物。
本发明是一种压接装置,上述基座插入至由上述阻挡部件所包围的空间内。
本发明是一种压接装置,上述阻挡部件构成为与上述头本体能够分离。
本发明是一种压接装置,具有基座和按压头,使上述按压头和上述基座相对地移动,用上述按压头按压配置在上述基座的载置面上的压接对象物,其中,上述按压头具有头本体和配置在上述头本体上的按压橡胶,上述载置面由比上述载置面表面高度高的阻挡部件包围.
本发明是一种压接装置,上述按压头插入至由上述阻挡部件所包围的空间内。
本发明是一种压接装置,上述阻挡部件构成为能够与上述基座分离.
本发明是一种压接装置,在上述按压橡胶和上述头本体之间配置有能够压缩变形的压缩部件,至少在上述压缩部件被压缩时上述阻挡部件的高度比上述按压橡胶的表面高度高。
本发明是一种安装方法,是将在基板上配置有多个高度不同的部件的压接对象物配置在基座的载置面上、借助设置在按压头上的按压橡胶来按压上述部件、将上述部件固定在基板上的部件安装方法,其中,在上述按压橡胶按压上述部件时用阻挡部件包围上述压接对象物的周围,用上述阻挡部件阻挡上述按压橡胶的由变形导致的横流.
本发明是一种安装方法,在上述部件和上述基板之间配置各向异性导电性膜,使上述部件粘结在上述基板上,然后一边加热上述基板一边借助上述按压橡胶进行按压。
本发明是一种安装方法,在按压上述部件时,在上述按压橡胶和上述压接对象物之间配置有能够从上述各向异性导电性膜剥离的保护膜。
在按压橡胶压接压接对象物时,借助阻挡部件防止横方向的扩张,因此即使在按压橡胶的端部也不易产生电气部件的位置偏离。并且,若按压橡胶在横方向上不扩张,则按压橡胶变形的力的大部分成为按压压接对象物的力,因此没有按压时的按压压力的浪费.
附图说明
图1是说明第一例的压接装置的剖面图。
图2是说明按压头和基座的形状的俯视图。
图3(a)~(c)是说明将电气部件安装在基板上的工序的剖面图。
图4(a)~(c)是说明使用第二例的压接装置来安装电气部件的工序的剖面图。
图5是说明按压头的其他例的剖面图。
图6是说明第三例的压接装置的剖面图。
图7是说明按压头和基座的形状的俯视图。
图8(a)~(c)是说明将电气部件安装在基板上的工序的剖面图。
图9是说明按压头的其他例的剖面图。
图10(a)~(c)是说明使用第四例的压接装置将电气部件安装在基板上的工序的剖面图。
图11是说明阻挡部件的一例的俯视图。
图12是说明阻挡部件的其他例的俯视图。
图13(a)~(c)是说明使用第五例的压接装置将电气部件安装在基板上的工序的剖面图.
图14是说明保护膜的配置方法的其他例的剖面图.
图15是说明阻挡部件的其他例的侧视图.
图16是说明阻挡部件能够分离的按压头的其他例的剖面图。
图17是说明阻挡部件能够分离的按压头的其他例的剖面图.
图18(a)、(b)是说明现有技术的安装方法的剖面图。
图19是说明按压橡胶的扩张的俯视图。
附图标记说明
1、3、4 压接装置
5 保护膜
10 压接对象物
11 基板
15 各向异性导电性膜
16、18 电气部件
20、30、35、40、70 按压头
21 头本体
22 压接部(按压橡胶)
31 压缩部件
32 按压橡胶
24、49、74、78、89 阻挡部件
26、46、86 基座
具体实施方式
图1的附图标记1示出本发明的压接装置的第一例,该压接装置1具有操作台9、驱动装置25、按压头20、基座26。按压头20具有头本体21、阻挡部件24、和压接部22。
这里,头本体21是金属制的板状,在按压后述的压接对象物10时不变形。压接部22的内部由均一材质的弹性材料(例如橡胶)构成,压接部22与铁等金属材料不同,若受到施力则变形,并在除去力时恢复原来的形状。
压接部22固定在头本体21的表面上,按压头20将压接部22向着下方配置在操作台9的上方位置上。
按压头20构成为与驱动装置25连接,若驱动装置25动作,则按压头20在压接部22的露出面朝向下侧的状态下在操作台9上沿竖直方向上下移动。
在此,头本体21的平面形状是四边形,压接部22形成为四棱柱。头本体21的大小比压接部22大,在头本体21的比压接部22还向外侧突出的部分上以包围压接部22的方式配置有筒状的阻挡部件24。
在此,阻挡部件24与头本体21相同地为金属制,在此,阻挡部件24固定在头本体21上。阻挡部件24的顶端部分从压接部22的表面突出,形成有以阻挡部件24的内周侧面为侧面、以压接部22的表面为底面的凹部29。
阻挡部件24的内周侧面相对于水平面大致垂直,压接部22的表面大致水平。并且,阻挡部件24的顶端距压接部22表面的高度成为均一的。由此,由阻挡部件24的顶端构成的开口23位于水平面内且其形状与凹部29的底面的形状相同是四边形。在此,基座26是四棱柱,将其一个底面与操作台9表面密接,而竖直设置在操作台9上。
基座26的另一底面是载置有后述的压接对象物的载置面27,该载置面27与操作台9的表面平行,由此,载置面27成为大致水平的。载置面27的形状是与凹部29的开口23相同的形状、或比凹部29的开口23稍小的相似形状(图2),基座26的载置面27所位于的部分能够插入在凹部29内。
接着,说明使用该压接装置1将半导体元件这样的电气部件连接在基板上的工序。图3(a)的附图标记10示出压接对象物,压接对象物10具有基板11、各向异性导电性膜15、电气部件16、18。
各向异性导电性膜15配置在基板11的端子12上,电气部件16、18配置在各向异性导电性膜15的与基板11相反一侧的面上。电气部件16、18具有突块或突脊等端子17、19,将各电气部件16、18的端子17、19配置为位于基板11的端子12上。
用未图示的搭载头分别地将各电气部件16、18承载在各向异性导电性膜15上,然后一边预先加热为比较低的温度一边借助搭载头用较小的压力进行按压,各电气部件16、18借助各向异性导电性膜15所具有的粘结力暂时地与基板粘结(暂时压接)。但是,暂时压接时的粘结力弱,电气部件16、18容易从基板11脱落,并且,基板11的端子12和电气部件16、18的端子17、19在物理上和机械上都不接触,其间有各向异性导电性膜15。
基板11的未配置有电气部件16、18的面成为平坦的,压接对象物10的平坦面与载置面27密接而将压接对象物10载置在基座26上。
各向异性导电性膜15形成为比电气部件16、18大,一部分从电气部件16、18突出,在电气部件16、18之间露出.并且,即使在各向异性导电性膜15不从电气部件16、18露出的情况下,在后述的按压时,各向异性导电性膜15被按压从而一部分从电气部件16、18的外周突出。
压接部22由表面可与各向异性导电性膜15粘结的材料构成,因此,在后述的按压时,在压接对象物10的表面配置相对于各向异性导电性膜15的粘结性低的保护膜5,以使在后述按压时压接部22和各向异性导电性膜15不接触(图3(a))。
在此,载置面27形成为比开口23小,保护膜5比载置面27大,在保护膜5的端部在基座26的侧面垂下的状态下,包含保护膜5的基座26的外周与开口23的大小大致相等。
由此,对按压头20和基座26的方向进行定位以使包含保护膜5的基座26的外周和开口23一致,若通过驱动装置25使按压头20下降,则基座26和保护膜5一起插入凹部29。
保护膜5由可压缩变形的材料构成,构成为即使包含保护膜5的基座26的外形比开口23稍大,也能够将基座26插入。
电气部件16、18是例如半导体元件或电阻元件,其厚度因每种部件的种类而不同,由于电气部件16、18的厚度的差别而在基板11的表面上形成有阶差。
图3(b)示出在基座26的载置面27与压接对象物10一起插入凹部29、压接部22按压压接对象物10的各电气部件16、18之前,压接部22隔着保护膜5与基板11上的最后的电气部件16接触的状态,在该状态中,载置面27位于比开口23还靠上方的位置,基座26的侧面的载置面27的顶端部分插入凹部29内,被阻挡部件24的内周侧面包围。
若从该状态进一步使按压头20下降而令压接部22相对地接近基板11,则压接部22的与电气部件16接触的部分被按压而凹陷。
在此,压接部22的侧面不固定在阻挡部件24上,压接部22的中央部分和周围都凹陷,通过使按压头20进一步下降而进行按压,从厚度厚的电气部件16向厚度薄的电气部件18依次与压接部22的表面接触而被按压。
若压接部22与电气部件16、18接触而凹陷,则其他部分因其反作用而膨胀,但压接部22的底面固定在头本体21上,侧面由阻挡部件24包围,因此在水平方向上不膨胀,压接部22的表面中不与电气部件16、18面对的部分比按压前向下方膨胀。由此,压接部22表面在电气部件16、18之间的部分和压接对象物10的周围的部分向下方膨胀(图3(c))。
如上所述,各向异性导电性膜15在电气部件16、18之间露出,并且若按压电气部件16、18则各向异性导电性膜15的一部分从电气部件16、18的外周突出,但电气部件16、18之间和电气部件16、18由保护膜5覆盖,因此压接部22不与各向异性导电性膜15直接接触。
并且,基座26和阻挡部件24之间的间隙小,即使压接部22的表面在压接对象物10的周围向下方膨胀,也不会从其间隙流出,因此向压接部22的下方膨胀的部分即使填充在电气部件16、18之间的凹陷中,也与以往不同压接部22不向放射方向外侧流动。由此,不对各电气部件16、18施加向外侧的力,不会产生电气部件16、18的位置偏离.
在基座26中内置有加热器8,通过在加热器8上通电,压接对象物10被加热为既定温度,通过加热,各向异性导电性膜15的流动性变高。
由此,若按压电气部件16、18,则各向异性导电性膜15被电气部件16、18推开,电气部件16、18的端子17、19隔着各向异性导电性膜15中的导电性粒子而压接在基板11的端子12上,电气部件16、18和基板11电气地连接。
在各向异性导电性膜15含有热硬化性树脂的情况下,通过加热而使各向异性导电性膜15硬化,并且,在各向异性导电性膜15含有热塑性树脂的情况下,在加热结束后,若温度下降则各向异性导电性膜15固化。由此,电气部件16、18经由硬化或固化的各向异性导电性膜15而与基板11机械地连接,得到电气部件16、18与基板11机械地且电气地连接的电气装置10a。
按压电气部件16、18时,不会产生电气部件16、18的位置偏离,因此该电气装置10a的连接可靠性高。
如上所述,按压电气部件16、18时压接部22不与各向异性导电性膜15接触,因此压接部22不与各向异性导电性膜15粘贴,在使按压头20上升时压接部22的表面从电气装置10a分离,电气装置10a留在基座26上。
若压接部22从电气装置10a分离,则施加在压接部22上的力除去,压接部22恢复按压电气部件16、18前的形状.
取出留在基座26上的电气装置10a,将新的压接对象物10承载在基座26上,能够以上述的图3(a)~(c)的工序继续进行电气部件16、18的连接。
此外,阻挡部件24的顶端的高度并不特别限定,但压接部22按压压接对象物10时膨胀的量不会比该压接对象物10的最大膜厚大,因此只要使从按压前的压接部22表面至阻挡部件24顶端的高度与最厚电气部件16(例如半导体元件)的膜厚和基板11的膜厚的合计量相同或比其大,则压接部22不会超过阻挡部件24。
上面说明了在按压头20上预先形成凹部29、在该凹部29内收纳压接对象物10之后,使压接部22与压接对象物10接触的情况,但本发明并不限定于此.
图4(a)的附图标记3示出了本发明的第二例的压接装置,该压接装置3除了将按压头30的压接部34如下所述地改变之外,具有与第一例的压接装置1相同的结构,按压头30和基座26的配置也与第一例的压接装置1相同。
第一例的压接装置1的压接部22由橡胶构成,与其相对,该压接装置3的压接部34具有与第一例的压接装置1的压接部22相同地由橡胶构成的按压橡胶32、可动板33、压缩部件31,压缩部件31由例如像海绵状的橡胶那样内部具有空洞、施力时空隙被压溃从而体积减少的材料构成。
压缩部件31的上端固定在头本体21的表面,可动板33的表面安装在压缩部件31的下端,按压橡胶32的上端安装在可动板33的背面。由此,压缩部件31、可动板33、按压橡胶32从头本体21向基座26所位于的竖直下方按所述的顺序排列。
在此,压缩部件31在水平方向上切断时的截面形状成为与由阻挡部件24包围的区域的截面形状相同的柱状.由此,压缩部件31的侧面与阻挡部件24的内周侧面接触,但其侧面不固定在阻挡部件24上。按压橡胶32和可动板33也不固定在阻挡部件24上,而构成为能够在由阻挡部件24包围的区域内移动。
图4(b)示出了使按压橡胶32与压接对象物10上的保护膜5接触后,进一步使按压头30下降的状态。
使压缩部件31变形所需要的力比使按压橡胶32变形所需要的力小,若使按压头30下降,则压缩部件31借助按压橡胶32而被压接在头本体21上,在按压橡胶32变形前压缩部件31压缩,其厚度变小,压缩部件31按压在按压橡胶32上,在按压头30上出现被压缩前没有的凹部。
压缩部件31的变形量具有限度,因此若压缩部件31发生某种程度变形,则压缩停止,若进一步继续进行按压头30的下降,则按压橡胶32变形(图4(c)).
按压橡胶32变形时形成有上述的凹部,阻挡部件24的顶端比按压橡胶32的表面还向下方突出,其顶端和基座26之间的间隙小。由此,与第一例的压接装置1的情况相同,按压橡胶32不从其间隙流出,不会产生电气部件16、18的位置偏离。
压缩部件31只要是通过按压体积会减少即可,并不特别限定。图5的附图标记35的按压头除了压缩部件不同之外,与图4(a)~(c)的按压头3具有相同的结构,在相同部件上标注相同的附图标记进行说明。
也可以是该按压头35的压缩部件由弹簧36构成,通过按压使弹簧36压缩,从而推起压接部34的表面,令阻挡部件24的顶端比压接部34向下方突出。
并且,只要是在按压橡胶32上施加的力能够传递至压缩部件31即可,不需要特别地设置支承板33。
上面说明了在按压头20上设置阻挡部件的情况,但本发明并不限定于此。
图6的附图标记4示出本发明的第三例的压接装置,该压接装置4没有在按压头40上设置阻挡部件,而如下所示地在基座46的载置面的周围设置了阻挡部件49,除此之外,具有与上述第一例的压接装置1相同的结构.
在此,压接部42与第一例的压接装置1相同地由按压橡胶形成,取代安装在头本体41的表面而由阻挡部件包围压接部42的结构,在此被由薄板形成的滑动板44包围。
基座46与第一例的压接装置1相同是柱状,在基座46上、在载置面47的周围以包围载置面47的方式固定有阻挡部件49.
阻挡部件49的顶端从载置面47向上方突出,形成以阻挡部件49的内周侧面为侧面、以载置面为底面的凹部45。
图7是用于比较基座46的平面形状和按压头40的平面形状的示意的俯视图,压接部42的包含滑动板44的外周的大小与凹部45的开口48相同或比其小。
压接部42的侧面向着竖直下方,滑动板44的膜厚是均一的,因此滑动板44的侧面也向着竖直下方。阻挡部件49的内周侧面向着竖直下方,由此,按压头40的下端能够插入凹部45。
接着,说明使用该压接装置4连接上述的压接对象物10的情况。与第一例的压接装置1的情况相同将压接对象物10配置在载置面47上,将保护膜5配置在阻挡部件49的开口48上,将保护膜5压入阻挡部件49的内部时,压接对象物10由保护膜5覆盖(图8(a))。
在此,凹部45的开口48的大小比按压头40的平面形状的外周大,保护膜5成为其端部覆盖凹部45的侧面和其周围的大小,由于覆盖保护膜5而相应地变窄的凹部45的开口48的大小与按压头40的平面形状的外周的大小大致相等。
由此,以该开口48和按压头40的外周一致的方式定位按压头40和基座46的方向,若用驱动装置25使按压头40下降,则按压头40的下端插入开口48内,成为由阻挡部件49包围的状态。
图8(b)示出按压头40的下端插入开口48内、压接部42的表面经由保护膜5与最厚的电气部件16接触的状态,在该状态下,压接部42不被按压,不变形。
在该状态中,在滑动板44具有柔软性的情况下,压接部42的侧面从表面到底面由阻挡部件49包围,在滑动板44不具有柔软性的情况下至少压接部42的表面的周围由阻挡部件49包围。
由此,任何情况下压接部42的侧面都由硬的部件包围,若使按压头40下降而不使压接部42压接在压接对象物10上,则压接部42在水平方向上不膨胀,其表面向下方膨胀(图8(c))。
滑动板44薄,按压头40和阻挡部件49之间的间隙变窄,因此从压接部42的表面的边缘到阻挡部件49的距离变短。即使压接部42膨胀而向外侧扩张,也由阻挡部件49阻挡,因此其扩张量小,由此不易产生电气部件16、18的位置偏离。
此外,在使按压头40的平面形状的大小与阻挡部件49的开口48的大小的差别大的情况下,使保护膜5的膜厚尽可能厚,由保护膜5填充阻挡部件49和按压头40的侧面之间的间隙即可.
上面说明了用滑动板44包围压接部42的周围的情况,但本发明并不限定于此,也可如图9所示,不在压接部42的周围设置滑动板44,而使其侧面露出.
上面说明了将阻挡部件固定在头本体21或基座46上的情况,但本发明并不限定于此,也可以由与基座或头本体分离的分离部件构成阻挡部件,在按压压接对象物10时,使阻挡部件与基座或头本体密接.
图10(a)的附图标记7示出本发明的第四例的压接装置,该压接装置7除了按压头70的阻挡部件74与头本体71以分离部件构成之外,具有与第一例的压接装置1相同的结构,按压头70和基座26的配置也相同。图10(a)示出了阻挡部件74从头本体71分离的状态。
阻挡部件74如图11所示具有多张板状的单位部件75,各单位部件75借助未图示的移动装置在表面向着竖直方向的状态下沿着压接部72的侧面排列并与头本体71密接,在各单位部件75与头本体71密接的状态下,压接部72的侧面由单位部件75包围。
图10(b)是压接部72在最厚的电气部件16处与保护膜5接触的状态,示出压接部72不被按压、不变形的状态,最迟在该状态时使单位部件75密接,按压压接部72使之变形时,由单位部件75包围压接部72的侧面。
压接部72由按压橡胶构成时,若比按压前的压接部72表面下端突出的方式安装各单位部件75,则即使进一步使按压头70下降而按压压接部72,也与第一例的压接装置1的情况相同,压接部72不会超过阻挡部件74,不会产生电气部件16、18的位置偏离(图10(c))。
此外,压接部72也可以使用具有按压橡胶和压缩部件的部件。
图16、17的附图标记90和95示出了阻挡部件74可从本体71分离、且压接部72具有压缩部件31、36、按压橡胶21的按压头.在此,图16的按压头90具有与图4(a)~(c)的按压头17的压接部34相同的结构,图17的按压头95具有与图5的按压头35的压接部34相同的结构。并且,头本体71和阻挡部件75的结构与图10的按压头70相同,在相同部件上分别标注了相同的附图标记而进行说明.
该按压头90、95的情况下,若借助压缩部件31的压缩而在后形成以按压橡胶32的表面为底面的凹部,则将阻挡部件74安装在头本体71上时,可以将阻挡部件74的顶端形成为与按压前的压接部34表面成为一个面,也可以使按压前的压接部34表面比阻挡部件74的顶端向下方突出,也可以使阻挡部件74的顶端比按压前的压接部34表面向下方突出。
上面说明了由多个单位部件75构成阻挡部件74的情况,但本发明并不限定于此,可以如图12所示将阻挡部件78最初筒状地成形。在这种情况下,在按压压接对象物10而压接部72变形前,使按压头70插入阻挡部件78的筒的内侧,由阻挡部件78的内周侧面覆盖压接部72。这种情况下,也由阻挡部件78阻挡压接部72的水平方向的扩张,因此防止电气部件16、18的位置偏离。
接着说明阻挡部件可从基座分离的情况。
图13(a)的附图标记8示出本发明的第五例的压接装置,该压接装置8除了阻挡部件89为能够从基座86分离的分离部件之外,具有与上述第三例的压接装置4相同的结构,基座86和按压头40的配置也相同。图13(a)示出了阻挡部件89从基座86分离的状态。
阻挡部件89可以如图11所示由多个单位部件构成,也可以如图12所示由一个筒构成.在阻挡部件89由多个单位部件构成时,使各单位部件沿着载置面87的边缘而排列而包围载置面87的状态密接,在阻挡部件89是筒状的情况下,将基座86插入该筒的下端,使阻挡部件89与基座86密接。
在使阻挡部件89与基座86密接的状态中,阻挡部件89的顶端比载置面87向上方突出,形成以阻挡部件89的内周侧面为侧面、以载置面87为底面的凹部85.
该凹部85的开口和按压头40的大小关系与图6、7所示的压接装置4相同,由此,可以使按压头40的下端插入凹部85内。
图13(b)示出了压接部42经由保护膜5与载置面87上的压接对象物10的最厚电气部件16接触的状态,压接部42不被按压、不变形。最迟在该状态时,使阻挡部件89与基座86贴紧,由阻挡部件89包围载置面87的周围。
在该压接装置8中,用阻挡部件89阻挡压接部42的膨胀的表面(图13(c)),因此压接部42的水平方向的扩张小,防止电气部件16、18的位置偏离。
此外,保护膜5的平面形状是从载置面87突出程度的较宽的情况下,若将阻挡部件89安装在基座86之后覆盖上保护膜5,则保护膜5不卷入阻挡部件89和基座86之间。
并且,如图14所示,也可不将保护膜5置于载置面87上,而在将其卷绕在按压头40上、覆盖压接部42的表面的状态下将按压头40压接在压接对象物10上。
上面说明了按压压接对象物10时由按压头20的阻挡部件24、或阻挡部件49包围压接部22的情况,但本发明并不限定于此,只要能够防止按压压接对象物10时的压接部22的水平方向的扩张,也可以如图15所示在阻挡部件24上设置1个以上切入部99,使压接部22的侧面的一部分露出。
保护膜5的形状及大小也不特别限定,只要能够避免各向异性导电性膜15和压接部22、34、42、72的接触,也可以使用不从载置面27、47、87膨胀出的大小的保护膜5,也可以使用仅覆盖压接对象物10的一部分表面的保护膜5。
在所使用的各向异性导电性膜15和压接部22、34、42、72的粘结性低的情况下,也可以不使用保护膜5而使压接部22、34、42、72直接与压接对象物10接触。作为使压接部22、34、42、72和各向异性导电性膜15的粘结性低的方法,具有将按压橡胶的构成材料变为与各向异性导电性膜15粘结性低的材料,或在按压橡胶的表面设置对于各向异性导电性膜15具有分型性的分型层的方法。
这样,本发明申请的压接装置即使不使用保护膜5也能进行电气部件和基板的连接,但在阻挡部件和按压头之间、或阻挡部件和基座之间的间隙大的情况下,通过用保护膜5覆盖阻挡部件的侧面,能够使该间隙变窄。
由此,不使用模具而以便宜的成本制造基座或阻挡部件或按压头,即使在其成形精度差的情况下,通过适当选择保护膜5的膜厚,也能填充阻挡部件和按压头之间或阻挡部件和基座之间的间隙。
本发明中使用的基板11的种类也不特别限定,可以使用刚性基板、挠性基板等各种基板。
并且,与基板11连接的电气部件的种类也不特别限定,除了电气部件以外,在基板11上连接其他基板时也可以使用本发明申请的压接装置及连接方法。
可以在各向异性导电性膜15中仅含有热塑性树脂和热硬化性树脂中的任意一方,也可以含有双方.
热硬化性树脂和热可塑性树脂的种类并不特别限定,但作为热硬化性树脂,可以使用环氧树脂、丙烯酸类树脂、尿烷树脂等的一种以上,作为热可塑性树脂,可以使用苯氧基树脂、聚乙烯醇树脂等的一种以上.
导电性粒子的种类也并不特别限定,除了金属粒子,也可以使用在树脂粒子的表面设置金属层的粒子。
并且,也可取代各向异性导电性膜15而将膏状的各向异性导电性粘结剂涂覆在基板11表面,然后使电气部件与该各向异性导电性粘结剂粘结而作为压接对象物10。
保护膜的种类并不特别限定,最好是对于上述的各向异性导电性膜15具有剥离性的保护膜,例如可以使用将聚四氟乙烯成形为膜状的保护膜、将硅橡胶成形为膜状的保护膜。
构成按压橡胶的弹性材料并不特别限定,若叙述一例,则可以使用橡胶硬度(根据JIS S 6050)为40、80的弹性体。
以JIS S 6050:2002的“6、试验方法”中所述的方法测定橡胶硬度。其内容如下述所示。
试验所使用的试样使用在制造后经过24小时以上的试样。并且,化学分析中通用的一般事项参照JIS K 0050。硬度的试验使用硬度试验机,试验机的按针成为竖直而使加压面与保持为水平的试验片的表面接触,立即以正数读出刻度。此外,试验片的测定位置是将表面的整体三等分而分别测定各自的中央部分,将其中间值作为试验片的硬度。
此外,所谓硬度试验机,是按针形状为直径5.08mm正负0.02mm的半球状的弹簧硬度试验机。按针的高度在刻度为0时是2.54正负0.22mm、为100时是0mm。刻度和弹簧的力的关系见下述表1。
[表1] 表1:刻度和弹簧的力的关系
刻度 | 0 | 10 | 20 | 25 | 30 | 40 | 50 | 60 | 70 | 75 | 80 | 90 | 100 |
弹簧的力N | 0.54 | 1.32 | 2.11 | 2.50 | 2.89 | 3.68 | 4.46 | 5.25 | 6.03 | 6.42 | 6.82 | 7.60 | 8.39 |
关于橡胶硬度分别为40、60、80的弹性体,在测定温度30℃~240℃的范围内每隔30℃测定橡胶硬度,橡胶硬度的变化为±2。该值可称为测定误差范围,因此得知橡胶硬度是不受温度变化影响的值。
作为用于按压橡胶的弹性体,可以使用天然橡胶、合成橡胶的任一种,但从耐热性、耐压性的观点看,最好使用硅橡胶.
上面说明了用驱动装置25使按压头20在上下方向上移动的情况,但本发明并不限定于此,只要按压头20和操作台9相对地移动,可以固定按压头20,使操作台9在竖直方向上上下移动,也可以使按压头20和操作台9双方在竖直方向上上下移动。
实施例
改变第一例的压接装置1的从按压前的压接部22表面到阻挡部件24的顶端的高度(顶端高度),进行半导体元件16和基板11的连接,测定半导体元件16的水平方向的偏离量。
在此,在凹部29中收纳按压头20时的从按压头20侧面到阻挡部件24的内壁面的距离(间隙)为50μm,使用膜厚50μm的保护膜5,实质上,在按压头20和阻挡部件24之间没有间隙的状态下进行按压。并且,半导体元件16的厚度为0.4mm,基板11的厚度为0.6mm.
将所测定的半导体元件16的偏离量的最大值和阻挡部件24的顶端高度一起记载于下表2中。
[表2] 表2:阻挡部件的顶端高度和最大偏离量
顶端高度(mm) | 最大偏离量(mm) |
-3.0 | 0.050 |
-1.0 | 0.050 |
0 | 0.050 |
1.0 | 0.020 |
2.0 | 0.015 |
3.0 | 0.015 |
此外,上述表2中的“顶端高度”中,使阻挡部件24的顶端与压接部22表面成为同一平面的情况为“0mm”,阻挡部件24的顶端比压接部22表面向下方突出的情况为“+”,压接部22表面比阻挡部件24的顶端向下方突出的情况为“-”。
如上述表2中所明确的那样,在阻挡部件24的顶端从按压前的压接部22的表面突出的情况下最大偏离量变小,相对于此,压接部22的表面与阻挡部件24的顶端成为一个面、或比阻挡部件24的顶端突出的情况下半导体元件16的最大偏离量变大.
综上可以确认,通过以顶端从压接部22的表面突出的方式设置阻挡部件24,能够防止电气部件的位置偏离,能够制造可靠性高的电气装置。
Claims (10)
1.一种压接装置,具有基座和按压头,使上述按压头和上述基座相对地移动,用上述按压头按压配置在上述基座的载置面上的压接对象物,其特征在于,
上述按压头具有头本体和配置在上述头本体上的按压橡胶,
在上述按压橡胶的周围配置有比上述按压橡胶的表面高度高的阻挡部件,
上述按压橡胶一边变形一边按压配置在上述基座上的上述压接对象物。
2.如权利要求1所述的压接装置,其特征在于,上述基座插入至由上述阻挡部件所包围的空间内。
3.如权利要求1所述的压接装置,其特征在于,上述阻挡部件构成为能够与上述头本体分离.
4.如权利要求1所述的压接装置,其特征在于,在上述按压橡胶和上述头本体之间配置有能够压缩变形的压缩部件,至少在上述压缩部件被压缩时上述阻挡部件的高度比上述按压橡胶的表面高度高.
5.一种压接装置,构成为具有基座和按压头,使上述按压头和上述基座相对地移动,用上述按压头按压配置在上述基座的载置面上的压接对象物,其特征在于,
上述按压头具有头本体和配置在上述头本体上的按压橡胶,
上述载置面由表面高度比上述载置面高的阻挡部件所包围。
6.如权利要求5所述的压接装置,其特征在于,上述按压头插入至由上述阻挡部件所包围的空间内.
7.如权利要求5所述的压接装置,其特征在于,上述阻挡部件构成为能够与上述基座分离。
8.一种安装方法,是将在基板上配置有多个高度不同的部件的压接对象物配置在基座的载置面上、借助设置在按压头上的按压橡胶按压上述部件、将上述部件固定在基板上的部件安装方法,其特征在于,
在上述按压橡胶按压上述部件时用阻挡部件包围上述压接对象物的周围,用上述阻挡部件阻挡上述按压橡胶的由变形导致的横流。
9.如权利要求8所述的安装方法,其特征在于,在上述部件和上述基板之间配置各向异性导电性膜,使上述部件粘结在上述基板上,然后一边加热上述基板一边借助上述按压橡胶进行按压。
10.如权利要求8所述的安装方法,其特征在于,在按压上述部件时,在上述按压橡胶和上述压接对象物之间配置有能够从上述各向异性导电性膜剥离的保护膜。
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CN101371346B (zh) | 2011-04-27 |
TWI401756B (zh) | 2013-07-11 |
KR101057913B1 (ko) | 2011-08-19 |
TW200805538A (en) | 2008-01-16 |
US20090314437A1 (en) | 2009-12-24 |
EP1975994A1 (en) | 2008-10-01 |
US8011407B2 (en) | 2011-09-06 |
US20090032570A1 (en) | 2009-02-05 |
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US7736459B2 (en) | 2010-06-15 |
HK1126034A1 (en) | 2009-08-21 |
JP4925669B2 (ja) | 2012-05-09 |
WO2007080956A1 (ja) | 2007-07-19 |
KR20080093026A (ko) | 2008-10-17 |
JP2007189100A (ja) | 2007-07-26 |
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